1 / 20

Innovative solutions for high density interconnections

Innovative solutions for high density interconnections. Company Objective. To be the reference in ball soldering equipment through R&D and partnership development. Key activity : AMI or Alloy Micro Injection. A revolutionary process for area array package production.

jamese
Download Presentation

Innovative solutions for high density interconnections

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Innovative solutions for high density interconnections

  2. Company Objective • To be the reference in ball soldering equipment through R&D and partnership development.

  3. Key activity : AMI or Alloy Micro Injection A revolutionary process for area array package production To answer today’s cost needs and tomorrow ’s technological needs

  4. Allows dramatic reduction in TCOO – up to 50% • Current technology uses • expensive balls which are • positioned through pick & place • Or stencil print process • Applied Microtech’s AMI • only requires inexpensive • alloy bars which are molten • to form the balls

  5. AMI 700 PRODUCTION MODULE AMI - Alloy Micro Injection First commercialized module for Micro Injection production

  6. Process Steps Current technology A.M.I. technology

  7. AMI Benefits

  8. Reduced footprint

  9. Lower energy consumption Dramatic reduction in water consumption No flux or detergents Savings Necessary where water is scarce In line with IC manufacturer’s corporate policies Environmentally Friendly

  10. A strategic issue

  11. Solder ball formation

  12. Mould cavity filled with SnPb

  13. Mould cavity filled with lead less solder

  14. Temperature profile Reflow oven

  15. Temperature profile A.M.I process for leadless solder Component damage Process windows

  16. Metal corrosion With leadless solder Inox 304

  17. T.C.O.O comparison ( PBGA 276, 760 µm Ball diameter )

  18. Looking to a bright future • Applied Microtech’s patented technology is set to be the reference for WLP bumping as well as wafer bumping. • 1st level of interconnect of substrates is also an ideal candidate for our technology.

  19. R&D High density road map Alloy Micro Injection Pitch 0,15 Wafer Bumping 1st level substrate bumping 0,3 Wafer Level Packaging 0,5 CSP 0,8 BGA 1,0 Q2 2002 Q4 2002 Q2 2003 Q4 2003 Q2 2004

  20. Thank you Questions & Answers

More Related