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SEMICON/Japan Industry Briefing

SEMICON/Japan Industry Briefing. December 5, 2012. Executive Summary. The Program has achieved critical momentum Tools selected for program demonstrations Broad coverage of tool set and Supplier base Tool optimization added to program scope

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SEMICON/Japan Industry Briefing

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  1. SEMICON/JapanIndustry Briefing December 5, 2012

  2. Executive Summary • The Program has achieved critical momentum • Tools selected for program demonstrations • Broad coverage of tool set and Supplier base • Tool optimization added to program scope • Coordinating across Industry on precompetitive opportunities

  3. Global 450mm Consortium • A public/private program based at the College of Nanoscale Science and Engineering in Albany, NY • Driving effective industry 450mm development • Coordinate test wafer capability supporting development • Demonstrate unit process tool performance • Improve tools with Suppliers to ready for customer operations • G450C Members • CNSE / Research Foundation • GLOBALFOUNDRIES • Intel • IBM • Samsung • TSMC

  4. G450C Program Organization GM/VP and Coordinator Paul Farrar, CNSE VP/ GM, Internal / Operations John Lin, TSMC VP/GM, Industry / Strategy Frank Robertson, Intel Director, Program Coordination (Intel) Lithography Engineering Director (GLOBALFOUNDRIES) Etch Engineering Director (Samsung) CMP/Thermal/Cleans Engineering Director (TSMC) CVD/PVD/Implant Engineering Director (IBM) Co-directors, Fab Operations (CNSE/TSMC) Director, Integration (Samsung) • Industry consortium coordinated by not-for-profit entity • Leveraging New York State funding, matched by all industry participants • Broadly-shared management of Program execution • >60 staff on board now; >150 by 2014, with ~60 Supplier engineers on site

  5. Development and Technology Intercept Targets G450C Program Early 450mm Development Early Development of Silicon and factory integration / automation standards, interoperability test beds for component and standards verification; early tool development Test Wafers to support development and demo Tools for Consortium Demonstrations (unit process) ISMI 32/22nm Equipment Performance Metrics 14nm G450C Demonstrations 10nm and beyond 450mm and 300mm tools progress synchronously through technology generations Ready for IC Makers Nominal “nm” = ITRS M1 Half Pitch Full set of process and metrology, automation ------ 2010 2011 2012 2013 2014 2015 2016

  6. Test Wafer Support for Tool Development 2011 2012 2013 2014 Tool Demo / Improvement Supplier Tool Development Alpha Beta Pre-production Increasing scope and complexity of process / metro capability Wafer pool coordination for multiple use, re-use, reclaim Bare Wafers Metrology G450C TW Cleans, Blanket Films, Etch, etc. Imprint /Spacer doubling, 300mm Coupons 193i on 450mm Manufacturing Execution Systems, Engineering Data Collection and analysis tools, Virtual Fab logistics for globally-distributed tool set

  7. Demonstrations Drive Tool Improvement 2012 2013 2014 2015 2016 Tool Ready for Customers Development Demo Tool Tool Improvements as Indicated by Pareto Supplier Testing Increasing tool maturity and data-based confidence EMA Report Baseline Report Demo Report Tech Transfer G450C Demo EMA Test Plan MDC Gauge Study PDC DOE Marathon Standardized methods and consistency across all tools

  8. 450mm Equipment Development

  9. Tool Selection Overview • Closing deals with selected Suppliers • Immediate objective: • Select at least one Supplier for Priority 1 and 2 tools for negotiation of Demo / full flow @ CNSE • Criteria: • Technical and commercial scores from RFQ • Balance across competitive Supplier base • Benefit to all Members and NY State • Process: • Research Foundation RFQ • Member selection teams used pre-agreed criteria • Management Council approved recommendation

  10. 450mm Cleanroom in CNSE (NFX) G450C • Cleanroom ready by January 2013; First tools installed March 2013 • 450mm OHV is ready, could carry 300mm FOUP in 450mm inter-bay • 4 stockers with 1000 bins ready in Feb 2013 11

  11. G450C Test Wafers/ Operations

  12. Wafer Availability Establish roadmaps for cost / quality learning • Initial order for 6000 sc-Si (SEMI M76) • Growing capability to meet 2013 need • Initial order for 2000 cast wafers (SEMI M74) • Provision for wafer handling needs • Bring up additional supply in 2013 • > 15,000 wafers and progress to prime quality (SEMI M1) needed next year • Exploring engagement with multiple Suppliers

