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ITRS - YE ITWG Meeting in Maastricht April 6-7, 2006

ITRS - YE ITWG Meeting in Maastricht April 6-7, 2006. Lothar Pfitzner, ++49 9131 761 110, lothar.pfitzner@iisb.fraunhofer.de Andreas Nutsch, ++49 9131 761 115, andreas.nutsch@iisb.fraunhofer.de. Maastricht 2006 YE ITWG Meeting Participants. 12 Participants (Europe, Japan, USA)

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ITRS - YE ITWG Meeting in Maastricht April 6-7, 2006

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  1. ITRS - YE ITWG Meeting in Maastricht April 6-7, 2006 Lothar Pfitzner, ++49 9131 761 110, lothar.pfitzner@iisb.fraunhofer.de Andreas Nutsch, ++49 9131 761 115, andreas.nutsch@iisb.fraunhofer.de

  2. Maastricht 2006 YE ITWG Meeting Participants • 12 Participants (Europe, Japan, USA) • Lothar Pfitzner (Fraunhofer IISB) • Ines Thurner (Infineon) • Dilip Patel (ISMI) • Sumio Kuwabara (NEC) • Andreas Nutsch (Fraunhofer IISB) • Andreas Neuber (MW Zander) • Dieter Rathei (D R Yield) • Dirk de Vries (Philips) • Chris Muller (Purafil) • Francois Finck (ST) • Allyson Hartzell (Exponent) • Dave Roberts (Air Products)

  3. YE TWG • Topics • DDC: update the tables • DDC: remark that metrology tools need to be available for technology development 18 to 24 months before each technology generation ius actually introduced • YMDB: Defect budget survey will be done in Japan, the data will be supplied to ITRS, if other regions participate • YMDB: The defect size distribution will be kept on scaling with 1/x³. Remark: it might be possible for smaller defect size the defect numbers might increase significantly stronger, because effects e.g. nucleation are expected

  4. Cross TWG • Cross TWG • Lithography • ESH • FEP • Interconnect • Factory Integration • Test • Topics • Lithography: For immersion lithography: Is there a need for a new method for defect inspection? Is a specific defect specification required? – Answer: no additional specs. Follow up: exchange on information on sensitivity etc. (requirements on defect detection) • FEP: Yield model in ITRS: requires input from Fabs  requires further discussion • FEP: Defect budgets: still no new survey available • TEST: Common coordinate system neccessary

  5. Cross TWG • Cross TWGs of WECC • Litho: Further improve definition of interfaces and parameters • Factory integration (FI): Further clarification of interfaces • Front end processing (FEP): Follow-up on AMC and CVD/ALD precursor specifications • Assembly and Packaging: Second contact with regard to new requirements • ESH: Yield modelling for impact analysis will be difficult due to potential reliability issues, further coordination on CVD/ALD precursor material screening and yield impact analysis of recycling

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