ITRS Factory Integration

1. ITRS Factory Integration 2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui Shige Kobayashi, Tom Jefferson July 2008 San Francisco, USA Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: S. H. Park Taiwan: Thomas Chen US: Tom Jefferson

2. UI Factory Integration Scope and Drivers Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities Si Substrate Mfg Chip Mfg Wafer Mfg Product Mfg Distribution Reticle Mfg • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Increasing cost & Cycle time implications • Factory is driven by Cost, Quality, Productivity, Speed, and Flexibility • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient/Effective volume/mix production, high reliability, & high equipment reuse • Enable rapid process technology shrinks and wafer size changes

3. Key Technologies that will Impact Factory Design • 2008 and future years are targeted to meet productivity and capture technology requirements • Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), new materials, 450mm conversion, significant productivity improvements, and waste (inefficiencies) reduction • Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness Planning for NGF/450mm EUVL in Production? 450mm ? NGF ?

4. FI 2008 Focus

5. FI 2009 Focus Other Focus Areas will be Addressed as Required

6. Supporting MaterialsFor ITRS Factory Integration 2008 and 2009 Focus Areas

7. NGF/450mm Fab Guidelines 2005 2006 2007 2008 2009 2010 2011 2012? NG Factory Guidelines combined with ITRS TR & PS Interoperability Testing & Reliability Verification 5 6 Factory Control System Standards 4 300mmプライム推進派 ISMI Guidelines 450mm Era JEITA Guidelines Productivity Axis Direct Transport Standards Cycle time &Cost/Cm2 reduction STK STK 300mm Prime Wafer by wafer Process Start Speed etc Seasoning etc Production Equipment Standards Driven by productivity & cost improvements (Cycle time & cost/cm2) 450mm wafer Standards Tool Tool 300mm Classic Carrier & lot-size determination Wafer Point Of View Equipment maker Inputs 2005 2006 2007 2008 2009 2010 2011 2012 2 Source XTime Dest XTime Inter-Bay XTime Today Next several years 450 Time axis Source Tool Wait Time Source STK Wait Time Dest STK Wait Time Dest Tool Wait Time 3 ITRS FI TWG will synchronize with NGF and 450mm guidelines to address FI challenges, technology requirements and potential solutions Courtesy: JEITA/ISMI

8. Factory Integration Working Group Focus Equipment Output Waste in Factory Factory View Wait time Waste People Output Waste in Factory Unit View People Capability Waste Silicon Waste Equipment Resource Waste More Detailed Representation of Factory Waste Wafer People Equipment

9. Waste Reduction Activity Time Table Summer Mtg Winter Mtg Spring Mtg Summer Mtg Manuscript Work with other TWGs to pilot W/R Review of W/R approach FI W/R TR tables development Working with Other TWGs W/R Write Up for 2009 ITRS

10. Wait Time (WTW) and Equipment (EOW) Output Waste Facility Operators Bottleneck Resource Issue: Comprehensive data collection of factory resource activities Addition of related factory resource activity data(; equipment, AMHS, operators, facility) Standardization of data definition Data collection automation AMHS by Lot by Wafer 2～N 1 Availability Efficiency Losses • Operation View • Lot Size • Batch Size • Dandori • Hot Lot • Dispatch Rule Operation Efficiency Losses Rate Efficiency Losses W/R :Waste Reduction WTW :Wait Time Waste EOW :Eqp Output Waste Assignable Quality Losses E79 Theoretical Production Time Trade-Off Waste Reduction Cycle Plan EOW Reference OEE Metrics Raw Process Time Wait Time Product View Do Structured Information W/R KPI Check WTW Reference Resource View X-Factor Metrics by Process Steps Action Cycle Time

11. Applying Waste Reduction to Drive The Industry in the Proper Direction • Wait Time Waste • Baseline = time to process a single wafer in an un-loaded tool = CTmin • Actual performance = cycle time of wafer when processed in production with large lot • Waste = (actual CT-CTmin)/CTmin • Equipment Output Waste • Baseline = designed equipment output capability (wph) • Actual performance = actual good production wafer output of the equipment in production • Waste = (capacity-actual good wfrs)/capacity * 100

12. Data Collection Roadmap FICS PE HostSoftware Tool EDA Sensor Factory Time Server E148 (NTPv3) Data Frequency Time Synchronization Factory Integration - AMHS Sub-team June 18, 2008 12

13. Methodology for Future Facility Modeling High Level Approach Process Mask Layers Metal Layers Process Steps Process Tools Physical Characteristics (LxWxH, Weight, etc) Process Materials (New Technology Impact) HIGH LEVEL First Draft Average Tool Size Tool Scaling Factor Admin Scaling Factor Support Space Scaling Factor Cost per square foot Construction Impact Design/Build Time Schedule Facility (SF,M2) Clean space, Admin Space, Non-clean space

14. Total AMC Concept YE Interface