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Automation Technology Europe TC Chapter Liaison Report. Updated Jan 7, 2016. Committee Leadership. • Co-Chairs – Christian Hoffmann – Peer Group. 2. Meeting Information. • Last meeting – Oct 8, 2014 • SEMICON Europa • Grenoble, France • Next meeting – TBD. 3.
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Automation Technology Europe TC Chapter Liaison Report Updated Jan 7, 2016
Committee Leadership • Co-Chairs – Christian Hoffmann – Peer Group 2
Meeting Information • Last meeting – Oct 8, 2014 • SEMICON Europa • Grenoble, France • Next meeting – TBD 3
Organizational Chart Automation Technology EU TC Chapter C: Christian Hoffmann – PEER Group Global Equipment Interface Spec. (EIS) TF Carsten Born – VITRONIC GmbH PV Wafer Traceability TF TBD 4
Equipment Interface Spec (EIS) TF • No New Activities • Idled SNARFs – Doc. 5151, New Standard: Specification To Transfer Wafer Mark Reader Data To Host System (MES) – Doc. 5339, New Standard: Specification for Single Material Tracking and Tracing For Crystalline Silicon PV – Doc. 5566, Line Item Revision to SEMI PV002-00-0709E Guide for PV Equipment Communication Interfaces (PVECI), modify requirement [PV02-RQ-00007-00] to allow implementation of new namelist requests instead of required documentation. – Doc. 5154, New Subordinate Standard "Profibus implementation specification for a Horizontal Communication between equipment for crystalline photovoltaic fabrication system" (Parent Document: PV35 "Specification For A Horizontal Communication Between Equipment For Photovoltaic Fabrication System") 5
PV Wafer Traceability TF • No new activities • Idled SNARFs – Doc. 5418 Revision of SEMI PV32-0312, Specification for Marking of PV Silicon Brick Face and PV Wafer Edge – Doc. 5419 Revision of SEMI PV29-0212, Specification for Front Surface Marking of PV Silicon Wafers with Two-Dimensional Matrix Symbols 6
Questions? • Contact – Stephan Raithel (sraithel@semi.org)/ Europe – James Amano (jamano@semi.org)/HQ – Kevin Nguyen (knguyen@semi.org)/HQ 7