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Interconnect Task Group Status Update

Interconnect Task Group Status Update. IBIS Summit at DesignCon Santa Clara, California January 31, 2013. Background. The Interconnect Task Group was suspended in July 2011 after IBIS-ISS work was completed Time slot was used for Editorial TG meetings (IBIS 5.1)

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Interconnect Task Group Status Update

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  1. Interconnect Task GroupStatus Update IBIS Summit at DesignCon Santa Clara, California January 31, 2013

  2. Background • The Interconnect Task Group was suspended in July 2011 after IBIS-ISS work was completed • Time slot was used for Editorial TG meetings (IBIS 5.1) • IBIS 5.1 was released in August 2012 • Interconnect work restarted in September 2012 • Problem: IBIS package modeling insufficient • Per-pin or per-component lumped RLC • Single-section coupled model (no AC losses) • Multi-section distributed single-line model (no AC losses) How to update IBIS to accommodate today’s industry package modeling needs? How to integrate IBIS, IBIS-ISS and Touchstone to cover industry interconnects more broadly? 2013 IBIS Summit at DesignCon

  3. General Needs • Proposals being discussed are intended to address modeling requirements for various interconnect types • Packages • Multi-chip modules • Connectors • Interposers • Sockets • Cables • On-Die interconnect descriptions • Key issues include • Backward compatibility? • Compatibility with other industry group approaches (e.g., Si2)? • Differences between interconnects for traditional IBIS and IBIS-AMI? • Ambiguities in the structure of [Model] exist & affect packaging? 2013 IBIS Summit at DesignCon Thanks to Walter Katz for the type list!

  4. Presentations & Proposals • Documents available on http://www.eda.org/ibis/interconnect_wip/ • Problem description • Background and proposals from Arpad Muranyi, Mentor Graphics • www.eda.org/ibis/interconnect_wip/PackageModeling_NewDirections.pdf • Electronic Module Description (EMD) Specification, Draft 0 • Proposal from Walter Katz, Signal Integrity Software (SiSoft) • www.eda.org/ibis/interconnect_wip/EMD.docx • Several other proposals available showing EMD in specific applications 2013 IBIS Summit at DesignCon

  5. Upcoming Work • Analysis of Si2 specification proposals • Now under 60 day closed comment period • Expected for public disclosure late February • www.si2.org • Resolve (with ATM) nature of [Model] stimulus • This is critical to IBIS-AMI interoperability • The nature of [Model] affects how analog device information is allocated among package, on-die interconnect and buffer sections • EMD and any other proposals can be evaluated once these are complete Your feedback is encouraged! Thanks to our participants and contributors! 2013 IBIS Summit at DesignCon

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