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Status of Stripixel Sensor + SVX4 Test. Junji Tojo RIKEN VTX Meeting June 1 st , 2004. R&D Goals. Evaluation of the detector technology used for the outer barrel strip layers The primary candidate is the stripixel sensor + SVX4 chip. R&D items
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Status of Stripixel Sensor + SVX4 Test Junji Tojo RIKEN VTX Meeting June 1st, 2004
R&D Goals • Evaluation of the detector technology used for the outer barrel strip layers • The primary candidate is the stripixel sensor + SVX4 chip. • R&D items • Measure S/N w/ the v2 prototype sensor (400um/500um) + SVX4 chip. • Study of charge sharing property : principle of single-sided 2-dim sensitivity. • Matching test w/ DC-coupling and AC-coupling (SVX4 is design for AC-coupling sensor).
The Current Detector Setup • The 400um thick v2 prototype sensor • CDF SVX4 hybrid • DC-coupling btw sensor and SVX4 • ORNL SVX4 readout board (PHENIX DAQ mimic) • Laser test bench
Snapshot of DAQ Operation Operation w/ LabVIEW DAQ designed by ORNL DAQ GUI Timing configuration Serial parameter configuration
Status • Towards measurement of S/N w/ the DC-coupled 400um sensor+SVX4 • Laser tests at RIKEN • Laser pulse synchronized with (internal) 10MHz beam clock • External Trigger (L1A) input made from scaled down beam clock • Timing scan (timing btw laser pulse and L1A) • Laser spot focusing (possible up to 10um dia.) • Serial parameter adjustment in SVX4 ← We are here now. • Absolute calibration to obtain S/N • Charge injection to SVX4 and/or a radioactive source
Laser Signals • L1A timing scanned • Adjustable in 30 clocks in SVX4 • Laser focusing • Profile showed sharp peak • There is still a room to improve (up to ~10um dia.) • Laser intensity corresponding to the ADC channels of the signal can be adjustable. To be adjusted to 1 MIP equivalent. • Need to understand the noise. ADC (ch) # SVX4 ch ADC (ch)
Detectors to Be Tested • What we have in our hands • V2 prototype sensor : 3×400um (QAed), 4×500um (not QAed), 2×500um • Eight CDF SVX4 hybrids • Pitch adaptors for DC/AC-coupling and one-dim readout • One ORNL SVX4 readout board • Possible detector configuration • Selection in 400/500um thick, DC/AC-coupling and one/two-dim readout • Note : Pre-production sensors are 500um thickness. • Save SVX4 hybrids to be used for both this R&D and pre-production sensor evaluation • Save the man power in ORNL ROC development • Detectors to be made and tested in minimum requirement • [400um thick sensor, DC-coupling, one-dim readout (the current detector)] • 500um thick sensor, AC-coupling, one-dim readout • 500um thick sensor, DC-coupling, two-dim readout (w/ new pitch adaptor)
Schedule • S/N w/ 400um thick sensor, DC-coupling and one-dim readout by late June. • Two QAed 500um sensors ready around the middle of June. • Wire-bonder will be ready at RIKEN by the end of June. • New pitch adaptor for 2-dim readout will be ready in early July. • Fabrication of 500um thick sensor, AC-coupling and one-dim readout and measurement of S/N from early July to the middle of July. • Fabrication of 500um thick sensor, DC-coupling and two-dim readout and measurement of S/N from the middle of July to the end of July.
Stripixel Sensor + SVX4 Chip Test The slide shown at the Upgrade DC Meeting on March 10th. • Goals • Show enough S/N (>10) with stripixel sensor + SVX4 chip. • Tests • DC-coupling scheme as the 1st step. If fails, AC-coupling scheme will be tested. • DC-coupling test by resetting SVX4 during RHIC abort gap. • AC-coupling test by decoupling sensor with SVX4. Cu/PI flex on SMD (R&C) will be used. • AC-coupling test by decoupling sensor with SVX4. “RC chip” will be used. • Stripixel sensor v2 • 400μm thick sensor : 4 sensors were fabricated. 2 sensors are available and 2 sensors are before QA and laser-dicing. • 500μm thick sensor : 4 sensors are under processing and will be fabricated by the end of March. • SVX4 hybrid • CDF SVX4 4-chip hybrid is used. • One hybrid in RIKEN : Used for DC-coupling test. • One hybrid in ORNL : Used for SVX4 readout board development. • Eight hybrids for R&D : Used for AC-coupling & 2D readout tests. Under nego. with FNAL. • Detector • Gluing & Wire-bonding for DC-coupling detector at a company (Hara-Seiki in Japan). • Completed. • SVX4 readout board • Readout of CDF SVX4 4-chip hybrid w/ PHENIX DAQ mimic • Used for Sensor+SVX4 tests. • Sent to RIKEN soon. Response received from FNAL (Ed&Yasuyuki). Under testing at RIKEN. Arrived at RIKEN from Vince on March 15th.