2003 ITRS Factory Integration Chapter Factory Operations Backup Section

1. 2003 ITRS Factory Integration Chapter Factory Operations Backup Section Details and Assumptions for Technology Requirements and Potential Solutions ITRS Factory Integration TWG

2. Factory Operations Backup Outline • Scope of the Section • Contributors • How Metrics were Selected • SEMATECH and ITRS Metrics Alignment • X-Factor Details • High Mix Potential Solutions • Other Potential Solutions • Factory Operations Research Center (FORCe) • Suggested University and Industry Research for 2004+ ITRS Factory Integration TWG

3. Don Martin (IBM) Mani Janakiram (Intel) Martin Haller (Infineon) John Fowler (ASU) Donald Hicks (UT-Dallas) Mike Schwartz (ISMT) Shantha Mohan (Consultant) Raja Sunkara (National) Eric Christensen (AMD) John Plummer (Consultant) Abol Taghizadeh (Tefen) Hiromi Yajima (Toshiba) Ashwin Ghatalia (Phillips) Dev Pillai (Intel) Arieh Greenberg (Infineon) Arnie Steinman (ION Systems) Court Skinner (Consultant) Eric Englhardt (AMAT) Shige Kobayashi (Renesas) Jeff Pettinato (Intel) Junji Iwasaki (Renesas) Michio Honma (NEC Electronics) Contributors to Factory Operations ITRS Factory Integration TWG

4. How Metrics were selected • Almost every metric is a best in class or close to best in class • Sources are: Rob Leachman’s published 200mm benchmarking data, Individual IC maker feedback, and I300I Factory Guidelines for 300mm tool productivity • It is likely a factory will not achieve all the metrics outlined in the roadmap concurrently • Individual business models will dictate which metric is more important than others • It is likely certain metrics may be sacrificed (periodically) for attaining other metrics (Example: OEE/Utilization versus Cycle time) • The Factory Integration metrics are not as tightly tied to technology nodes as in other chapters such as Lithography • However, nodes offer convenient interception points to bring in new capability, tools, software and other operational potential solutions • Inclusion of each metric is dependent on consensus agreement We think the metrics provide a good summary of stretch goals for most companies in today’s challenging environment. ITRS Factory Integration TWG

5. Manufacturing Strategy Evolution Speed and environment center-minded Throughput center-minded Specific Tech. Level TR (Eq., AMHS, FICS) Effort Effort Specific Tech. Potential Solution (Eq., AMHS, FICS) Factory Operation Requirement Enterprise Level Requirement Current values Next generation Values Wider coverage needed

6. International SEMATECH Metrics Alignment Rev 1 09/06/03

7. ITRS/ISMT Metrics Alignment Objective & Status • Align 300mm metrics definitions that are collected for ISMT with those for the ITRS for consistency • Status: Done and Agreed for 37 metrics by ISMT. ITRS sync on production equipment in progress. Expect to complete the alignment by the end of the 2003 ITRS roadmap year in September • Long term objective (2004+) is to develop a process where best in class metrics can be collected globally by SIA or an independent equivalent and used for ITRS synchronization • Industry Best in Class (BIC) Data sharing proposal will not occur in 2003 and will be contingent on number of global 300mm Fabs for 2004 • JEITA (Japan) is ok with the concept, however, since there is only 1 300mm Fab (Renesas/Trecenti), all of their values will be lined to that fab. Timing is key for them • Taiwan TSIA has agreed to discuss, but FtF has been pushed to August due to SARS • Need to close on SIA willingness to manage cross regional data – AR for Jeff to close by September FtF

8. 300mm Metrics Sync Agreement with ITRSSummary of Approvals from MMC/PAG/Council FtF Meetings • ISMT has agreed to definitions for 36 combined operations, production equipment and AMHS metrics (see slide xx for summary) • ISMT will use three process technology nodes for 300mm Fabs: • 1) >130nm, 2) =130nm and 3) < 130nm • ITRS defines current node as 90nm and this will be the focus for future BIC calculations • Use minimum printed image on a process recipe to define technology nodes • Example: Use minimum printed image on Poly, Contacts or Isolation (DRAM) layers • ITRS defines 130nm node as having 24 layers • Please direct any questions or comments to • Mike Schwartz -> (512) 356-3926; mike.schwartz@sematech.org • Jeff Pettinato -> (480) 554-4077; jeffrey.s.pettinato@intel.com

