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Pixel nSQP E-board

Pixel nSQP E-board. Presented by David Nelson djn@slac.stanford.edu. Status. Arrangement of wires on board Determined during board layout. Bundle organization/wire gauges Base line is 28 CCAL for data & 36 Cu for Cmd&Clk Hopefully can migrate to 34AWG for all signals

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Pixel nSQP E-board

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  1. Pixel nSQPE-board Presented by David Nelson djn@slac.stanford.edu

  2. Status • Arrangement of wires on board • Determined during board layout. • Bundle organization/wire gauges • Base line is 28 CCAL for data & 36 Cu for Cmd&Clk • Hopefully can migrate to 34AWG for all signals • More studies needed on wire selection • PP1 penetration and connector to opto-boards • No progress – need help from opto-chassis folks

  3. Layout of current opto-board Mounting holes 80 pin connector VDCs & DORICs

  4. E-board • Wire bond LVDS chips • 8 chips on connector side Wire surface mount interface 8 LVDS buffers

  5. LVDS Chip wire bond diagram • Received 12 LVDS die LVDS die

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