Particles and Fields Package Monthly Status Review (MSR) Sep 21, 2010

1. Particles and Fields Package Monthly Status Review (MSR) Sep 21, 2010 Dave Curtis, PFP PM

2. SSL Contracting Status Phase B/C/D Contract in place. Received mod pulling back $ in FY10 Adequately funded through FY10

3. Schedule Status Some erosion in pre-CDR schedule slack Power Converter Layouts SWIA/STATIC mechanical Due to personnel conflicts with RBSP (& August vacations) First RBSP FM instrument is in environmental tests, so end in in sight Still show 3 weeks margin between EM test completion and CDR Should be able to do some catching up once RBSP is delivered Still have 20 weeks CDR to Delivery margin MAG currently on critical path

4. Manpower • Concern with competition with RBSP-EFW for some key people • Power converter design team • layouts falling behind • SWIA/STATIC/LPW boom mechanical engineers • SWIA/STATIC EM mechanical parts falling behind • FSW lead • keeping ahead of MAVEN schedule • QA • some lag in getting EM passive parts ordered

5. Accomplishments All EM and some FM EEE active parts on order, ~50% delivered to GSFC A few parts don’t meet our EM need date, working on alternates Part qualification testing has been delayed till next FY, which adds some schedule risk in case parts fail screening Starting to organize some TID testing of key parts Passive EM parts ordering in progress EM & some FM connectors ordered, some in house EM Resistors/capacitors not yet ordered, some concern about long lead passives PWBs are in layout EM Mechanical parts are going to fab PFP FSW Boot code 93% coded; operational code started More in instrument sections…

6. Ongoing Work Supporting Project planning process Supporting EMC, Payload, SDT working groups Getting the last of the EM parts on order (passives) Working parts issues with the PCB Completing EM layouts and getting EM mechanical parts ordered

7. EM Status Summary EM & GSE Layouts (23) 3 complete, (2 of which with boards fabricated) 3 in final review 6 in progress 5 in the queue remaining 6 waiting on completion of electrical or mechanical details (mostly power converters). EM EEE Parts All active parts ordered, 46 of 92 types delivered, 11 potential problems being worked (finding alternate EM parts) Long lead (connectors) on order Passives to be ordered soon EM detectors on order (MCP, SSD, foils, magnets) EM Mechanical parts: SWEA, SEP, LPW Boom (not sensor), STATIC TOF in fab Remaining SWIA, STATIC parts into fab soon

8. PFP RFA Status

9. Trades Considering changing LPW boom whip caging Nick Jedrich Mechanical Peer Review recommendation Now that sensor geometry has been decided, can proceed. Change from caged to fixed whip Deletes caging mechanism mass & resources Deletes whip hinge Deletes an actuation Simplifies qualification Concerns being investigated Enhanced vibration on whip, preamp Have ideas for mitigations which look promising Plan for building a demonstration model to vibrate this month. RBSP EM + simple whip Potential damage to exposed whips during I&T Possibly remove whip for some of ATLO SSL & LM current see no show-stoppers

10. Issues [1] Magnetics Current sensor location on solar array does not work Too close to solar array strings AC magnetics too high Working with Project on alternatives Looks like the U-string configuration works for most conditions Assumes outtermost strings don’t switch Will see a transient going in and out of shadow Still have not seen a full ‘non-ideal geometry’ model of array field

11. Issues [2] SWEA Surface Treatment Need to modify thermal characteristics of surfaces in SWEA aperture to avoid excessive heating - candidate solutions in work Candidate solutions need to be evaluated for Atomic Oxygen effects, charging effects, thermal properties, and robustness AO test in progress Current candidates: DAG213, Ebanol-C, Black Nickel, Black Chrome, Z307 SWIA and STATIC also interested SEP detector Atomic Oxygen effects Heritage instruments survives AO, but we would like to test a MAVEN detector if possible. Included in the test