9. ISMT and ITRS Metrics Synchronization

10. Production Lot Cycle Time • Average Cycle Time Per Layer for all Production Lots • Average duration, expressed in fractional working days, consumed only by production lots of wafers from time of release into the fab until time of exit from the fab: Exit includes final parametric test and wafer processes after final parametric test up to die probe/sort, divided by the number of photo wafer layers in the process flow. • Notes: • Note capacity loading percentage on data entry template • Weighted average by volume • Number of photo layers is a volume weighted average

11. Hot Lot Cycle Time • Average Cycle Time Per Layer for Hot Lots • Average duration, expressed in fractional working days, consumed only by fastest class of full flow priority lots of wafers from time of release into the fab until time of exit from the fab: Exit includes final parametric test and wafer processes after final parametric test up to die probe/sort, divided by the number of photo wafer layers in the process flow. • Notes: • Hot Lot = Top 5% of lots in the Fab from a priority perspective • Note capacity loading percentage on data entry template • Weighted average by volume • Number of photo layers is a volume weighted average • Does not include partial flow lots (i.e. wafers released from mid-flow wafer banks or engineering experiments)

12. Direct H/C Productivity (Aligns / Day) • Photo Alignments Completed Per Non-exempt Hour • Total number of photo alignments completed, divided by hours worked by: • Operators (ALL operators in wafer fab including final parametric test) • Maintenance Techs (internal/external) • Process Technicians • Sustaining Supplier Technicians ( including on call) • Notes: • Include temporary/contract employees • Rework not included • Include production wafers, engineering wafers (optional), but no monitor wafers

13. Indirect H/C Productivity (Aligns / Day) • Photo Alignments Completed Per Total Exempt Headcount Per Day • Total number of photo alignments completed, divided by total exempt fab headcount. Total exempt headcount includes all personnel and only personnel from the following groups: • Operations Managers/Supervisors • Process Engineers/Managers • Equipment Engineers/Managers • Dedicated Engineering Support from Equipment Suppliers • Notes: • Do not include Probe Test,Yield analysis, CIM/IS, development, production control etc.) • Rework not included • Include production wafers, engineering wafers – (optional) • No monitor wafers • Exempt H/C should include central or support group personnel working in the factory for the areas listed above

14. Floor Space Effectiveness • Floor Space Effectiveness Weighted average number of mask layers x WSPM Floor space area • Includes the following items: • Traditional clean room areas (bay/chase, ballroom areas, and other clean areas) • Additional areas where equipment is installed including clean tool interface areas and non-clean space for the physical tool footprint (including associated maintenance spaces) • Does not include the following items: • Sub-fab areas where equipment is not installed • Notes: • WSPM = actual production starts per month- not FAB capacity • Proposed as a yearly benchmark

15. # non-revenue generating wafers started Total number of wafers started A. Non Product Wafer Starts Usage • Overall factory non-product wafer starts usage • Notes: • Non-Revenue wafers include controls, monitor, and engineering wafers not sold • Do not count new technology development node wafers (e.g. 90nm or 65nm TD) processed in either numerator or denominator

16. # non-revenue wafers processed through equipment Total number of wafers processed through equipment B. Non Product Wafer Activity Usage • Overall factory non-product wafer activity usage • Notes: • Non-Revenue wafers include controls, monitor, and engineering wafers not sold • Do not count new technology development node wafers (e.g. 90nm or 65nm TD) processed in either numerator or denominator

17. Process Equipment Availability • Availability defined as 100% - (scheduled + unscheduled downtime) as per SEMI E10 • Calculate as a yearly benchmark for following tools: • 193nm Scanner • 248nm Scanner • Damascene ILD etch • Cu CMP • Cu Plating • Cu barrier/seed • Intermetal level dielectric (CVD) • Notes: • Measure availability for cluster tools at the chamber level • How to calculate chamber aggregate level?

18. Process Equipment Utilization • Utilization defined as Operational Efficiency as per SEMI E10, which is defined as • (Production Time) / (Available Time) • Calculate as a yearly benchmark for following tools: • 193nm Scanner • 248nm Scanner • Damascene ILD etch • Cu CMP • Cu Plating • Cu barrier/seed • Intermetal level dielectric (CVD) • Notes: • Measure utilization for cluster tools at the chamber level • How to calculate chamber aggregate level?