  13. Wafer Industry Support Model Adjust for wafer costs, reuse/regen, scrap rates, etc. • Suppliers providing tools for the program get access to test wafers at significant discount to individual purchase • Program expansion: • Suppliers without tools in the program can also get discounted cost if they return wafers and provide data • Suppliers may take advantage of program volume aggregation to procure wafers at consortium cost • Wafer pool managed for budget, allocation to needs • Pass on our costs beyond program capabilities for TWs

  14. Wafer Cost Sharing To support 450mm development and maintain Consortium budget, wafer cost will be shared with industry G450C will be loaning wafers for a given duration, at a shared cost (wafers available for purchase at 100% of G450C cost) G450C cost share represents a considerable discount from independent small volume purchases Factors for cost share will include usage/needs, reuse/regen, wafer loan duration, scrap, etc. Test wafer process/metrology capability ‘Menu Card’ being developed for industry needs For wafer request/loan discussion, more information available at:http://www.g450c.org/wafer-loan.aspx

  15. Wafer Quality Continues to Improve Defects / Wafer 2010: > 3000 defects/wafer 2012: ~50 defects/wafer 2011: ~ 175 defects/wafer August 2012: ~5 defects/wafer Defects per wafer reduced significantly (@ 90nm sensitivity) Most recent ~ 66 @ 38nm sensitivity Year-to-year comparison using >90nm defect size recipe Migrating to 40nm and below 16

  16. Wafer Quality Roadmap & Reclaim Capability • Wafer quality roadmap M74 Spec Mechanical Wafer Q2, 2013 M76 Spec Test / Mon Wafer • SFQR meet (~90% area) • Particle (~70% pass rate) Q2, 2014 M1 Spec Prime Wafer Q1, 2015 Epi Wafer M62 Spec Wafers meet SEMI spec • FEOL wafer reclaim capability G450C On-site ★ Supplier side

  17. Test Wafer Routes (Menu Card) Front End Metals

  18. Metrology Readiness • Metrology capability expanding to support virtual test wafer operations

  19. G450C Operations - CNSE Cleanroom 11 tools installed in NY cleanroom, 3 in progress Existing space allows for 3-4 additional metrology tools incoming 2H’12 / 1H’13

  20. On Site Equipment Progress - Films PECVD Uniformity example Q2, 2012 Q3, 2012 SiN • Thickness uniformity • SiN: 5.06 %  1.46 % • Ox: 14.5 %  1.62 % • Throughput • Compatible to 300 mm 5.06 % 1.46 % Ox 14.5 % 1.62 % 21

  21. Wet Clean and Wafer Recycling • Wet Cleaning: • Optimizing early tool Recent optimization Bar brush • Recycled oxide wafer: Front side Back side 22

  22. On Site Equipment Progress: Defects Particle Inspection A: on site Particle Inspection B: off site • To be moved in soon • Bare Si wafer particle sensitivity demo < 30nm • Target sensitivity at ~ 25nm • Passed qualification (in July) • Current particle sensitivity 38nm • Continue improving to 30nm 23

  23. Summary and Opportunities – Test Wafer Operations Summary • Silicon supply capability improving across the industry • G450C operations have resulted in cleaner wafers • Proven logistics in place, continuous improvement underway • Processed wafer loans increasing • Multiple Wafer Carrier suppliers in place and progressing well • G450C expanding equipment base in existing clean room Your Opportunities • Leverage G450C Wafer Bank to accelerate your equipment development • Engage G450C for wafer loan requests via website http://www.g450c.org/wafer-loan.aspx

  24. Lithography Update

  25. G450C Lithography Tool Roadmap 300mm Imprint 193i patterning access at Supplier site 193i Coupon, EUV Coupon Positive 450mm Imprint + Spacer Coupon + Imprint Potential G450C tool @ CNSE

  26. Lithography Strategy Working on an Industry solution to accelerate 450mm scanner development • Imprint solution before optical lithography available • Imprint + Spacer extends resolution to 14-15 nm (2013 - 2014) • Pull in early 193i tool to 2H14 • Expect 193i Litho full demo capability 2015 - 2016

  27. Imprint as Interim Patterning Measure Imprint Coupons – 193i / EUV 30nm 1:2 40nm 1:2 • 450 mm tool is completed, operational by end of 2012 • Explore spacer process to extend ~20nm to 10 nm • Litho, Etch, Films engineering team developing templates and processes to prepare patterned test wafers • Work with Suppliers to build up complete process 29

