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AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS. Alexandre BOYER INSA/DGEI University of Toulouse 31077 Toulouse - France Alexandre.boyer@insa-toulouse.fr. Etienne SICARD INSA/DGEI University of Toulouse 31077 Toulouse - France

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AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS

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  1. AN EDUCATIONNAL APPROACH TO ELECTROMAGNETIC COMPATIBILITY OF INTEGRATED CIRCUITS Alexandre BOYER INSA/DGEI University of Toulouse 31077 Toulouse - France Alexandre.boyer@insa-toulouse.fr Etienne SICARD INSA/DGEI University of Toulouse 31077 Toulouse - France Etienne.sicard@insa-toulouse.fr

  2. SUMMARY • CONTEXT • EDUCATIONAL NEEDS • STANDARDS 4. WHAT IS IC-EMC 5. EXAMPLE 6. EVALUATION 7. CONCLUSION

  3. CONTEXT Personnal Equipements interferences Boards Safety systems Components Hardware fault Software failure Function Loss EMC – ONE ACRONYM, TWO CONCEPTS Susceptibility to EM waves Emission of EM waves Carbon airplane Radar

  4. CONTEXT 32nm 90nm 45nm 130nm 100M 250M 500M 1G 2004 2006 2008 2010 Core+ DSP 3 A Core DSPs eMem 10 A Multicore, DSPs, FPGA, RF multiband Memories Sensor 30 A Multicore, Multi DSP Reconf FPGA, Multi RF Memories Sensors 100 A TRENDS – INCREASED PARASITIC EMISSION Increased complexity, IOs number, operating frequencies, transient current Technology 180nm Complexity 50M Packaging 2002 Embedded blocks transient current Core 1 A

  5. CONTEXT 150 mV margin Core supply TRENDS - INCREASED SUSCEPTIBILITY Less voltage margin Supply (V) 5.0 3.3 I/O supply 2.5 1.8 1.2 0.7 32nm 45nm 0.5µ 0.35µ 0.18µ 90nm 65nm Technology

  6. EMC Issues CONTEXT PACKAGES AS ANTENNAS Package dimensions are close to lambda/4 at GHz range

  7. Tools Training Design Guidelines EMC Simulations Compliance ? FABRICATION NO GO EMC compliant GO CONTEXT EMC VALIDATED BEFORE FABRICATION What IC designers and EMC experts are dreaming of… This work DESIGN Architectural Design Design Entry Design Architect

  8. EDUCATIONNAL NEEDS EMC TRAINING AT IC LEVEL – HOW TO START? • A nightmare?

  9. EDUCATIONNAL NEEDS EMC TRAINING AT IC LEVEL – HOW TO START? • A nightmare?

  10. EDUCATIONNAL NEEDS THINGS WE NEED TO DO • Illustrate technology scale down • Complexity • Current switching • Impact on EMC • Illustrate package role and complexity • Simulate simple models with simple simulator (SPICE-like) • Post-process in Freq. domain for Spectrum comparison • “see” E, H fields from currents and voltage • Investigate “what if” with students 3D real-time view in Microwind IBIS 3D viewer in Microwind

  11. EDUCATIONNAL NEEDS OUR PROPOSAL – KEY FACTS • Give key facts about technology impact on EMC • Introduce standard measurement methods • Simulate first order effects using standard model approaches • Give the basics of • emission prediction • immunity simulation • Give simple design rules for improved design • Address both • Undergraduate, graduate students • Engineers in companies • Leave plenty of space for exercises and real-case problem solving • Fit the course in a one or two days format (cost, duration)

  12. EDUCATIONNAL NEEDS OUR PROPOSAL – COURSE OUTLINES • Overview (EMC-IC for managers) • Basic concepts • Measurement methods • Guidelines for improved EMC • Case study • EMC models • Chip-chip coupling

  13. Most usual conducted method Most usual radiated method STANDARDS EMISSION MEASUREMENT METHODS International Standards IEC 61967 www.iec.ch

  14. Most usual conducted method Most usual radiated method STANDARDS IMMUNITY MEASUREMENT METHODS International Standards IEC 62 132 www.iec.ch

  15. STANDARDS MODEL APPROACHES International Standard IEC 62 433 www.iec.ch

  16. WHAT IS IC-EMC IC-EMC - A TOOL FOR EMC PREDICTION • A schematic editor to enter macro-models • An interface to WinSpice analog simulator • A post-processor to compare simulated with measured spectrum • An Electromagnetic solver to simulate radiated field • Freeware, online, 250 pp documentation, 15 case studies

  17. Key tools Main analysis Smith Chart Spectrum analysis Immunity simulation IBIS interface Near-field simulation Impedance simulation WHAT IS IC-EMC SCHEMATIC EDITOR SPICE compatible IC, package and PCB model Basic symbols

  18. EXAMPLE CONDUCTED EMISSION Emission prediction approach Simulation Measurements IEC 62 433 Core Model Package Model Probe Model Test board Model Frequency measurements Time-domain measure Analog Time Domain Simulation IEC 61 967 Fourier Transform Fourier Transform Compare dBµV vs. Frequency

  19. Conversion to Win-SPICE Analog Time-Domain Simulation Fourier Transform dB vs Freq (log) conversion EXAMPLE CONDUCTED EMISSION Emission spectrum analysis Probe Model Test board Model Package Model Core Model

  20. EXAMPLE CONDUCTED EMISSION Emission spectrum analysis What if? • Effect of decoupling • Effect of package supply pairs • Effect of current reduction • … Frequency measurements Compare dBµV vs. Frequency

  21. EVALUATION AUDIENCE • Since 2002, more than 20 sessions involving 300 students and engineers have been organized • ISEN France • ENSME France • On-Semiconductors • NOKIA • APEMC Beijing • One-day or two-days format. • The majority of students said • They understood the mechanisms of parasitic emission and susceptibility • They felt confident in their ability to handle EMC at IC level

  22. EVALUATION QUESTIONS

  23. EVALUATION RESULTS • Answers to questionnaire

  24. CONCLUSION • An environment for EMC prediction at IC level and trainings has been developed • The tool is free and is based on measurement and model standards • Trainings help students and engineers to understand the mechanisms of parasitic emission and susceptibility • As little theory as possible • As much practice and examples as possible • Positive feedback from trainees concerning the tool usage for the illustration of EMC concepts (80 – 90 % satisfaction rate)

  25. REFERENCES • E. Sicard, A. Boyer, “IC-EMC v.2 User's Manual” ISBN 978-2-87649-056-7, July 2009, 320 pages, INSA Editor • C. Dupoux, S. Akue Boulingui, E. Sicard, S. Baffreau, N. Bouvier, "Measurement and Simulation of Electromagnetic Interference in 3G Mobile Components“, EMC Compo 2009, November 2009, Toulouse, France. • S. Akue Boulingui, C. Dupoux, S. Baffreau, E. Sicard, N. Bouvier, B. Vrignon, "An Innovative Methodology for Evaluating Multi-Chip EMC in Advanced 3G Mobile Platforms", IEEE Symposium on EMC, 2009, Austin, USA. • S. Bendhia, M. Ramdani, E. Sicard, Electromagnetic Compatibility of Integrated Circuits, book published by Springer, USA, 2006, 0-387-26600-3 The tool, manual and course slides are online at www.ic-emc.org

  26. THANK YOU FOR YOUR ATTENTION

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