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IBL 2013 aka “Fast Track IBL”

IBL 2013 aka “Fast Track IBL”. H. Pernegger / CERN. Fast track IBL: FEI4 and Module pre-production. Schedule version 4.1 built on assumption of installation date 1. July 2013. FEI4V2 submission: June. Sensor pre-production available for IZM: September * 20% of 900 chip equiv.

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IBL 2013 aka “Fast Track IBL”

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  1. IBL 2013aka “Fast Track IBL” H. Pernegger / CERN

  2. Fast track IBL: FEI4 and Module pre-production • Schedule version 4.1 built on assumption of installation date 1. July 2013 FEI4V2 submission: June Sensor pre-production available for IZM: September * 20% of 900 chip equiv.

  3. Fast Track IBL: Module production Module pre-production: Oct-Dec 2011. Sensor production available for IZM: Nov 2011 * 60% of 900 chip equiv.

  4. Fast track IBL: Stave production Stave 0 assembly and test: April 2011 to Oct 2011 Stave loading: July-Nov 2012

  5. Fast track IBL: Integration and installation Integration around BP: Dec 2012 to April 2013

  6. IBL schedule for installation 2013 • Assumptions for schedule for installation 2013 • Official project start: 1. March 2011 • Ready for installation : 1. July 2013 • Construction time shortened by: remove explicit contingency (2x3mo) + parallelizing operations + early start for sensor pre-production (6-8 mo) + FEI4 Version 2 direct production run (5 mo) • Main construction duration of components not changed (e.g. BB, stave loading, integration …) • Treated as construction schedule with qualification steps of components (sensor, chip, module, stave, integration) • The schedule is aggressive but achievable if there are no major component failures and no major delays (e.g. due to extended RD steps) • There is no contingency in the schedule, which is dangerous • Time critical items: • Sensor pre-production run (start Feb) and sensor review/decision (June) • FEI4 Version 2 submission (June 2011) • Bump bonding of thin modules (workplan in preparation with IZM, aim to get first thin modules in approx 3 months) • Stave 0 program to qualify full stave mechanically and electrically (requires rapid advancement on stave flex and module loading) (mechanical stave April-May, loaded Aug, tested Oct) • Beam pipe qualification of split flange and order of beam pipe

  7. Sensors pre-production • The two slides summarize discussions between IBL management and sensors group representatives (Giovanni, Heinz, Cinzia, Claus, Daniel, Marko) • Schedule for installation in mid 2013 gives two key dates for FEI4 and sensors in 2011 • Submission FEI4-V2 early June 2011 -> return early September; aim at chip submission review April • Sensor required to start pre-production of IBL modules: end September 2011 • IBL management proposal to proceed with sensors • Start production of significant number of sensors in early February along two technologies: 3D double sided by CNM/FBK and planar n-in-n by CiS • Schedule leads to sensor review and decision in June with the available information by then: • Results of present sensor+FEI4 qualification modules • Production advances of IBL pre-production runs (see next slide) and to-date manufacturing yield, production timeline and risk analysis • With this strategy we will have a sizeable number of sensors available immediately after the decision on sensors is taken and the FEI4-V2 is back • This approach allows us to minimize risks (two technologies = back-up available if one has problems) and, simultaneously, allows rapid advancement of IBL • It requires detailed production plan and close monitoring of progress, i.e. monthly milestones for duration of pre-production runs at each foundry (Feb to end of runs)

  8. Implications on IBL performance • Lifetime: We keep the IBL specs as given in TDR, i.e. nominal 300 fb-1 plus safety factor for a total of 500 fb-1 . This is also in view of running the IBL beyond 2017 possibly up to the shutdown of 2021. • Sensors and Bump-bonding: • Proceed with TDR given specifications for the sensors and bump bonding (chip thickness 100µm). Therefore we do not expect a degradation in lifetime or performance as X0 is kept. A fast track program for demonstration of thin modules is being prepared now with IZM and Bonn to lead to first thin assemblies end of March/early April. • FEI4 Version 2 • The submission in June is very tight. The schedule pressure may force us to drop some options. A detailed work-plan for the FEI4-V2 until submission is now under preparation to address the necessary modifications. The FEI4-V2 design team and IBL MB will prepare a risk analysis (performance implications) for the FEI4 V2 submission. • Currently expect no change in performance, however the achievable FEI4 modification list for June needs to be checked in detail (FEI4 design team)

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