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2004 ITRS Factory Integration

2004 ITRS Factory Integration. Europe Arieh Greenberg, Infineon Asia (Japan, Taiwan and Korea) Michio Honma, NECEL; Shige Kobayashi, Junji Iwasaki, Akihira Chikamura, Renesas; Hiromi Yajima, Toshiba; Mikio Otani, Asyst Shinko; Makoto Yamamoto, Murata; Hiroyki Akimori, Hitachi;

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2004 ITRS Factory Integration

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  1. 2004 ITRS Factory Integration Europe Arieh Greenberg, Infineon Asia (Japan, Taiwan and Korea) Michio Honma, NECEL; Shige Kobayashi, Junji Iwasaki, Akihira Chikamura, Renesas; Hiromi Yajima, Toshiba; Mikio Otani, Asyst Shinko; Makoto Yamamoto, Murata; Hiroyki Akimori, Hitachi; Thomas Chen, TSMC; Tom Yeh, PSC; Ivan Chou, HP; US Mani Janakiram, Jeff Pettinato, Intel; Brad Van Eck, Sematech; Eric Englhardt, Maureen Breiling, AMAT; FTF Meeting@ Tokyo, Japan Nov 30th & Dec 1st 2004

  2. ITRS FI FTF Summary • Very good participation • Team closed on 2004 FI efforts and started planning for 2005 FI efforts • Kicked off focus area efforts • Airborne Molecular Contamination (AMC) cross-functional team formed with YE to address Facility and Equipment requirements for <45nm. • 450mm FI team formed to focus on technology needs based IRC ready date of 2012. • “Proactive Visualization” team formed to address high mix, small lot sizes and other key areas. • Good cross-TWG interaction and identified key issues • AMC • Data traceability • more investigation needed for: • 1mm Edge Exclusion (YE conducting survey) • Facility challenges for bulk delivery, vibration, etc.

  3. “Top 9” FI Focus Areas (Not prioritized)

  4. Cross-Cut TWG Discussion (Nov 30th/Dec 1st)

  5. Cross-Cut TWG Discussion (Nov 30th/Dec 1st)

  6. Cross-Cut TWG Discussion (Nov 30th/Dec 1st)

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