OCP-IP Corporate Introduction

1. OCP-IP Corporate Introduction Ian R. Mackintosh President, OCP-IP

2. S P P OCP-IP Industry Vision NATIVE WHOLE INFRASTRUCTURE VALUE ADDED Proprietary/Closed Proprietary/Closed Proprietary/Closed Best-of-Breed/Open P Corporate Growth (Product-centric) Industry Growth (Standard-centric) Source: Mackintosh Model

3. OCP-IP Public Membership List (pg. 1) Icron Technologies Imagination Technologies Infineon Technologies Inicore, inc. Innovision Research Integrated Device Technology Inventure, Inc. ITRI ITT Corporation Jasper Design Automation JEDA Technologies, Inc. Jetstream Media Technologies Kaben Wireless Silicon Kawasaki Microelectronics KETI L-3 Communications Systems Leiden University LTRIM Technologies Magillem Design Services Magnum Semiconductor Manhattan Routing, inc. Marvell Semiconductor, inc. Mentor Graphics Mercury Micronas Mimasic Ministry of Information Industry MIPS Technology MIT Lincoln Library Mobileye Carbon Design Systems Carnegie Mellon University CAST CCLRC Celoxica, Inc. Chips & Media, Inc. CircuitSutra Technologies Pvt Ltd. CNFM Cologne Chip AG Comtech EF Data ControlNet India PVT-Ltd. CoWare CrevinnTeoranta Cubic Defense Applications Curtiss-Wright Controls Embedded Computing DAFCA Denali Software, Inc. Den Comm Design and Reuse Digimarc Corp. Digital Blocks, Inc. Digital Dynamics Corporation Digital Media Professionals Dolphin Integration Doulos Duolog Technologies EADS Astrium eASiC EcolePolytechnique de Montreal EDA Café EDA Consortium EDA Express eInfochips, Inc. Elliptic Semiconductor, Inc. Embedded Systems Lab. ENSTA Entropic Communications Ernst & Young, LLP Esterel Technologies ETIS/ENSEA European Electronic Chips & Systems European Space Agency Evatronix S.A. EVE First Silicon Solutions Forte Design Systems FueTrek Co. GDA Technologies GeoLogic Design, LLP Georgia Institute of Technology GreenSocs HCL Technologies HDL Design House HDL Dynamics Hifn Hughes IBM IBM, Japan Icera Semiconductor 3Plus1 4DSP, Inc. Accent Advanced Architectures AerieLogic Agnisys Technology PVT-Ltd. Aizyc Technology Alcatel Alpha Data Amimon Amphion Semiconductor Applied Science & Technology Research Institute Arasan Chip Systems, Inc. ARC International Artec Design Group Arteris Atomic Rules ASICs World Services, Ltd. Atrenta, Inc. Attogenix Biosystems Australian Semiconductor Technology Co. Averant, Inc. Axell Corporation AXYS Design Automation Beceem Communications Bluespec, Inc. Boston Circuits, Inc. Broadcom Cadence Design Systems, Inc.

4. OCP-IP Public Membership List (pg. 2) University of Tokyo, VDEC VaST Systems Technology Verification Technology Inc. VeriLab Inc. Vimicro Vivante VSI Alliance VTT Washington State University Wavante Wipro Technologies WiQuest Communications Xilinx, inc. Yamaha Corporation YogiTech Zoetronics Zoran Zuken, Inc. Ricoh Company, Ltd. Rockwell Collins Royal Institute of Technology Sasken Communication Tech. Savant Company, Inc. Semiconductor Technology Academic Research Center Sesca Embedded Solutions Shanghai Hometown Microsystems Shenzhen Graduate School SIEMENS AG Oesterreich Silicon & Software Systems Silicon Hive Silicon Image GmbH Silicon Integration Initiative Silicon Interfaces Private, Ltd. Silicon Laboratories Inc. Silicon Valley PA, Inc. Silistix SMI Corporation SoC Microelectronics GmbH Sonics Spreadtrum Springsoft SSIPEX STMicroelectronics Stream Processors Synfora Synopsys Taiwan SoC Consortium Tampere University of Technology Tata Elxsi Limited Technical University of Denmark TechOnLine Temento Systems Tensilica, Inc. Teradici Corporation Texas Instruments The MITRE Corporation Thomson Toshiba Semiconductor Tower Semiconductor TransEDA, Inc. TranSwitch Corporation TrustIC Design SRL TSMC UMC Universidad de Castilla-La Mancha Universitadi Bologna Universite de BretangeSud Universite de CergyPontoise University of Bristol, UK University of British Columbia University of California at Berkeley University of Houston University of Southampton Motorola Mtekvision Co. Ltd. Nallatech Nascentric, Inc. National Applied Research Labs National Tsing Hua University NEC Electronics Nexus 5001 Forum NoBug Nokia NVIDIA Corporation Olympus Digital System Design Corp. ON DEMAND Microelectronics On2 Technologies OSCI Paradigm Works Pixelworks, Inc. pls Programmierbare Logik Systeme GmbH Princeton University ProDesign Electronics Corporation PUCRS QThink QualCore Logic Realtek Semiconductor Corporation Regulus Co., Ltd. Republic of Tunisia, Faculty of Sciences

5. OCP – Applications Served – 100’s Mu’s Switches Set-top Boxes Printers Mobile Phones DVD Players Computers Wireless LANs Game Consoles Video Recorders DTVs Note: OCP usage is expanding in both FPGA and military applications (both low and high volumes)

6. OCP-IP Mission “….to promote and support OCP as the completesocket standard that ensures rapid creationand integration of interoperable IP cores.”

