2003 ITRS Factory Integration Update Mani Janakiram, Intel

1. 2003 ITRS Factory Integration UpdateMani Janakiram, Intel • Agenda • Scope and Global Landscape • Difficult Challenges • Manufacturing Strategy Evolution • Technology Requirements • Attributes of a 90nm -> 45nm Factory • Some Integrated Potential Solutions: • Direct Transport, Process Control, Engineering Chain • Industry Research Needed • Key Messages

2. Factory Integration Scope and Drivers UI Factory Operations Production Equipment Factory Information & Control Systems Facilities AMHS Si Substrate Mfg Chip Mfg Wafer Mfg Product Mfg Distribution Reticle Mfg • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Increasing cost & Cycle time implications • Factory is driven by Cost, Productivity, and Speed: • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient high volume production, high reliability, & high equipment reuse • Enable rapid process technology shrinks and wafer size changes

3. Excellent Participation from Suppliers, IC Makers, Universities, and Research Institutes Over 100 Global Participants in 2004

5. APC, Yield, and E-Manufacturing Capabilities (EEC) R2R FDC SPC Recipes Data Yield PCS E-Diag EPT What Does a Leading Edge 300mm Fab Look Like Today? High product mix operations enabled using automation 100% AMHS Storage and Intrabay Transport Systems in place Aggressive focus on lot cycle time reduction Pervasive use of Standards for carriers, equipment interfaces, and software systems FOUP carrier tracking using ID tags at load ports Some Wafer Level Tracking & Recipe/Parameter Changes Very high use of APC and Yield systems Factory Scheduler And Material Control Systems Scaled for > 30k wspm Equipment Control Systems Manufacturing Execution Systems Most equipment data feed through SECS/GEM communications All lots and wafers tracked and processed using the MES Equipment Performance Tracking (EPT) Data Partner, Customer Or Supplier Some use of E-Diagnostics

7. Manufacturing Strategy Evolution Speed and environment center-minded Throughput center-minded Specific Tech. Level TR (Eq., AMHS, FICS) Effort Effort Specific Tech. Potential Solution (Eq., AMHS, FICS) Factory Operation Requirement Enterprise Level Requirement Current values Next generation Values Wider coverage needed

8. Search for New Metrics • Carrier Delivery Time Facility ECM Equipment Control Technical Element Level • AMHS T/F Design • AMHS MTTR & MCBF AMHS SCM FICS • Eq. Availability & Utilization Eq. Process Speed Production Flexibility • X Factor Factory Operation Level • NPW Activity • NPW-Start Usage Development Speed ES & H NPW Control • Productivity • Lot Cycle Time • Productivity and flexibility measure for high mix Production Methodology and Constraints • Consumables and cost reduction Enterprise Level Line capability strategy • Floor Space Effectiveness • Energy saving Product Development

14. Future Process Control System Capabilities Manufacturing Execution System (MES) Operations Data WIP Tool Control Dispatch MCS SECS/GEM Control Line Integrated APC/Yield Data & Systems Equipment Data Acquisition (EDA) Standards Line Equipment & Process Data Run To Run FDC SPC Yield PCS Today 100 variables @ 3 Hz each = 300 values per sec Future EDA Goal 500 variables @10 Hz each = 10,000 values per sec • Equipment Capabilities • Standardized data and connectivity • Fast sensor sampling & data transfer rates • Host ability to stop processing as needed • Graceful recovery when a fault occurs • Ability to change parameters and values between wafers • Wafer tracking all points within the tool • Automation Capabilities • Data Sharable between APC applications • High data transfer rates • Single point configurations • Integrated yield, process control, and operational systems • Rapid application development (run to run algorithms, etc.)

17. Part of Supply Chain Part of Supply Chain Not Engineering or Supply Chain Legend New Products Need Faster Customer Delivery • Challenge: Customers want new products delivered much faster • Key Concept: The Engineering Chain integrates rapid data exchange from design to new chip delivery to the customer to ensure customer cycle times are met • Engineering Chain = Design  Reticle  Integration  Customer  HVM • Different from supply chain management which focuses on volume production Data Transfer Planning and parallel activities to deliver Process Development Product Design Mask Fabrication Packaging and Test Customer Evaluation Wafer Fab Data Transfer Data Transfer This is a Supply Chain Task Data Transfer Volume Run Design Fix Design Improvement

20. Key Messages • Business strategies, market demands, and process technology changes continue to make factories difficult to integrate • Economic and business challenges areequal to our manufacturing and process technology challenges • Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling still must be improved • Factory’s speed and flexibility are gaining more attention to accommodate various production methodology • Intense investigation of enterprise and FO level requirements to meet newer production methodology is required In addition to the current requirement • More industry alignment and standard development are to be continued