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**Fast Track IBL Project - Accelerating Component Production for Successful Installation**

Fast Track IBL project aims to expedite sensor, chip, module, and stave production to meet the aggressive construction schedule for installation by July 2013. The schedule, though challenging, is achievable with strategic planning and close progress monitoring. Key dates for FEI4 and sensor production in 2011 have been outlined to ensure timely completion. This approach minimizes risks, allows for rapid advancements, and ensures the compatibility with the specifications stated in the TDR for sustained performance.

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**Fast Track IBL Project - Accelerating Component Production for Successful Installation**

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  1. IBL 2013aka “Fast Track IBL” H. Pernegger / CERN

  2. Fast track IBL: FEI4 and Module pre-production • Schedule version 4.1 built on assumption of installation date 1. July 2013 FEI4V2 submission: June Sensor pre-production available for IZM: September * 20% of 900 chip equiv.

  3. Fast Track IBL: Module production Module pre-production: Oct-Dec 2011. Sensor production available for IZM: Nov 2011 * 60% of 900 chip equiv.

  4. Fast track IBL: Stave production Stave 0 assembly and test: April 2011 to Oct 2011 Stave loading: July-Nov 2012

  5. Fast track IBL: Integration and installation Integration around BP: Dec 2012 to April 2013

  6. IBL schedule for installation 2013 • Assumptions for schedule for installation 2013 • Official project start: 1. March 2011 • Ready for installation : 1. July 2013 • Construction time shortened by: remove explicit contingency (2x3mo) + parallelizing operations + early start for sensor pre-production (6-8 mo) + FEI4 Version 2 direct production run (5 mo) • Main construction duration of components not changed (e.g. BB, stave loading, integration …) • Treated as construction schedule with qualification steps of components (sensor, chip, module, stave, integration) • The schedule is aggressive but achievable if there are no major component failures and no major delays (e.g. due to extended RD steps) • There is no contingency in the schedule, which is dangerous • Time critical items: • Sensor pre-production run (start Feb) and sensor review/decision (June) • FEI4 Version 2 submission (June 2011) • Bump bonding of thin modules (workplan in preparation with IZM, aim to get first thin modules in approx 3 months) • Stave 0 program to qualify full stave mechanically and electrically (requires rapid advancement on stave flex and module loading) (mechanical stave April-May, loaded Aug, tested Oct) • Beam pipe qualification of split flange and order of beam pipe

  7. Sensors pre-production • The two slides summarize discussions between IBL management and sensors group representatives (Giovanni, Heinz, Cinzia, Claus, Daniel, Marko) • Schedule for installation in mid 2013 gives two key dates for FEI4 and sensors in 2011 • Submission FEI4-V2 early June 2011 -> return early September; aim at chip submission review April • Sensor required to start pre-production of IBL modules: end September 2011 • IBL management proposal to proceed with sensors • Start production of significant number of sensors in early February along two technologies: 3D double sided by CNM/FBK and planar n-in-n by CiS • Schedule leads to sensor review and decision in June with the available information by then: • Results of present sensor+FEI4 qualification modules • Production advances of IBL pre-production runs (see next slide) and to-date manufacturing yield, production timeline and risk analysis • With this strategy we will have a sizeable number of sensors available immediately after the decision on sensors is taken and the FEI4-V2 is back • This approach allows us to minimize risks (two technologies = back-up available if one has problems) and, simultaneously, allows rapid advancement of IBL • It requires detailed production plan and close monitoring of progress, i.e. monthly milestones for duration of pre-production runs at each foundry (Feb to end of runs)

  8. Implications on IBL performance • Lifetime: We keep the IBL specs as given in TDR, i.e. nominal 300 fb-1 plus safety factor for a total of 500 fb-1 . This is also in view of running the IBL beyond 2017 possibly up to the shutdown of 2021. • Sensors and Bump-bonding: • Proceed with TDR given specifications for the sensors and bump bonding (chip thickness 100µm). Therefore we do not expect a degradation in lifetime or performance as X0 is kept. A fast track program for demonstration of thin modules is being prepared now with IZM and Bonn to lead to first thin assemblies end of March/early April. • FEI4 Version 2 • The submission in June is very tight. The schedule pressure may force us to drop some options. A detailed work-plan for the FEI4-V2 until submission is now under preparation to address the necessary modifications. The FEI4-V2 design team and IBL MB will prepare a risk analysis (performance implications) for the FEI4 V2 submission. • Currently expect no change in performance, however the achievable FEI4 modification list for June needs to be checked in detail (FEI4 design team)

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