7. Important OCP Facts • ONLY complete and proven SoC socket • Essential for “reuse without rework” • The only path to Plug and Play • NOT tied to any one supplier • Tools/Interconnect/Design style, Independent • Specification freely available • HIGH Value Infrastructure in place for Members • Huge cost savings from Deliverables • Dramatic TTM advantages for users (a TTM win = Profit $$)

8. OCP SOCKET Interface Target Bus A SOCKET IS NOT A BUS INTERFACE OR Interface Target Bus B IP Core Core-centric Interface Note: OCP separates the computational IP core from its communication activity. White Paper available re: “Sockets” at www.ocpip.org/socket/whitepapers.

9. Charter of OCP-IP • Governance of OCP Specification • Evolution and enhancement • Compliance testing and certification • Community source products administration • Specification • Tools, support, services, etc. • Promotion of the standard • Non-profit operation • HQ Beaverton, Oregon

10. Membership Structure • Governing Steering Committee (“GSC”) • The Governing BoD • Sponsor • Eligible for Working Groups • Community • Free Community Source Products Note: Sponsor fees $25K, Community $10K per year ($1K for company with annual revenues < $10million)

11. University Program • Launched January 2003 • World-leading participants • Suitable for undergraduates and post-graduates • Free software tools, support and training • Research Copies of OCP Specification • 1,000 university copies worldwide

12. OCP-IP Benefits are Compelling Industry-wide Breadth of Standards and Specifications • Successful interface adoption requires depth • OCP-IP provides this depth Focused Depth

13. Extensive OCP Infrastructure Visit the website for details of the benefits offered by OCP-IP: www.ocpip.org/membership/information/wheel

14. OCP-IP in Asia: Supporting Global Design • Multiple, existing local-language websites: • Japanese, Chinese and Korean • Reach homepages via www.ocpip.org • Technical support in Japanese, available now • Contact jptech@ocpip.org • OCP and CoreCreator Training in Japanese, available now • Contact admin@ocpip.org • Expansion continuing in India CY2009 • Many Indian companies already hold membership in OCP-IP

15. OCP-IP Working Groups (WGs) • Technical Vision • Marketing • Specification • Cache Coherence (*) • System-Level Design • Functional Verification • Debug (*) • NoC Benchmarking (*) • MetaData (*) …all groups meet weekly or bi-weekly (*) Newer WGs driven by Heterogeneous Processor, Multi-Core Systems

16. Reviewing Status of OCP-IP WGs • View “infrastructure wheel” for general status and activities of working groups • http://www.ocpip.org/membership/information/wheel • Quarterly updates on individual working groups provided in OCP-IP newsletter • http://www.ocpip.org/pressroom/newsletters/ • Enquiries regarding specific working group activity or your request for participation • Contact us at admin@ocpip.org

17. OCP Benefits • Bus/interconnect independent (vendor neutral) • ONLY complete socket • Extensive, Proven and Tested industrial-grade tools environment provided free as part of paying membership entitlement • IP core-centric (key to true reuse)

18. Membership Benefits Matrix

19. OCP-IP Membership Benefits

20. White Papers Available from OCP-IP • “Survey of Network-on-Chip Proposals” • “Standard Debug Interface Socket Requirements for OCP-Compliant SoC” • “An Initiative Towards Open Network-on-Chip Benchmarks” • “OCP TLM for Architectural Modeling, Methodology White Paper” • “SystemC based SoC Communication Modeling for the OCP Protocol” • “The Importance of Sockets in SOC Design” • “Socket-Centric IP Core Interface Maximizes IP Applications” • All white papers available FREE at: http://www.ocpip.org/socket/whitepapers/

21. OCP-IP Promotional Benefits • Access to OCP-IP endorsed promotional activities such as tradeshows, technology pavilions, presentations, etc. • Company listing, URL and logo on the member roster • Collaboration or support on article placement • Promotion in OCP-IP’s libraries • IP: www.ocpip.org/library/ip/ • EDA Products: www.ocpip.org/library/eda/ • Related Services: www.ocpip.org/library/services_asic/ • Newsletter feature • Joint press releases

22. Organizational Growth • OCP-IP plan Mar ‘01 • Formal founding Jun ‘01 • Web site/products/services Sep ‘01 • “GSC” BoD Formation Oct ‘01 • Public announcement Dec ‘01 • Official OCP 2.0 Release Sep ‘03 • Official OCP 2.1 Release Mar ’05 • Official OCP 2.2 Release Q4 ’06 • Official OCP 2.2 Rev 1.1 Release Q2 ‘08

23. OCP-IP Membership Join OCP-IP now by contacting: admin@ocpip.org OCP-IP Association 3855 SW 153rd Drive Beaverton, OR 97006 Tel: 1-503-619-0560 Fax: 1-503-644-6708

24. Becoming an OCP-IP Member • Get membership application:www.ocpip.org/data/OCPIP_Membership_Application.pdf • Complete application form (takes two minutes!) • Fax completed application to 1-503-644-6708

25. OCP-IP Corporate Introduction Ian R. Mackintosh President, OCP-IP