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Pixel Thermal Test

Pixel Thermal Test. Task Objective Compare FEA Predictions with LBNL thermal test of Pixel Stave Construction utilizes Allcomp carbon foam for sandwich core Two different composite facings YSH70 woven cloth single layer with substantial openness between fiber tows K13D2U, 3 layer unitape

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Pixel Thermal Test

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  1. Pixel Thermal Test • Task Objective • Compare FEA Predictions with LBNL thermal test of Pixel Stave • Construction utilizes Allcomp carbon foam for sandwich core • Two different composite facings • YSH70 woven cloth single layer with substantial openness between fiber tows • K13D2U, 3 layer unitape • Both using resin matrix • Silicon heater used on top and bottom surfaces, bonded to facings with SE4445 adhesive • Forward and aft of the silicon heaters were Kapton strip heaters • FEA model • Confined to the silicon heater region (6.24cm long) VG 1

  2. FEA Model • Primary Objective • Recover the Allcomp foam thermal conductivity • Allcomp foam based on enhancing thermal properties of RVC foam • 3% solid density (0.066g/cm2) of RVC foam has a thermal conductivity ~0.05W/mK • Allcomp foam for the LBNL test had a density of 0.26g/cm2 ???? • Iterate until thermal solution nominally agrees with the thermal test result • Difficulty lies in assigning material properties • There are four solids, with three thermal interfaces on each side of the mid-plane • Thermal interface thermal resistance becomes an assumption, as well as the thickness • Water coolant • Flow results in turbulent flow and very high convection coefficient, less problematic than thermal interface resistance VG 2

  3. Solution With FEA Model • Material Properties • Heater heat loads, 8.38W • Silicon heater, 148W/mK, 0.28mm thick • Silicon heater adhesive, SE4445, 0.6W/mK, 0.004in thick, two places • YSH70 open cloth fabric, one layer, 0.6W/mK, 0.14mm • YSH70 adhesive, 1.55W/mK, 0.002in • Allcomp foam, 10W/mK, back-out by solution • Al cooling tube, 200W/mK, 2.8mm OD and 2.19mm ID • Water, convective film coefficient, 66,000W/m2K, 1.0L/min • K13D2U facing, 1W/mK, 0.28mm thick • K13D2U adhesive, 1.55W/mK, 0.002in thick VG 3

  4. Pixel Prototype Components Tube with CGL7018 YSH-70 and K13D2U glued to foam Tube in foam with CGL7018 VG 4

  5. LBNL Thermal Test Set-Up Silicon heater VG 5

  6. FEA Model- Silicon Heater Portion Only Heaters 2.14cm by 6.24cm Allcomp foam 2.8 OD coolant tube VG 6

  7. FEA Solution- LBNL Foam Sandwich LBNL Thermal Test Peak 34.5ºC YSH70 side K13D2U side Slight temp difference, due to thickness of laminates 31.48ºC ~0.5C in center VG 7

  8. Pixel Test Using Allcomp Foam FEA peak ~31.48ºC and analytic ~29.5ºC Q Prediction using analytic formula using shape factor for foam, based on foam extending laterally to infinity VG 8

  9. FEA Temperatures at Each Surface VG 9

  10. Allcomp Foam Prediction • Based on LBNL Test and Thermal Solution • Conclude the foam thermal conductivity is nominally 10W/mK • Factor 200 increase over virgin RVC foam VG 10

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