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ITRS 2008 ITWG Spring Meeting April 2-4 Petersburg, Germany FEP TWG Report

ITRS 2008 ITWG Spring Meeting April 2-4 Petersburg, Germany FEP TWG Report. FEP ITWG Spring 2008 Participants. Reported New TWG member FeRAM Masayoshi Horii. ITRS 2008 ITWG Spring Meeting FEP ITWG. FEP Plans for 2008 Change Effective Gate Length

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ITRS 2008 ITWG Spring Meeting April 2-4 Petersburg, Germany FEP TWG Report

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  1. ITRS 2008 ITWG Spring MeetingApril 2-4Petersburg, GermanyFEP TWG Report

  2. FEP ITWG Spring 2008 Participants • Reported New TWG member • FeRAM • Masayoshi Horii

  3. ITRS 2008 ITWG Spring MeetingFEP ITWG • FEP Plans for 2008 • Change Effective Gate Length • I think Alan said “Yes, change the gate length in 2008, push back if it is too difficult” • FEP will change all tables where the Gate Length dependence is first order

  4. Spring 2008 FEP Round Table and Cross-TWG Discussion Notes • Gate Length Based Modifications • Printed/Etched Ratio – need to agree with Litho • On-chip Frequency – Transistor and Design model – need alignment from PIDS, FEP and Design • New Drivers: Ion/W and CV/I – needs PIDs and FEP 2008 update and provide to ORTC - - FEP will be able to accommodate whichever driver PIDS and Design accept • Flash/PCM plans for 2008 • update table entries based on PIDS survey results, refine projection for “end of floating gate flash” • add table to focus on charge trapping devices – Is this possible in the update? • update PCM tables • UTBSOI • What is reason for color code – 2011: 14-17 yellow, 2012 14-16 red – transmit to Starting Materials

  5. Spring 2008 Round Table Notes • Edge Exclusion • Agreed with Factory Integration to change to 2mm throughout table, due to Clamp/Edge rolloff – transmit to Starting Materials • 450MM wafer • Considering ROI – 2012 seems unrealistic – Push back –Transmit to Starting materials • Is there a market growth analysis that justifies this aggressive timing? • Contact Maximum Resistivity • Data from MRS, IEDM shows that 1E-8 can be done – reconsider coloration. Transmit to Thermal Thin Films • Discussion with Interconnect – need to understand components and make sure lines are coordinated

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