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FEE Electronics progress

This update discusses the delay in PCB manufacturing for a mezzanine card due to a technically challenging design. It also mentions the progress in testing and VHDL development for the FEE64 system.

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FEE Electronics progress

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  1. FEE Electronics progress Mezzanine manufacture progress FEE64 testing and VHDL progress

  2. Mezzanine manufacture Progress • PCB manufacturer delayed through the processing due to technically challenging design. • Shipped 20 to assembler ( Patronics Ltd ). • 15 assembled boards delivered to DL 2/12/09. • 5 assembled boards failed final quality control at Patronics. Pads had lifted after re-work. • After visual inspection at DL. • 10 OK for use. • 1 broken track and lifted resistor • 1 solder whisker between resistors ( can repair ) • 3 solder on ASIC pads • Assembled to copper block and found a component fouled. Mechanical workshops removing 0.2mm copper to solve the problem. • Creating 5 kits with mezzanine card, mounting pins and copper block with heat conducting foam pad in place for despatch to RAL.

  3. FEE64 testing and VHDL progress • MIDAS control and acquisition system is under development as the VHDL evolves. • Spectra taken from all four Mux readout ADCs with reference and input ground. FWHM of 3 channels.

  4. Clock distribution • No further work has taken place. • Pcb layout to proceed after VHDL for acquisition complete. • Designed for manufacture locally. Master SYNC to clock box FEE64 (sync master) Clock box FEE64 FEE64 FEE64 200Mhz clock and SYNC distribution

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