  28. 300mm Nano Imprint Performance • Good CDU, Line edge • Successfully etched SiN & APF • Poly Spacer etch on-going • Coating at Supplier site • Solving particle issues • Working on re-work issue Good CDU, LER; Profile OK, Rdl ~15nm • SiN & APF (amorphous carbon) etching

  29. 450mm Nano Imprint Status • 450mm tool is ready in Nov, (Austin) –tuning process • Template design: 22nm ok, verify 14nm capability • Poly spacer for pitch doubling – on going • Negotiate 1st phase patterning wafer capacity in Austin

  30. 450mmDemonstration Test Methods (DTM)

  31. Equipment Performance Metrics (EPM) • “1X nm Range” technology targeted for 2013-14 G450C demonstrations – “ITRS 14 nm Nominal” • Snapshot in continuum of technology progression • Performance of 450 mm and 300 mm tools advances in lock-step • Update Process (by end of 2012): • Suppliers propose competitive performance at ‘14 nm” without revealing sources of guidance or disclosing customer IP • Consortium staff take best Supplier proposals for each tool type to propose EPMs • Consult with Suppliers for aligned output • Validate EPMs meet Member Companies needs • Implementation • Ensure Demo test plans allow for full range of tool performance • Report the data for each tool with comparison to Demo EPM

  32. Updated Equipment Performance Metrics Millisecond Anneal Example 14nm targets for demo Agreed with all Suppliers Publish update by EOY

  33. Demonstration Test Methods (DTM) Overview

  34. Demonstration Test Methods (DTM) Duration 2-6 months DTM Components • Equipment Maturity Assessment (EMA) includes a couple of dozen parameters with clear categorization of the tool characteristics based on defined criteria, as well as compliance with applicable standards; output is a report recommending pre-test actions and testing levels • Test planning is based on the tool maturity, goals for reliability, throughput of the tool and confidence objectives, combining any Supplier pre-data with demo testing via Bayesian statistics • Gauge Studies run for all metrology needed for the demo to ensure adequate Precision/Tolerance ratios • Mechanical Dry Cycle (MDC) - nominally 5000 cycles of the wafer movement functions without process for reliability and mechanical handling defect data • Passive Data Collection (PDC) - a test of process stability on a baseline recipe for each application. • Initial data is analyzed and a Baseline Characterization Report issued; decisions are made about subsequent testing or reversion to tool development to address any hurdles • Sensitivity Analysis - DOE optimization of the recipe(s) and RSM characterization of the process window(s) • Marathon - 24/7 manufacturing simulation to capture tool productivity and reliability performance using E10 states over a significant period, running process with sample testing to capture rates/variability, defectivity and tool-specific performances like step coverage, gap fill, LER, etc.. • A final report is drafted, the Supplier has opportunity for comment, recommendations for tool improvement are made and demo is completed with web publication

  35. Demonstration Test Methods (DTM) • Standardized Reports • Executive Summary • Demo Test Background • History and previous testing • EMA Report • Test Plan • Test Results • Process Capability Performance • Gauge study • PDC • Sensitivity Analysis (SA) • Marathon Test • Equipment Performance • MDC • Marathon Test • Others • CoO, Standards compliance, software & user interface, factory integration • Conclusions • Supplier Input

  36. Compliance with SEMI Standards Required(www.semi.org) • SEMI E5: SECS II • SEMI E30, E30.1, E30.5: GEM ("Fully GEM Compliant" as well as GEM Compliant per section 8) • SEMI E37: HSMS • SEMI E37.1: HSMS-SS • SEMI E39, E39.1: Object Services Standard: Concepts, Behavior and Services • SEMI E40, E40.1: Standard for Processing Management (PJM) • SEMI E87, E87.1: Specification for Carrier Management (CMS) • SEMI E84, E84.1: Specification for Enhanced Carrier Handoff Parallel I/O Interface • SEMI E90, E90.1: Specification for Substrate Tracking (STS) • SEMI E94, E94.1: Specification for Control Job Management (CJM) Stream 7 Process Program Management for recipes (E5, E30) Definition and measurement of equipment reliability, availability, and maintainability during program testing will conform to SEMI E10-0304

