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8 MEMS Packaging

MEMS MOEMS Nano. Workshop. 8 MEMS Packaging. Ken Gilleo PhD ET-Trends LLC. Packaging Classification. Package discrete MEMS device (non-WLP) Partial WLP; pre-packaging; e.g. capping Total WLP Bond protective wafers with vias Bond protective wafers with vias in MEMS

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8 MEMS Packaging

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  1. MEMS MOEMS Nano Workshop 8 MEMS Packaging • Ken Gilleo PhD • ET-Trends LLC

  2. Packaging Classification • Package discrete MEMS device (non-WLP) • Partial WLP; pre-packaging; e.g. capping • Total WLP • Bond protective wafers with vias • Bond protective wafers with vias in MEMS • Integrated package with 2nd-level connectors

  3. Hermetic Packaging • Metal • Ceramic • Combinations Plastic has not “proven” hermeticity – passing leak test is not enough; Result is generally a Near-Hermetic Package (NHP)

  4. Plastic OPEN INSERT FILL Conductor Insert RJR Polymers Thermoplastic Quantum Leap Packaging RJR Polymers Plastic Molded Package Metal Lead Fame (MLF)

  5. Knowles Electronics PCB Fabricated Enclosures • Fabricated PCB substrate; BGA, QFN • Add walls; various methods used • Die attach & wire bond chip (s) • Seal lid • Singulate Used for non-hermetic MEMS such as microphones

  6. Dam Selective; semipermeable membrane, etc. Ported Flip Chip BGA Encapsulant MEMS FLIP CHIP Underfill Light pipe or gas access

  7. WLP Processes • Wafer preparation • MEMS release step • Coat (polymer), treat; anti-stiction, other • Wafer bonding • Apply adhesive if required • Bond • Singulation; cap, MEMS, both • Secondary packaging if required • Test

  8. Partial WLP: Pre-Packaging • Form package components • Caps in wafer • Couplings, fittings, ports, or none • Assemble • Place sub-components • Wafer bonding • Move to final packaging process • Capped wafer is transportable • Packaging foundry may handle Popular for inertial sensors; accelerometers, gyro.

  9. Wafer-Level Capping (1) Print Adhesive Printed Adhesive Walls or use etched features Cap (2) Bond MEMS Wafer (3) Singulate; may be complex

  10. Seal Cap Vacuum MEMS Chip Cross-section WL “Cap & Mold” 1. Apply cap to device or wafer; solder, weld, bond. After singulation steps 2. Attach & bond device 3. Conventional overmolding or dispensed encapsulant

  11. Lid Sealing/Bonding • Used for virtually all cavity packages • WL lid bonding is called “capping” • Many methods, old and new • Wafer bonding & lid seal can share methods Can use many of the same methods as wafer bonding

  12. Wafer-Level with Polymer Films 1. Form sheet of polymer film or resin 2. Cut or mold into matrix; laser or die 3. Bond tack to lens disk Laser spot or diode bar line 5. Seal/bond to wafer with laser, such as near-IR 6. Singulate by sawing 4. Flip lens/LCP array and align to wafer

  13. Total WLP Processes must provide: • Electrical pass-through; e.g.; TSV • Enclosure • Interconnect to PCB (2nd-level) • Controlled atmosphere as required • Non-electrical I/Os as required • General package attributes TSV = Through Silicon Vias

  14. Interconnect for WL • Through chip (drill & fill; plasma, RIE) • Route conductors over/under Same methods been adopted & developed for 3D stacked chips

  15. Integral Caps • Form capping structure • Clean • Vacuum or gas environment • Seal port • Singulate

  16. Fabricate Caps on Wafer(Hexal MicroMold Process) • Etch Recess • Deep Etch • Deposit sacrificial & pattern • Plate Au bumps & seal • Release

  17. Micro Cap Assembly • Transfer caps to MEMS • Align • Bond • Separate

  18. Deposited Layer Sacrificial MEMS Structure Base Evacuate …or add port or coupling Seal Integrated Package

  19. Device-Specific Packages

  20. Encapsulation Selective MEMS Ink Jet “Gun” I-TAB package This type of machine can be used to selectively encapsulate MEMS- one like this is used on ink jet cartridges. Courtesy of Speedline MEMS bare die

  21. Protective Coating; e.g.; Parylene Corrosion can occur under the coating in harsh environments Cost can be too high Pressure Packages Motorola Unibody Package Bishnu Gogoi, Motorola

  22. Bio-MEMS & Fluidics Packaging

  23. Bio-MEMS Challenge • Biocompatibility; inert • Sample into pressurized system • Variety of energy transfer modes • Interfaces in hostile environments • Protection within life system • Remakable couplings

  24. Fluid Coupling Technology • Fluidic MEMS device (s) • Inter-chip coupling as required • Auxiliary unit connections • Through-package fluidic interface • Electrical I/Os and 2nd-level

  25. Bulk Coupler Assembly Fluid Coupling Design Materials: silicon, polymers Processes: bulk etching, RIE Plastic Insertion Using Cryogenics Ellis Meng; California Institute of Technology

  26. BioMEMS IME Singapore

  27. Plug-in MEMS

  28. Session Summary • MEMS is a major packaging challenge • Typically device-specific • Often application-specific • Result is non-standard, high customization • Trend Discrete  pWLP  full-WLP • More WLP in the future • Some MEMS packaging suppliers evolving

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