12. Issues [3] Amptek HV801 failures Seems to be a lot workmanship issue New lot in work at Amptek, but not certain they will be better Projects ahead of MAVEN in trouble, will have higher priority for parts SWIA, STATIC use HV801 Alternative VMI part has acceptable performance Tested in breadboard Much too large for existing layout Significant changes would need to be made to accommodate mass, schedule impact Micropak has built equivalent demo parts with same form factor Parts in test (one at SSL)

13. Issues [4] SWEA Planetary Protection CESR part of SWEA FM build in progress Will be assembled before the breakup/burnup analysis complete Current PP plan indicates SWEA is likely to burn up SWEA is small, not a large contributor even if it does not burn up SWEA has stringent contamination concerns due to MCP, and so is already built in very clean conditions Need to decide if we need extra steps such as bio assay This is the same as the rest of MAVEN, but with a sooner trigger date FM fab already started, mechanical assembly starts in November

14. Issues [5] Launch Loads The current random vibe levels in the ERD are significantly higher than anything we have worked to on previous missions 23GRMS for forward deck mounted instruments 47GRMS for MAG MAC curve limit loads are as high as 72g Corresponds to design loads significantly greater than 100G, which is the usual design target at SSL Greater than qualification level for heritage instruments which were expected to fly with minimal changes SWEA, SEP, LPW booms A concern for some structures Historically loads come down significantly once we get CLA CLA is due ~October, well before CDR PFP plan is to follow LM’s lead and not redesign to these unrealistic loads When CLA comes in there is a risk we will have to do some redesign

15. Issues [6] THEMIS SST Attenuator anomaly MAVEN SEP attenuator design is identical to THEMIS SST THEMIS attenuator life tested to ~75,000 cycles One of 10 flight attenuators failed to completely open after ~3 years on orbit and ~4,000 cycles MAVEN expected life is ~2,000 cycles. Diagnostics indicate the problem is not the end-of-travel microswitch (an early candidate), but the “Nanomuscle” actuator itself Looking at ways to improve the actuator reliability MAVEN has 2 independent SEP telescopes. Failure of one attenuator impacts part of the science from one telescope; can still meet Level 1.

16. Top Risks

17. Risks List [1]

18. Risks List [2]

19. PFP Mass PFDPU CBE mass increase Old estimate based on STEREO design MAVEN has thicker walls MAVEN is a larger stack, which complicates spacecraft interface Somewhat more conservative PWB mass estimate

20. Mass Tracking Chart

21. PFP Power Liens: Expect to need operational heat during eclipse None allocated for most instruments; amount needed pending thermal analysis Preliminary estimates included for MAG and EUV IPDR numbers for the remaining instruments are up to 13.3W (worst case cold) Hoping to improve on that using the LM-provided environments, pending

22. PFP Power Trend

23. PFP Data Rate Per 2009-6-9 allocations from Bruce

24. Requirements Verification Status Nothing to report

25. MAVEN Magnetometer Status September, 2010 Connerney, Sheppard, Schnurr, etc.

26. Progress, Plans, Issues • Juno FM MAG delivery to ATLO this week! • RBSP FM delivery next month • Recent Progress: • Resolved budget issue to the satisfaction of PI (Jakosky) and GSFC management (White/600 and Mitchell/460). • Procurement of long-lead and/or threatened availability parts (4066 CMOS); fabrication of sensor piece parts (contract awarded). • Began fabrication of magnetics piece parts (inductors, transformers). • Near Term Plans: • Assemble and test new a/c heater circuit board (Aeroflex PWM). • Complete EM circuit board layout. • Work with Project on document load. • Issues: • MAG boom trade (Project) to be completed soon; solar array circuit and backwire configuration.

