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2011 ITRS ESH iTWG Update July 13, 2011

2011 ITRS ESH iTWG Update July 13, 2011. Francesca Illuzzi – Micron Hans-Peter Bipp – Infineon Mike Mocella - DuPont Leo Kenny – Intel Dan Herr – SRC Mike Garner - Stanford University Gopal Rao – Intel Andreas Neuber - AMAT. Agenda. Change in ESH Roadmap from 2009

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2011 ITRS ESH iTWG Update July 13, 2011

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  1. 2011 ITRSESH iTWG Update July 13, 2011 Francesca Illuzzi – Micron Hans-Peter Bipp –Infineon Mike Mocella - DuPont Leo Kenny – Intel Dan Herr – SRC Mike Garner - Stanford University Gopal Rao – Intel Andreas Neuber - AMAT

  2. Agenda Change in ESH Roadmap from 2009 Implications of the 2011 Roadmap Example of roadmap change to Interconnect Table ESH iTWG Key focus areas

  3. Major ESH shift in 2009 Roadmap ESH needs no longer presented as undifferentiated, but divided into 3 categories • Critical: Any requirement in this category is an essential item for technology success/implementation • Important: Any requirement in this category can compromise the cost of ownership (CoO) of the technology • Useful: Any requirement in this category is a key item for ESH benefits (“best practices”)* * items in this category are no longer considered for further action in the ITRS

  4. Roadmap implications for 2011 • Radical “simplification” of many tables • ESH needs as presented in ‘09 did not have sufficient Roadmap quality • Goals and metrics often been stated in continuous improvement terms • Many improvement activities are already part of industry practice (not aligned with fundamental roadmap strategic intent) • All needs in the Critical and Important categories are further rated according to two subcategories: • Data available: there is a consensus definition, and there is adequate data available, to drive meaningful action under the ITRS • No data available: there is not a consensus definition, and/or there is inadequate data available, to drive meaningful action under the ITRS • Proactive collaboration emphasis with Technical Work Groups • Renewed partnership on cross thrust goal development

  5. Interconnect example Chemicals & Materials: 2009

  6. Interconnect example Chemicals & Materials: 2011

  7. ESH iTWG Key focus areas • Sustainable (Green) Chemistry integration • Proactive intercept of materials design through the life cycle • Design for Environment to optimize HVM • Emerging research material guidelines (with ERM iTWG) • Energy (alignment/direction) with Factory Integration WG • 450 engagement/direction • Advanced Metrology R&D guidance • Natural resource usage and utilization • Rapid risk assessment for enabling new materials

  8. Green Chemistry principles* Prevent waste Maximize atom economy Design less hazardous chemical syntheses Design safer chemicals and products Use safer solvents and reaction conditions Increase energy efficiency Use renewable feed stocks Avoid chemical derivatives Use catalysts, not stoichiometric reagents Design chemicals and products that degrade after use Analyze in real time to prevent pollution Minimize the potential for accidents * Anastas, P. T. and Warner, J. C. Green Chemistry: Theory and Practice, Oxford University Press: New York, 1998.

  9. Back-up

  10. Electronics Power Consumption • Information Processing Energy Consumption • Device Energy Consumption • Changing or Comparing Information • Electrical Resistance and Leakage (Reduce Efficiency) • Higher operating temperature increases these • Interconnect Energy Consumption • Transmitting Information • Electrical resistance and capacitance ( Reduce Efficiency) • Higher operating temperature increases resistance

  11. Need for New Materials • Energy Efficiency Can be Improved in Future Technologies • Computational density and efficiency increases with reduced size, but.. • Device power efficiency decreases with reduced size • Interconnect power efficiency decreases dramatically with reduced size • New materials could dramatically increase energy efficiency of devices and interconnects • New materials • New structures • Small quantities of new materials

  12. ERM ITWG Potential Insertion Opportunity Matrix

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