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Half-stave assembly

Half-stave assembly. Gluing procedure & glue characteristics Status of dummy components. Half-stave a ssembly. Carrier Bus. Gluing A. Extender Bus. Grounding Foil. Ladder 2. MCM+ optical fiber. Gluing B. Ladder 1. Carbon fiber sector. Gluing C.

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Half-stave assembly

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  1. Half-stave assembly Gluing procedure & glue characteristics Status of dummy components V. Manzari for Bari SPD-Group

  2. Half-stave assembly Carrier Bus Gluing A Extender Bus Grounding Foil Ladder 2 MCM+ optical fiber Gluing B Ladder 1 Carbon fiber sector Gluing C - Schematic view of half-stave components and assembling - Draft version of a Glue Requirement Document ready V. Manzari for Bari SPD-Group

  3. Gluing AMCM and Ladders to Carrier-bus Carrier Bus Ladder 2 Extender Bus Gluing A: glue characteristics Ladder 1 • Electrical insulating • Thermal conductive • Removable ? MCM+ optical fiber • Proper gluing underneath wire bonding pads and module planarity • Elasticity modulus to reduce mechanical stress • No Pressure required for gluing • Max cure temperature <100°C • Thickness <100 µm V. Manzari for Bari SPD-Group

  4. MCM Ladder 2 Ladder 1 Gluing A Assembly procedure Step 2-A1 glue deposition layer Step 1-Alignment Step 3- Carrier-bus + A support alignment and contact Multilayer Carrier-bus + A support V. Manzari for Bari SPD-Group

  5. Step 5- Extender alignment and contact Supporto B Extender (LV & Bias) Multilayer Carrier bus Multilayer Carrier bus Optical fiber Extender (LV & Bias) Extender (LV & Bias) Step 6- B support clumping Ladder1 Ladder2 MCM Step 4- A support separation and A2 glue layer deposition V. Manzari for Bari SPD-Group

  6. Currier Bus Extender Bus Ladder 2 Grounding Foil MCM + optical fiber Ladder 1 Gluing BAssembly A to Grounding-foil • Electrical conductive • Thermal conductive • Removable ? • Proper gluing on whole interface and good planarity Glue B characteristics: • Elasticity modulus to reduce mechanical stress • Thickness, temperature step and required pressure as gluing A V. Manzari for Bari SPD-Group

  7. Gluing BAssembly A to Grounding-foil • Good glue control to avoid FE chip wet (bumps and pads) • possible solution (under-filling, mechanical protection …..) • Grounding-foil equipped with sensor temperature ? (1 for FE chip) To be studied V. Manzari for Bari SPD-Group

  8. Gluing CHalf-stave to Sector Glue A characteristics: • Electrical insulating • Thermal conductive • Extremely smooth for a good thermal coupling • Good gluing rigidity for a good clamping between the half-stave and carbon fiber sector • Necessary removable for reworking Padova competence V. Manzari for Bari SPD-Group

  9. Glue Overview V. Manzari for Bari SPD-Group

  10. Thermoplastic filmsCookson (Staystic) V. Manzari for Bari SPD-Group

  11. Dummies production statusfor glue test several glass samples 150 and 300 μm thick silicon sensor ladders 300 μm thick + FE chips 750 μm thick • Ladders • MCM ? • Carrier bus • Extender Bus • Grounding foil multilayer Al foils ordered AP 9121 ( kapton foil 50 μm thick with a copper layer on each side 35 μm thick) To be defined V. Manzari for Bari SPD-Group

  12. Glass dummies production for glue studies V. Manzari for Bari SPD-Group

  13. Glass dummies production for gluestudies Diamond saw V. Manzari for Bari SPD-Group

  14. Micrometric measurement system Mitutoyo Apex 9166 (Fully dedicated to ALICE- SPD activities) Suitable to be equipped with a Vision Probe device for no-contact measurements in all 3 axis. V. Manzari for Bari SPD-Group

  15. What next? • Define the missing dummies • Bump-bonded ladders • MCM • Grounding foil • Contact glue producer • Available glues: • Araldite 2011, Thermalbond, NEE001……. • Next: thermoplastic adhesive films and paste • Start a campaign of tests with dummies and different glues V. Manzari for Bari SPD-Group

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