27. MAVEN PFP SWIA Status Aug 2010 Jasper Halekas, SWIA Lead

28. SWIA Progress • Board Schematics Complete, Layouts in Progress • Anode board layout first rev. done • Changes in progress • Preamp/MCP board layout in progress • Digital board layout in progress • Sweep board and LVPS behind (see next page) • Mechanical Design Maturing • First priority: Support layout • Most mechanical done for boards • Still work to be done on HV connectors • Second priority: Flesh out and fabricate attenuator mechanism and anode/MCP housing • Anode/MCP housing complete • Attenuator mechanism redesign in progress • Changing from MOBI to in-house SMA design • Third priority: Detail and fabricate full analyzer • FPGA Testing in Progress

29. SWIA Issues • Staffing • ME staffing continues to be an issue • Dalton largely busy with RBSP • Johnson splitting time between RBSP, STATIC, SWIA • Layout queue is tight • Many people out on vacations after PDR • Layout Complications • First revision of anode layout possibly susceptible to crosstalk • Revision in progress • SWIA/STATIC Sweep board has ongoing issues • Testing still ongoing on prototype • HV connection scheme still evolving • STATIC and SWIA solutions may diverge, splitting layouts • Power convertor layouts falling behind

30. MAVEN PFP SWEA Status September 2010 Dave Mitchell, SWEA Lead

31. SWEA Status - CESR • Mechanical • New mechanical sensor parts to upgrade Stereo EM have been delivered. Stereo EM  MAVEN EM • EM sensor has been disassembled and given to mechanical subcontractor to verify/refine hemisphere concentricity and obturator parallelism. • All EM parts back at CESR by week 40 (Oct. 4-8) for EM assembly and test. • Front-end Electronics (MCP, HVPS) • Electronic parts procurement – done • PCB fabrication – done • HV optocouplers – fabrication in progress • Transformers fab & test – fab complete, not yet tested

32. SWEA Status - SSL • Mechanical • Purge redesigned to point in the right direction • change to CESR mechanical design is very minor • Finalizing parts drawings – fabrication begins week 38 (Sep. 20-24) • LVPC • Design/parts selection done • Layout in queue (after HVPS and PFDPU IIB) • Digital • Board ready for layout in week 38 (Sep. 20-24) after review of recently added monitoring circuit for the door.

33. Surface Coating for Deflectors and Toroidal Grids Current candidates are: black chrome, black nickel, DAG213, Z307, and Ebanol-C. Laboratory tests are underway to measure electrical properties before and after exposure to atomic oxygen. FM parts coating awaiting thermal report and coating test results. Mechanical Design of Aperture Current mechanical loads spec exceeds SWEA’s tolerance. Awaiting results of CLA analysis (expected October 2010). Fabrication of most FM mechanical parts is frozen, awaiting results of CLA tests. FM Front-End Electronics FM electronics board assembly awaiting Planetary Protection Plan; will begin as soon as AIV procedures are known. SWEA Issues

34. MAVEN PFP STATIC Status September 2010 Jim McFadden, STATIC Lead

35. STATIC Accomplishments Thick foil frames sent out to Luxel for thick foil attachment Carbon foil carrier frames inspected, sent out for grid attachment Updated solid models sent to LM PC board mech keep-outs and inter-board connectors complete MCP clamp spring calculations shown to agree with test data TOF parts were ordered from E&S (due back 10-20) Detailed the STATIC nitrogen purge – review identified changes Anode, Preamp and TDC parts placement and layout undergoing review Schematics for Anode, Preamp and TDC updated Arranged contract for Digital board layout New 15 kV / MCP board layout proceeding Calibration room painted Calibration chamber design completed – out for quote next week

36. STATIC Open Issues Parts changes on STATIC Anode and TDC necessitated layout changes in Anode, Preamp and TDC boards Ken Hatch is optimizing Anode, Preamp and TDC boards part placement and routing, but these changes are delaying the schedule for EM board completion. This optimization should reduce risk of noise problems later. STATIC HV Sweep layout needs modifications for inter-board HV and external HV connectors – working on modification concept compatible with both STATIC and SWIA. STATIC FPGA still in development Mechanical Attenuator still in development, should get more ME time starting next week. Carbon foils received but are tearing when floated - vendor to send new foils. Clean room refurbishment (320D) still waiting on campus. Ion gun for calibration chamber being reviewed.

