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TE-MPE-EM Design Office

TE-MPE-EM Design Office. William Billereau. Structure. Design, manufacturing and assembly. Design Office. Planning and subcontracting Technological and commercial choices Ordering, collecting components, tracking Invoicing. 2 staff/ 2 FSU. 1 staff / 10 FSU. Repair. MPGD.

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TE-MPE-EM Design Office

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  1. TE-MPE-EMDesign Office William Billereau

  2. Structure Design, manufacturing and assembly Design Office Planning and subcontracting Technological and commercial choices Ordering, collecting components, trackingInvoicing 2 staff/ 2 FSU 1 staff / 10 FSU Repair MPGD Fine-pitch photolithography facility - PCB manufacturing Assembly Workshop Industry 4 Staff 8 staff/ 12 FSU

  3. Design Office Mission Ressources Workload Quality Documents

  4. Mission • Design of products • Standard PCB • 2 to 16 layers, rigid, flex, flex-rigid • Relatedmechanical parts • front panels, boxes • Crates and racks • Readout for MPGD • Design of CAD libraries • Schematicdiagram • Footprints

  5. Resources • 1 team leader (staff) • 8 technicians: the design of standard and special PCB (FSU) • 2 technicians: in CAD libraries (100% FSU since 2010)

  6. Equipment • CAD stations (Cadence, Altium) • AutoCAD • CAD to CAM software (Fabmaster, Aegis)

  7. Workload General situation 25 jobs in progress, 15 in the pipeline Visibility max 2 months

  8. BE/RF - LHC 1 Turn Delay Feedback 230*220mm 2-sided, PTH, BGA, QFN, 0402 1325 components 5500 solder joints

  9. EN/EL IncomerCrate

  10. Quality • Design rules: IPC standard • Layout • Librairies • Crosschecks (librairie and layout) • Internalreviews • Feedback frommanufacturing • EDMS Release system

  11. Documentation PCB manufacturing files (Gerber, drilling) PCB specification Detaileddrawing of all mechanical parts Detaileddrawing of harnesses Assembly documents for PCB (Drawing, BOM) Assembly documents for crates (3D drawing, BOM)

  12. PCB manufacturing files (Gerber, drilling) PCB specification

  13. Detaileddrawing of mechanicalparts

  14. Detaileddrawing of harnesses

  15. Assembly documents for PCB (Drawing, BOM)

  16. Assembly documents for crates (3D drawing, BOM)

  17. Assembly documents for crates (3D drawing, BOM)

  18. EDMS Release system Releasedstatus No more change possible Production allowed Available to subcontractor

  19. Any question?

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