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Pixel nSQP Update ER Bundle transmission qualification tests

Pixel nSQP Update ER Bundle transmission qualification tests. Presented by David Nelson djn@slac.stanford.edu. nSQP Bundle Test. nSQP Bundle Test. TERMINATION BOARD. PP0 Board. PIGTAILS. INTERFACE BOARD. HSIO. ER CABLE. Single Bundle Test. CK7-NO SHIELD. CK7- SHIELD.

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Pixel nSQP Update ER Bundle transmission qualification tests

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  1. Pixel nSQPUpdate ER Bundle transmission qualification tests Presented by David Nelson djn@slac.stanford.edu

  2. nSQP Bundle Test

  3. nSQP Bundle Test TERMINATION BOARD PP0 Board PIGTAILS INTERFACE BOARD HSIO ER CABLE

  4. Single Bundle Test CK7-NO SHIELD CK7- SHIELD DCI7- SHIELD DCI7-NO SHIELD DT07-SHIELD DT07-NO SHIELD

  5. Bundle test status • HSIO Bundle test board fabricated and partially loaded. • Need to load 10 each 16 channel LVDS driver chips • Need to wire bond more VDCs • Need to load DORIC and VDC chips • E-board termination fabricated and loaded • PP0 board is loaded • Pigtail cables are available • Need one E-board from CERN • Need five ER wire bundles from CERN • Need firmware for test. • Martin Kocian will modify existing firmware used on the IBL wire bundle tests. • UCF file is ready

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