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VTX

VTX. From beam-line chipmunk ( h ~ 5.5). Be beam pipe. Specs: 4cm inner dia; 500 m thick; NEG coated Discussed w/: PHENIX Engineer (P. Kroon) 0.3 +/- 0.1cm clearance between beam pipe and 1 st Si layer to get VTX concentric with the beam CAD Head of Vacuum Group (D. Hseuh)

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VTX

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  1. VTX

  2. From beam-line chipmunk (h ~ 5.5)

  3. Be beam pipe • Specs: 4cm inner dia; 500m thick; NEG coated • Discussed w/: • PHENIX Engineer (P. Kroon) • 0.3 +/- 0.1cm clearance between beam pipe and 1st Si layer to get VTX concentric with the beam • CAD Head of Vacuum Group (D. Hseuh) • Diameter probably OK; 500m walls may be too thin • AP Upgrades Coordinator (W. Fischer) • Physical aperture of at least 5 transverse rms beam sizes (allowing for 5mm orbit error) is OK • During start-up, increased chance that beam will hit the beam pipe leading to total loss of a single bunch • Contact Brush Wellman Electrofusion?

  4. Mylar sleeve • Proper grounding & isolation of Si detector • Image charge from circulating beam • Aluminized Mylar sleeve around Be beam pipe • Few m’s thick to hold down material budget • Grounded w/ braid through magnet • No interference with other sub-systems; nothing else between beam pipe and 1st pixel layer

  5. Infrastructure & Integration • From the DC Upgrades Meeting in March: • 1st action item on project timeline to begin now: • RIKEN-funded engineer to specify: • Heat Load • Mechanical tolerances/distortions • Disassembly/configuration options • Input to 2nd round HYTEC design • Next action item not until end of summer • Still on schedule; additional planning continues

  6. Infrastructure & Integration • Circulated spec sheet compiled by D. Lee for CDR: • Heat Load (mainly due to readout chips): • 0.35 W/cm2 for strip layers; Vince concurred • 0.70 W/cm2 for pixel layers; no response yet • Consistent with nos. in proposal • Mechanical tolerances/distortions: < 25 microns • Disassembly/configuration options: D. Lee has discussed modularity with HYTEC • Need to finalize before beginning mech design

  7. Auxiliary Systems • Mechanical Support Structure: • Barrel frame (HYTEC and LANL) • External support structure in central magnet (BNL) • Power for Si detectors (proper grounding & isolation): • Si HV power supplies (Stony Brook & RIKEN) • Si LV power supplies (Stony Brook & RIKEN) • UPS

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