19. Probe/Sort or Die Testing Parametric Yield A B C Yield Metric Definitions Final Parametric Test Ship Fabrication Finished wafer • Scribe Line Test or Test Chip Testing • Does wafer meet specs? Wafer Start • Chip Function Test • Does each chip • meet specs? Line Yield Wafers out of Tester Wafers into Tester Wafers out of Tester Wafers into Tester LY20 = LY (20/ML) Wafer Fab Accumulated Yield= A X B Total Accumulated Yield = A X B X C Yld_Met_Def.ppt/MSCHWARTZ/11-13-00

20. X-Factor Background & Definitions Rev 1 09/06/03

32. ITRS Factory IntegrationIntegrated Potential Solutions for High Mix Production Discussed at 12 July 2003 FtF Meeting at SEMICON West

33. Definition of High Mix Production • 2001 Definition in Factory Operations: • High mix is at least 5 large volume products (product flows) with no one product has >50% of production volume • Extended 2003 Definition: • Running > 3 technology generation concurrently in the same Fab • Running > 10 process flows within the same technology generation • Running > 50 products concurrently through the manufacturing line • Many of small lots of 1 to 10 wafers in size • Running an average of < 50 wafers between Reticle changes for each litho expose equipment • At 5000 wafers out per week per scanner, you will have a minimum of 100 reticle changes per week!! • Lot starts are based on customer orders. There is a daily variation in the number of lots you start with different products and process flows • This drives a large inventory of masks • High mix is at least 5 large volume products (product flows) with no one product has >50% of production volume

34. High Mix Production Business Drivers and Implications • Customers want new and volume products delivered quickly • Manufacturers need to have low wafer cost and do not want to sacrifice factory efficiency to achieve speed • Low volumes do not allow enough information turns to optimize product yields, resulting in lower yields and more wafers • Highly specialized parts often result [risk here?] in manufacturing inventory scrap due to customer cancellations or design changes • Customer may order 100 wafers for delivery over 6 months, but may cancel or change the order at any time resulting in scrap • There are large non-reoccurring engineering and non-consumable costs [reticles] associated with multiple product • Process to product integration, new reticles, new test vehicles, engineering time • Complicated manufacturing staging and scheduling of products through the line driven by varying product mix and volumes • Ex: Running standard ASIC design through transistor level and then staging these parts until final order is made before finishing interconnect and integration • Large number of smaller lots driving higher demand and rate of transaction for AMHS storage, AMHS transportation, and MES [metrology, facilities…]

35. High Mix Factory‘s Requirement and Implication Image Products High End to Low End Abundant Products S/W (Follow-Up) Visualization Tech&Quality Speed Small High Mix Factory Customers Businesses Time Capricious Orders Cost Stable Profit&Vision Total Optimization Full Utilized Flexibility H/W(Monitoring) Metrics (Driver) Agile Systems Production Resources

36. Current Metrics Driving High Mix Production • Hot and Normal Lot Cycle Time [Customer] • Reticle Cycle Time [Customer] • U/A Efficiency without sacrificing Throughput Time. TPT [Cost] • High Mix Capacity Degradation [Cost] • Efficiently processing multiple lots per carrier [Flexibility -> Cost] • Node to Node change-over [Flexibility -> Cost] • Average # of wafers between reticle changes [Flexibility -> Cost] • % of AMHS Tool to Tool Direct Transport Moves [Customer] • AMHS Delivery Time [Customer] • New NPW’s used and NPW Transactions [Cost] Metrics Not Captured In Today’s Roadmap Version • On Time Product Delivery to the Customer [Customer] • Cost of Wafer Starts per Square Meter [Cost] • Direct Wafer Cost Targets [Cost] - Anti-Trust Issues • [How are we tracking quality] – No line yield, die yield numbers…

37. Factors to Mitigate High Mix Issues • Use of Field Programmability vs. ASIC • Reduces the amount of separate and distinct products that are required by leveraging programmable vs. hard coded logic • Use of System in a Package (SIP) vs. System on a Chip (SOC) to reduce cycle time, improve yield, lower cost • Customer may not get exactly what they want with SIP since this implies use of standard parts in the package and possible performance loss, but they will get lower cost and cycle times…

38. High Mix Areas that Must be Worked • Layout optimization for speed is encumbered by differences required for each different process flow • Increasing complexity of process specific support system directly related to the number of process technology generations and potentially products • The explosion in the number of transactions due to product mix and volume demands will exceed vehicle based bandwidth capabilities

