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MuTr Shielding & Grounding. Preliminary 10/6/99 (G. Hart) Additions 1/4/01 (REM). Table of Contents. 1. Title 2. Table of Contents 3. Table of Contents (cont) 4. System Diagram 5. Chassis 6. Digital section 7. Calibration 8. Glink/Clink 9. Definitions
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MuTr Shielding & Grounding Preliminary 10/6/99 (G. Hart) Additions 1/4/01 (REM)
Table of Contents 1. Title 2. Table of Contents 3. Table of Contents (cont) 4. System Diagram 5. Chassis 6. Digital section 7. Calibration 8. Glink/Clink 9. Definitions 10. Signal Paths 11. LeCroy HV ground 12. HV Dist. Card Schematic 13. HV Dist. Card Assembly 14. HV Dist. Box Assy 15. HV Cable plug assy 16. HV Cable assy 17. LVHP Schematic 18. LV Dist. Schematic 19. FEE Power Schematic 20. Cable, LVHP - LVD 21. Cable, LVD - FEE 22. Cable, FEE Pigtail 23. FEE Card Layers 24. Cable, FEE Signals 25. Belden 12 AWG Cable 26. Cathode PCB Schematic 27. Anode PCB Schematic 28. Cathode PCB Comp Side 29. Cathode PCB Pad side
Table of Contents (cont) 30. Anode PCB Comp Side 31. Anode PCB, Pad side 32. St. 2 Cathode End View 33. FG Jumper assy 34. St. 2 Cathode Side View 35. St. 2 Anode Side View 36. Cathode Card Side View 37. ARCnet receiver 38. MAX1480 39.
Digital section LV + from preamp AMUADC FPGA LV - ARCnet +5 V 0 V DCM GTM
Distributed grounds for octant (Stn 2) calib 15 chassis 12 HV 15 chassis ARCnet 15 chassis G/C 15 12 chassis 5 LV 8
Distributed grounds for Station 2 LV calib chamber/CRA G/C … 8 times HV ARCnet
definitions Definitions: Frame Ground - refers to the chamber metal frames, cable shields, external ground planes of printed wiring boards (PCBs), crates and racks. Possible points (to be investigated) where this may be connected to BNL earth ground are the magnet frame, the Low Voltage High Power (LVHP) crate, and the racks containing the LV & HV power supplies, and the LeCroy high voltage power supply. SIGR-HV - derived from the chamber card “SIGnal Return - High Voltage”, this is the ground side of the chamber signals, and low and high voltage power.
High Voltage Distribution Box Schematic (This is an insulated box located on the chamber support structure)
FEE Printed Wiring Cards layer structure Cathode Readout Card (CROC) Layers Control Card Layers Backplane Layers
Signal Cable: Chamber PCB to FEE Backplane Signal Cable: Chamber PCB to FEE Backplane Schematic & Assy Drawing of Signal Cable
Cathode Chamber Card (Typical), cathode pad side Note square pads to lower left of connectors, these are for the connections to the frame.
Anode Chamber Card (Typical), component side Ne square pads to lower left of connectors, these are for the connections to the frame.
Anode Chamber Card (Typical), anode pad side Note square pads below connectors, these are for the connections to the frame.