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WP4 Face to face meeting Stave Core Assembly Status New Thicker Stave

WP4 Face to face meeting Stave Core Assembly Status New Thicker Stave. PS Liverpool 11 th July 2013. Thicker stave to Accommodate Electrical Break. E lectrical break is between the skins in the core Larger hole in the end closeout to accommodate the 3.5mm dia Ti cap

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WP4 Face to face meeting Stave Core Assembly Status New Thicker Stave

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  1. WP4 Face to face meetingStave Core Assembly StatusNew Thicker Stave PS Liverpool 11th July 2013

  2. Thicker stave to Accommodate Electrical Break • Electrical break is between the skins in the core • Larger hole in the end closeout to accommodate the 3.5mm dia Ti cap • Shorter Allcomp cooling strip

  3. Stave Dimensions – Top viewNot Changed Critical Dimensions: • Overall Length 1277 • Width 120 (likely to change, hopefully narrower, due to modifications with hybrid) – See Ashleys talk • SMC area 100 x 50 • EOS at Z=0 to Silicon Edge 0.1mm • Start of Silicon from Z=1277.2 = 3.36 • Module to Module Gap 0.46mm • Pitch of Modules 98mm

  4. Stave thicknessesHas Changed • Inner Core 5.4mm was 3mm- is 0.2mm the right amount of clearance? • Wirebond to Wirebond 10.28mm was 7.88mm • ASIC to ASIC 8.58mm was 6.18mm

  5. EoS Area • SMC card incorporated the general idea of flex sandwiched between 2 FR4 pcb’s. Thickness? • SMC Size 98 x 30 • Interlink isn't right. • Opto height and chips seems to be about right.

  6. Z=0 Closeouts • Closeouts increased in thickness. • Z=0 ‘overlap’ remains the same.

  7. Discussion • Stave Width (Ash) • Preliminary layout studies from Ashley • Estimate of required widths on I/O and POWER sides • What is the impact of the emerging “Tape Design Rules” ? • What extra constraints would the ‘stereo tape’ add ? • Philosophical Discussion • Do we want / need / would like modules to be symmetrically mounted on stave core (i.e. extra stave width is shared equally on both sides of the silicon) ?

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