39. High Mix Production Potential Solutions (1)

40. High Mix Production Potential Solutions (2)

41. High Mix Production Potential Solutions (3)

42. Anatomy of a High Mix 300mm FabIndustry Standards + CurrentandFutureCapabilities • Data standards and Systems for Rapid Mask Set Creation • Use of Scheduling & Dispatching Pervasive FDC Implemented to get 100% LY Wafer Data Standard For Packaging 100% Intrabay and Carrier ID Equipment Designed for Rapid Set-up changes for New Lots • Conveyor Systems • Direct Transport OHV Process & Control Job Standards To support High Mix Job Processing (SEMI E40, E90, E94) • 100% full content recipe downloads • 100% recipe storage and tracking Full Content Recipe and Parameter Downloads to equipment for 100% LY Manufacturing Execution Systems Equipment Engineering Capabilities (EEC) Equipment Control Systems Rapid Process Matching APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Equipment Data Acquisition (EDA) to support FDC and APC needs Integrate planning, schedule & dispatch systems with floor execution Execution Control Systems that Support Direct Transport AMHS RosettaNet B2B standards for rapid connectivity Partner, Customer Or Supplier

43. Other Potential Solutions

44. Cycle Time/Operational Flexibility: Multiple lots per carrier and/or fewer wafers per carrier. Get new products to customer much faster. Cycle Time Reduction & Operational flexibility Output per tool must increase: Find breakthrough solutions that result in significant increases in good wafer out and increased OEE (eg: APC, e-Diag) More good wafers out per tool The 300mm factory is much more automated and must be designed to transport hot-lots and hand-carry’s. Highly automated factory Reduce time to $$$/Cycle-time reduction: What are stretch goals for cycle time from ground-breaking to first full loop wafer out. How to achieve quicker shrink? Reduce Time to Money Increased floor space effectiveness: Don’t want each new generation to drive big increase in cleanroom size, esp. since fab is segregated Cu/non-Cu and new metal layers added at each node. Factory size is becoming an issue What’s driving the Requirements Table for Factory Operations?

45. Translating Factory Operations metrics to Reality

46. OHV Integrated FICS to Improve Equipment Performance • GOAL: No Equipment Idle Time (“starvation”) if Material is available • Improves output (w/ priority on “super hot lot”) through more effective equipment utilization • Requires integrated equipment, scheduling/dispatching, AMHS, and factory operations, PM 1a. Load port event signals carrier leaving OR 1b. Equipment event indicates that processing is nearly finished • PM schedule checked to verify no PM is due • Dispatcher selects highest priority lot for processing • AMHS routes carrier to process equipment • Next lot delivered to equipment before it starves  OHV UI UI Process Chamber a Stocker Process Equipment b Processing nearly complete  SECS/GEM   Equipment Controllers Scheduling & Dispatching System AMHS Control System Equipment Tracking System Information Bus

47. Predictive PM to Improve Equipment Performance • GOAL: Predict future PM time to have technician/consumables ready. Intelligently determine when to run PM based on lot priority & tool/downstream impact. • Improve equip perf by optimizing Preventative Maintenance (PM) timing and avoiding unscheduled or last minute scheduled down time • Requires integrated equipment, scheduling/dispatching, AMHS, and factory operations 1. Equipment data indicates need for future Preventative Maintenance (PM) • Scheduler determines when to PM the equipment • PM is automatically scheduled in Equipment Tracking system • Prior to PM time, Scheduler validates need (based on lot priority, tool impact, downstream impact) • Technicians notified via page that specific PM is required • Equipment finishes processing and is taken offline for PM OHV  UI Process Chamber Process Equipment   Equipment data    Equipment Controllers Scheduling & Dispatching System Equipment Tracking System Paging System Information Bus

48. Factory Operations Research Center (FORCe) Rev 1 09/06/03

49. FORCe Background and Deliverables Background/History: • FORCe is a program integrating the efforts of International Sematech (ISMT) and Semiconductor Research Corporation (SRC) factory systems into a unified strategy for factory science research. • Member companies (MC) set the priorities for research efforts and determine how/where the ~$800K/yr for 3 years (2001-2003) should be utilized. • International Technology Roadmap for Semiconductors (ITRS) provided overall direction for prioritization. Focus is on Fab productivity improvement Deliverables to Member Companies: • Tools (S/W, Algorithms, Methods) • Qualified students for MC hire (MS/PhD) (50+ students) • Research results for MC implementation/adoption

50. Member company prioritized focus areas (2000) • Scheduling policies, and wafer release rules * • Fab cycle time reduction techniques, modeling cycle time reduction methods * • Factory labor modeling methods • Statistical operational control of cycle time and equipment utilization * • Intelligent preventive maintenance techniques * • Demand planning/modeling * • Goal driven modeling methods * • Financial/cost attributes in modeling * Focus areas addressed by FORCe projects