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FEE Electronics progress

This update provides the progress of the FEE64 PCB layout, including completion of signal routing, adherence to design rules, and manufacturing readiness. It also outlines the remaining tasks, such as prototype fixture development, testing, and commissioning.

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FEE Electronics progress

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  1. FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixtures FEE64 commissioning A few of the remaining tasks

  2. PCB Layout Progress June 9th : 77% signals routed July 14th : 100% signals routed • Check :- • Impedance matched traces are up to latest spec. • Layout conforms to design rules. • Schematics for undriven signals • Design requirements are met ( run Design Rules Check ) • Board is manufacturable. • Assembly assist marks and information.

  3. PCB progress targets • July 14th : • Completed routing and layout. • July 20th : • Submit to manufacturer for validation and quote. • Submit to assembler for evaluation of assembly and final parts purchase. • July 27th : • Complete engineering review. • Submit to pcb manufacturer and assembler. • September 14th : • Assembled FEE64 delivered.

  4. Collaboration with Detector Systems Development Group (DSDG) of TBU.(Technology Business Unit ) Completed : • Gbit data rate from memory on the devkit => 240Mbit/sec . • System boots with fallback to golden copy. • Created a DMA peripheral with transfer rate of 1.1Gbytes/sec. • Pin allocation of FEE64 memory and Gbit signals checked. Next steps : • Create a memory test and configuration system. • Review the FEE64 schematic and pcb layout.

  5. Prototype fixtures for softwareand VHDL development • Pin out and advice provided by Steve Thomas. • Fixture will allow communications between the ASIC and Linux to be developed. • Mux readout logic VHDL can also be developed. • Fixture designed and manufactured in DL electronic workshops. • 2 ASICs delivered. • Multiplex readout ADC circuit prototype in development for VHDL and performance testing. Fixture comprises a ZIF socket on a pcb designed to mount a packaged ASIC onto an ML507 FPGA development board. Also a copy of the ADC and buffers used for the Multiplex readout.

  6. Initial testing of FEE64 • Power supplies – 28 : Check for noise, stability, accuracy, efficiency…. • FPGA – • Check configuration via JTAG. • Check processor operates with internal memory and terminal. • Check configuration from EEPROM. • DDR2 Memory • Run test system developed by DSDG. • Check results and optimise access speed for best performance. • Gbit Ethernet • Run test system developed by DSDG. • ASIC communications and discriminator output timing • Analog buffers and ADCs

  7. A few of the remaining Tasks • Design Mezzanine pcb ? • Complete Mechanical design. ( Is waiting for final component heights ) • VHDL for prototype fixtures. • Test documentation. • Commission first FEE64 units • VHDL for first experimental use. • Full Linux processor with peripherals and DMA ( from DSDG work ) • ASIC communications ( from prototype work ) • ASIC multiplexed readout. ( from prototype work ) • Timestamped based on discriminator signals. • Formatted and transferred to processor memory as four time ordered data streams. • FEE64 design documentation. • Prepare for production.

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