1 / 12

Report of Technical Vice President Rolf Aschenbrenner

IEEE CPMT BoG, Dallas, Nov. 2004. Report of Technical Vice President Rolf Aschenbrenner. Technical Committees. Currently 18 „active“ Technical Committees TC-Opto Fiber Optics and Photonics New TC Chair: Dr. Sue Law, Australian Photonics /OFTC TC-Assy IC and Package Assembly

truman
Download Presentation

Report of Technical Vice President Rolf Aschenbrenner

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. IEEE CPMT BoG, Dallas, Nov. 2004 Report of Technical Vice President Rolf Aschenbrenner

  2. Technical Committees • Currently 18 „active“ Technical Committees • TC-Opto Fiber Optics and Photonics • New TC Chair: Dr. Sue Law, • Australian Photonics /OFTC • TC-Assy IC and Package Assembly • Vacant

  3. Technical Committees • TC-DIP: Len Schaper is convinced that there is no need • for an own CPMT committee on Discrete and Integral • Passives and would like to step down as a chair • 12 TC web pages are up to date • Little feedback about TC activities after two inquiries • by mail

  4. Annual TC Meetings TC-M Materials ECTC, Las Vegas TC Therm Thermal Management ECTC, Las Vegas, and Thermo-Mechanical Design TC-HDSB High Density Substrates ECTC, Las Vegas, and Boards and Tokyo, August TC-MEMS MEMS and Sensor Packaging ECTC, Las Vegas and DTIP, Montreux

  5. Annual TC Meetings TC-Nano Nano Packaging ECTC, Las Vegas TC-RF+W TC RF and Wireless ECTC, Las Vegas TC-WLP Wafer Level Packaging ECTC, Las Vegas TC-EDMS Electrical Design, Portland, October Modeling and Simulation TC-GEMP Green Electroncis, EGG 2004, Berlin, Sept. Manufacturing and Packaging

  6. Motion In case that a new topic comes up it should not directly be transformed into a technical committee but become a task force for the first three years. If the task force results to be successful a decision should be taken whether the task force becomes a technical committee or not.

  7. Nemi Activities • Mr. Griese from the NEMI Roadmap Committee Environmentally Concious • Electronics presented a 48 paper report about the actual situation of the • activities • Len Schaper from the NEMI Roadmap Committee Passive Components • reported no recent involvement with the NEMI effort due to lacking • funding • Erik Jung from the NEMI Roadmap Committee Packaging reported a first • draft in order to incorporate companies into the NEMI Roadmap

More Related