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IMB-CNM interest in ILC

IMB-CNM interest in ILC. We are a Microelectronics Institute, but with high interest in HEP activities Currently members of SILC Collaboration Foreseen activities: MCM and packaging Strip detectors Special interest in: Detector development Electronic read out chips design

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IMB-CNM interest in ILC

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  1. IMB-CNM interest in ILC • We are a Microelectronics Institute, but with high interest in HEP activities • Currently members of SILC Collaboration • Foreseen activities: • MCM and packaging • Strip detectors • Special interest in: • Detector development • Electronic read out chips design • Advanced packaging solutions • Device simulation • Radiation effects in components and materials

  2. Radiation detectors • Silicon radiation detectors • Design • Simulation • Fabrication • Characterization • Pad, strip and pixel designs • P-in-N, N-in-P and N-in-N technologies developed • Silicon oxigenation to increase radiation hardness • Radiation effects on devices and materials • Thin oxides for submicronic technologies • Silicon radiation detectors • MOS and bipolar devices • Members of RD50 CERN Collaboration • Pad pitch adaptors for detector modules • ATLAS-SCT Forward Modules

  3. X-ray radiation pixel detectors Real time stereotactic biopsy Complete pre-industrial system: Hardware, software, and chip design Aim: Develop a Mammography system EC project DearMama. Industrialization projects (PROFIT, CIDEM, Petri) Test Bench (HW+SW): Readout system for CERN Medipix2 chip Processing Images for medical applications Medical imaging systems

  4. Examples of holes made at CNM Aspect ratio 25:1 Minimum diameter tested 10 µm 3D detectors Edgeless detectors Silicon via holes with ICP RIE

  5. Multichip modules MCM-D technology Standard pitch: 400µm. Screen printing Fine pitch: 50µm. Solder electroplating Fine pitch bump bonding Interest in 3D packaging development Advanced packaging & MCM modules

  6. Circuit design for pixel systems • Example: Read-Out IC for large arrays of photon IR sensors at cryogenic temperatures • 6000 (500×12) QWIPs • true IR video (e.g. 500×640@100fps) • 215mW@3.3V • 77K cryogenic operation • 50mm2 (25mm×2mm) • APS functionality: • TDI, CDS, built-in test, charge multiplexing • 50µm×100µm pix size • 60ns mux time/pix • 6µA consumption/pix

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