500 likes | 709 Views
RF in Science and Industry Jonathan Allen, Ph.D. RF Electronics Consulting Philadelphia CONET. What is RF?. Maxwell. James Clerk Maxwell 1831-79. RF Vs. Pwr. or LF. LF: S ystem dimensions << so propagation times are insignificant within system.
E N D
RF in Science and IndustryJonathan Allen, Ph.D.RF Electronics ConsultingPhiladelphia CONET
RF Vs. Pwr. or LF • LF: System dimensions << so propagation times are insignificant within system. • RF: Phase diff. due to propagation times. • RF: Skin effect = (2/ o)1/2 [mks] • In RF plasmas, ion and electron migration per 1/2 cycle generally << sys. Dimensions. • Small L and C values much more important
Examples of ISM RF • Heating of lossy materials • Plastic welding (PVC) • Cooking • Drying • Glue curing • Medical (diathermy, ablation, cautery) • Materials testing • NMR/MRI • Plasma processes • Sputtering & deposition • Etching • Spectroscopy
RF Heating Polar molecules flip orientation as e-field reverses. Some of the energy is dissipated as heat (dielectric loss).
RF Drying • Use for wood, foods, ceramic greenware • Fast • Selective--Heats only wet zones, uncured resins. • Uniform in depth. • Controllable • Reduce RF power as product approaches goal • Often uses 27 or 40 MHz
RF Drying Wood SAGA RF-Vacuum Timber drying system
RF Induction Heating • Usually uses LF ~100 KHz for metals • Localized heating possible Zone refining • No combustion products or oxygen (can heat in vacuum)
Lab Measurement The same properties of polar molecules that enable RF heating also measure moisture content of wood, flour, etc. with an RF capacitance bridge. RF induction coils measure the thickness of metallic films and foils based on skin-depth.
Plasmas Generate: • Free electrons • Positive ions • Radicals • Energetic particles • Spallation of target (sputtering) • Chemical reactions • Excited atoms and molecules • Light (glow discharge)
Paschen Curves--Breakdown vs. PressureMFP (cm) = 5x10-3/p (torr)
Plasma Sputtering Energetic ions impact target and dislodge atoms or molecules. These migrate to the substrate where they deposit to form a thin film. Sputtering may be reactive, such as an aluminum target whose sputtered atoms reacting with oxygen in the process gas to form an Al2O3 film.
Plasma Etching Plasma produces chemically active radicals which react with unmasked areas of wafer. This etches away material. e.g. Fluorine radicals and ions etch silicon: C F4 + e- C F3 + F + e- Si + 4F Si F4
Plasma Etching with Mask DC field superimposed on RF helps accelerate F- ions Plasma Mask RF
Amorphous Si Plasma Deposition SiH4 Si + 2 H2
How to Generate RF • Spark generator (obsolete, dirty) • Power oscillator (efficient, cheap, but frequency not well defined) • Oscillator (usu. xtal), driving Power amplifier (present industry standard) • Vacuum tubes • Bipolar transistors • Power FETs
Impedance Matching RF generators conventionally have 50 (resistive) output impedance. Loads can have any complex (and varying) impedance. Matching networks allow the generator always to see a 50 resistive load and therefore operate efficiently.
RF Instrumentation • Current measurement • Voltage measurement • Broadband • Frequency selective • Directional power • Circuit analysis
Important Uses of RF • Food • Construction • Metallurgy • Semiconductors (Discrete, IC, Photovoltaic) • Optics • Health and Medicine • Laboratory science