1 / 4

Forward Inner Module

Forward Inner Module. Bonding. Bonding errors on both sides - swapped bonds Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector

katina
Download Presentation

Forward Inner Module

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Forward Inner Module

  2. Bonding • Bonding errors on both sides - swapped bonds • Corrected for on link 1 by swapping bonds at chip to fan-in and swapping them back at fan-in to detector • Noticed too late for link 0 and every other channel swapped. Also both unbonded detector strips at one end on link 0 • HV bonded via fan-in to front side. Bond wire from fan-in glued to detector back side

  3. Current characteristics • IV characteristic measured 20C • Consistent with data in database at 150V • High current above 150V, reason not know • Note: Module now slightly dirty due to treatment (e.g. opto tests at liverpool/oxford)

More Related