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Module Assembly Jig Status

Module Assembly Jig Status. Cambridge and DESY came to Liverpool Nov. 15 th -16 th for training on module assembly A complete jig set was sent back with Cambridge with a complete set of jigs

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Module Assembly Jig Status

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  1. Module Assembly Jig Status • Cambridge and DESY came to Liverpool Nov. 15th-16th for training on module assembly • A complete jig set was sent back with Cambridge with a complete set of jigs • Cambridge took extensive notes/photos/videos and is making web page to start a set of training documentation • Second set is be made ready for UCSC/LBL • Last week during final commissioning of the set, the metal stencil was damaged for the chip tray and had to be re-glued yesterday • The jigs could be sent out next week but I would like to discuss the timing • Worried about shipping during Christmas and would like to send include a new hybrid panel which is delayed (see next slide) • We are making 3 additional wire bonding jigs to be ready when other sites are ready to start • Should be finished late Jan/early Feb • Will send one to DESY with a hybrid panels with 3 sets of ASICs attached (1 bonded, 2 unbonded) • Could send one to Freiburg if interested

  2. Hybrid Delivery • Originally, I planned on shipping out jigs to the west coast with one of the new hybrid panels • With one hybrid bonded and 2 more with chips attached to start the process at UCSC • The hybrid shipment was due 2-3 weeks ago but was delayed due to bad weather and an increased work load due to an eminent VAT increase in the UK . • Hope to receive at the beginning of next week • Shifts SMD attach to the week of Jan. 11th • Would be able to send this panel ~ week of Jan. 18th • So I can either delay shipment until these hybrids are ready or ship the jig now with 1 bonded hybrid (maybe)

  3. Near term plans (1) • Before Christmas • Will finish bonding/testing of all the hybrid/modules assembled during the training sessions • Work on finishing the commissioning the last jigs at Liverpool • Extra pickup tools and module testing jigs • Define and start manufacture of testing system for irradiated modules • Receive and inspect hybrid delivery to prepare for SMD attachment • Finish gathering the needed components for the hybrid-to-sensor gluing study • Have epoxies in hand, Glasgow is dicing glass dummies for ASICs, hybrids in process at Stevenage, ordering glass sensors from Schott Ltd. (Germany)

  4. Near term plans (2) • January • Focus on finalization of glue layer • Determine maximum achievable glue layer with Epolite • Decide if we need to “load” epoxy to increase viscosity to increase thickness and to improve accuracy of glue placement • Use glass ASICs/sensor to determine glue coverage and to determine optimal glue patterning for hybrid-to-sensor gluing • Make 2 panels that have some hybrids with ASICs for UCSC/LBL, DESY and Freiburg (??) • Sending additional panel to Cambridge • Starting another order of 15 hybrid panels • Testing of DC/DC convertors on module frame • Testing of irradiated modules at CERN

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