37. MAVEN PFP SEP Status September, 2010 Davin Larson, SEP Lead

38. SEP Accomplishments DFE board layed out Review of DFE board on 9/13 Resuming DAP board layout SEP EM Mechanical parts in fabrication

39. SEP Open issues DFE Board Gerber files must be produced and reviewed Cable connector pinout changed due to layout issues (requires updating). Magnet selection to be done this week. FPGA design requires work.

40. MAVEN PFP PFDPU, Power Converter & GSE Status September 2010 Dorothy Gordon Tim Quinn Peter Berg

41. DCB Status PFDPU Processor DCB Layout in process – Routing expected to complete this week DCB FPGA Design completed and verified via unit testing for the following modules: Instrument CDI, S/C Interface (Command & Telemetry), Processor Bus Control and support subsystem, SRAM control Verification of Instrument Data I/F in process Remaining Modules: FLASH Memory Control, Registers, Timekeeper FLASH Subsystem Design to be ported from RBSP DCB Top level simulation performed using the ColdFire V1 IP Core (running Coldfire assembler code) FPGA Daughter Cards Both FPGA (FLASH and Flight) Daughter board have been placed FLASH (ETU version) Daughter board routing has been started, expected completion date: 24 September 2010

42. PFDPU GSE Extender Board • Will serve as a “break-out box” and extender board for the PFDPU during bench testing. • Allows for connection of power supplies and GSE equipment as well as access to the PC104 signals. • Fabrication complete (40 boards); next step is loading the components (the PC104 connector and breakout headers). • Hypertronics connector soldering is difficult; we have been in touch with local manufacturing facilities and plan to have one board loaded initially.

43. GSE Status GSE Hardware MISG FPGA effort to be ramped up next week Many of the DCB FPGA modules will be incorporated into the MISG design

44. GSE Status GSE Software First version of STATIC instrument CTM complete and tested All necessary GSEOS configuration files (telemetry definitions, command definitions, conversions) are created from this document using a python program Transitioned all software (GSEOS, SSG) to SVN system. Created stripcharts of STATIC housekeeping values which are displayed in GSEOS Modeled after flight software CTM document Updated SSG interface to: Control and display all interface settings (baud, parity, data bits, parity) Toggle DCB side select Toggle Reset Discrete, pulse duration of 2 seconds Send variable length hex string Open log file at startup

45. Power Converter Status REG Board Redesigned safeing circuit and updated board placement RFQ generated for layout (one quote received, one pending) STATIC Accelerator Board Placement is in progress 50% complete – expected completion by early next week (9/20/10) IIB Schematics are in process Circuit development continues on the IIB and the various low voltage supplies.

46. MAVEN PFP Flight Software Status September 14 2010 Peter Harvey

47. Schedule Tracker Progress Points=Telecons with GSFC. 1 pt for each telecon, 0 if the telecon did not happen. Management Effort. Expected 10% or less, but has required phase A requirements and plans to be written in phase B.

48. Technical Status • Technical Developments • HSK module : Analog List-based measurements • HSK module : High Rate single-quantity mode for diagnostic support • CMD module : Relative Time Sequence engine (up to 32 sequences) • CMD module : Diagnostic input command (simulation support) • TM module : Housekeeping Packet rate control, merging. • TM module : Real-Time Science, Archive multiplexing • TM module : Data Rate measurement and control • IO module : Support routines for FPGA (DCB Rev E specification). • Software tests being performed using Code Warrior simulator, breakpoints, etc. • SSR Module : Stubbed to support TM module testing. • Upcoming • Update Level 5’s (derived from Level 4’s) – IV&V reviewing rev C. • CMD/TM Module : Critical Command & Ack logic – discussion needed

49. Technical Margins

50. 1-Page Fever Chart