  37. 100% Compliance to Safety/Ergo Requirements • Self-audit completed and findings released (all medium to high risk non-conformances are to be addressed): • S2-0200: Safety Guidelines for Semiconductor Manufacturing Equipment including Operational Hazard Analysis covering tool installation, operation and maintenance (per S2-0200) completed for tool install operation / maintenance • S8-0308: Safety guidelines for ergonomics engineering of semiconductor manufacturing equipment • Environmental Characterization Data Summary Work Sheet 6 per International Semiconductor Manufacturing Initiative (ISMI) guideline #06124825A-ENG completed and provided electronically prior to shipment It is an absolute requirement that all equipment must be safe to operate and maintain at any stage of maturity Equipment spare parts and modules must either be small and light enough to handle safely during maintenance, and clearances adequate, or ergonomic handling aids must be provided

  38. Further Standards-related Requirements • Footprint, height and weight dimensions of the Equipment as well as the move-in packages must conform to SEMI E72 specifications • The Equipment loadport must have a RF ID reader compatible with RFID tags (model numbers TIRIS multipage MicroTag RI-TRP-DR2B) on the FOUP per SEMI E99 • The system must have adequate PGV docking interface exclusion zone per SEMI E64-0600 modified as needed for the SEMI E154 450mm load port • The Equipment configuration must have a minimum of one load port that confirms to latest revision of SEMI E154 • The Equipment load port must be capable of receiving 450mm FOUPs confirming to SEMI E158. • The Equipment load port must be capable of receiving lots delivered by 450mm Personnel Guided Vehicles (PGVs) G450C will require SEMI M74 Mechanical Wafer, M76 Developmental Test Wafer and M1 Prime Wafer Standards and use SEMI-compliant carriers for all program test wafer pool /demo purposes

  39. Facilities-Related Standards • The Equipment must comply with the current versions of the (U.S.) National Electric Code - NFPA 70 and Uniform Fire Code - NFPA 79 • The Equipment must be designed to SEMI F47 “Specification for Semiconductor Processing Equipment Voltage Sag Immunity” • All Equipment and materials which will come into direct contact with the wafer or FOUP should be grounded per SEMI Spec E78-0706. • All Equipment enclosures must have an IEC ingress protection rating of IP31 or better • SEMI E6-1296 facilities interface datasheets completed and provided electronically prior to shipment It is recommended that the 450mm Equipment is designed to EU regulatory requirements including, but not limited to, Machinery Directive 98/37/EC, Pressure Equipment Directive 97/23/EC, Electromagnetic Compatibility Directive 89/336/EEC, and Low Voltage Directive 73/23/EEC as applicable

  40. Industry Collaboration and Engagement

  41. Global Supply Chain Ecosystem Example: G450C Linkages Regional Tool Suppliers not in G450C core program Guidelines & Requirements Core G450C Program Process & Metrology Wafer Pool Regional 450mm Opportunities Wafer Suppliers EEMI 450 + R&D entities: FhG IMEC … Tool Suppliers w/G450C Demos Adjunct Tool Demos and CIP projects KSIA I450Metro … • Component Suppliers • Infrastructure Providers

  42. Standardization Opportunities Global Standards Regional Cooperation EHS optimization G450C Program Activities Guidelines Facilities optimization Compliance testing Equipment optimization Discussion this week with ESG-J Facilities Council Standardization WG G450C Groups Back End (Die Prep) WG TBD: Harmonize microcontamination specs TBD: Metrology collaboration

  43. Precompetitive Cooperation • Identified top facilities project objective with M+W • Identified top standardization focus areas with SEMI • Defined pilot project: tool installation at CNSE with adaptor plate and consolidated points of connection • F450C membership defined and first meeting with G450C rolled out project priorities toward proposals • Workshop planned with SEMI, F450C and G450C for early 1Q13 to explore further work • 14nm EPM update with standards guidance based on Supplier tool agreements to be published by end of year

  44. Top Areas for Precompetitive Cooperationwith SEMI and F450C (first targets) • Top Standardization interest areas • Aisle space / width, ceiling height • General sizing/loading/dimensions • EMO interface, control architecture • Crane, gantry • Templates • Top facilities project interest areas • Gas interface boxes, VMBs, cooling water manifolds, etc. • Minimize facilities POCs • Standard hookups for power, PCW, CDA, PV, GN2, exhaust, datacom • Improved AMC detection/response • Pumps and pump frames, etc. • He recycling (Backside cooling ), H2 recycling (EUV)

  45. TEL Facilities Cost Reductions in Albany

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