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Thermoplastic NIL of P(VDF- TrFE -CFE) . Si chips are cleaved and cleaned Spin-coating of OmniCoat on Si Spin-coating of P(VDF- TrFE -CFE) on OmniCoat The Si stamp is silanized Optical alignment performed Heating and compression The upper chip is removed
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Thermoplastic NIL of P(VDF-TrFE-CFE) • Si chips are cleaved and cleaned • Spin-coating of OmniCoat on Si • Spin-coating of P(VDF-TrFE-CFE) on OmniCoat • The Si stamp is silanized • Optical alignment performed • Heating and compression • The upper chip is removed • Release in water of free standing micro patterned membrane J. Shklovsky, L. Engel, Y. Sverdlov, Y. Shacham-Diamand, S. Krylov, Microelectronic Engineering, 2012
Thermoplastic Nano-Imprinting Lithography of P(VDF-TrFE-CFE) Silicon Stamp Patterned polymer Silicon Stamp Patterned polymer J. Shklovsky, L. Engel, Y. Sverdlov, Y. Shacham-Diamand, S. Krylov, Microelectronic Engineering, 2012