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ITRS 2003 Factory Integration Chapter Disruptive Technologies Backup Section

This chapter discusses the International Technology Roadmap for Semiconductors (ITRS), capturing the challenges, metrics, potential solutions, and R&D needed for factory integration. It explores the impact of litho, front-end processes, interconnect technology, environmental safety and health, and test technology on factory design. Integrated solutions are essential to meet disruptive and productivity requirements.

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ITRS 2003 Factory Integration Chapter Disruptive Technologies Backup Section

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  1. ITRS 2003 Factory Integration ChapterDisruptive Technologies Backup Section Details and Assumptions for Near Term Years ITRS Factory Integration TWG

  2. Near Term Years Year 2003 2004 2005 2006 2007 2008 2009 Technology Node (nm) 100 90 80 70 65 55 50 Wafer Size (mm) 300 300 300 300 300 300 300 Longer Term Years Year 2012 2015 2018 Technology Node (nm) 35 25 18 Wafer Size (mm) 450 450 450 2003 International Technology Roadmap for Semiconductors (ITRS) Refresher • ITRS is a 15 year forward looking roadmap geared to 300mm Fabs & equipment and Advanced Process Technologies (<90nm) • Factory Integration captures Best in Class 300mm factory capabilities for the current year (2003) and Best in Class needs for future years (2004-2018). Each technology requirement metric is Best in Class. • Captures challenges, metrics, potential solutions, plus R&D needed Future Targets To get to 300mm required 6+ years of planning & execution Is there 157nm litho? When does NG Litho intercept and how does the technology affect factory design? Next wafer size change date (2012)? Start of Post Bulk CMOS Novel Devices (2010)?

  3. Impact of Litho Technologies to the Factory Design (1 of 2) ITRS Factory Integration TWG

  4. Impact of Litho Technology to the Factory Design (2 of 2) ITRS Factory Integration TWG

  5. Impact of Front End Processes Technology to the Factory Design (1 of 2) ITRS Factory Integration TWG

  6. Impact of Front End Processes Technology to the Factory Design (2 of 2) ITRS Factory Integration TWG

  7. Impact of Interconnect Technology to the Factory Design (1 of 2) ITRS Factory Integration TWG

  8. Impact of Interconnect Technology to the Factory Design (2 of 2) ITRS Factory Integration TWG

  9. Impact of Environmental, Safety, and Health (ES&H) to the Factory Design ITRS Factory Integration TWG

  10. Impact of Test Technology to the Factory Design ITRS Factory Integration TWG

  11. Integrated Solutions are Essential to Meet Disruptive and Productivity Requirements Technology Requirements • New disruptive process technologies • 157nm litho • High K gate stack • Low k dielectrics • Copper processing + • Improved Productivity • Decreased Factory Cycle Time (QTAT) • Improved Equipment Efficiency • Reduction in non-product (I.e. test) wafer usage • More efficient direct labor • Faster factory conversion at technology nodes Integrated Solutions • Agile Manufacturing • - Equipment Engineering Systems - EES • - Single wafer control • - e-Diagnostics • Process Control • - Fault Det. & Classification • - R2R and W2F control • Integrated Metrology • Machine to machine matching • Material Handling - Direct Transport AMHS • - AMHS to support Send-Ahead, gating monitors, and very hot lots • - Integrated Sorters, Stockers, Metrology Integrated Factory Goal = Meet Factory Challenges and Technology Requirements ITRS Factory Integration TWG

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