1 / 5

IB module assembly

IB module assembly. A. Di Mauro (CERN) WP6 meeting 3 0.01.2014. Requirements. Chip position accuracy ~ 5 m m Time ~ 2-3 h/HIC Minimum material budget Full repeatability/reliability “ Reworkability ” (as much as possible). IB module assembly steps.

saleema-soroush
Download Presentation

IB module assembly

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. IB module assembly A. Di Mauro (CERN) WP6 meeting 30.01.2014

  2. Requirements • Chip position accuracy ~ 5 mm • Time ~ 2-3 h/HIC • Minimum material budget • Full repeatability/reliability • “Reworkability” (as much as possible)

  3. IB module assembly steps • Placement of chips on vacuum table and position check • Placement of flex on vacuum table and alignment • Placement of soldering grid on flex and alignment • SnAg soldering balls deposition and check • Soldering of one chip and check • Repeat steps 4 and 5 for all chips • Final check of chips position Comments related to use of artificial vision based automated system: • Steps 1-3: positioning/alignment done at the same time by a.v. • Step 4: soldering balls presence checked by a.v., possibility to intervene at level of single hole • Step 5: quality of each soldering checked by a.v. and pyrometer feedback (combination to be developed)

  4. Automated HIC assembly system from VEA Cycle time estimation • A) Worst case scenarios: • 9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x10) = 8388” = ~ 2 h 20’ • 2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x10) = 13039” = ~ 3 h 38’ • B) Normal case scenarios (soldering time/contact ~ 5 s*): • 9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x5) = 4428” = ~ 1 h 14’ • 2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x5) = 6878” = ~ 1h 55’ • * shorter time could also be possible 4

  5. Automated HIC assembly system from VEA Assuming 100 HICs for IB and 1800 HICs for OB and 8 h working day, 220 working days / year • 234 h for IB + 6540 h for OB -> 850 d -> ~ 4y • 124 h for IB + 3450 h for OB -> 450 d -> ~ 2 y

More Related