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Status of E mbedded L ocal M onitor B oard ( ELMB ). Overview Radiation tolerance measurements Future work. What is the ELMB ?. I/O concentrator implemented as CAN fieldbus node Features 8 ports input 8 ports output 8 ports definable ADC, 64 channels, 16 bit resolution, 7 bit gain
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Status ofEmbedded Local Monitor Board(ELMB) • Overview • Radiation tolerance measurements • Future work H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
What is the ELMB ? • I/O concentrator implemented as CAN fieldbus node • Features • 8 ports input • 8 ports output • 8 ports definable • ADC, 64 channels, 16 bit resolution, 7 bit gain • Add-ons: • DAC, 16 channels, 12 bit resolution (NIKHEF) • HW Interlock, 16 channels, window set by resistors (Wuppertal) • Motherboard (NTU Athens) Goal: flexible I/O system for use in ATLAS cavern outside the calorimeter (i.e. Muons) H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Status ELMB • Design: HW CERN; SW NIKHEF • Prototype LMB • Review (subdetector’ wishes, radiation tolerance) • ELMB • prototype 20 pieces • production 300 pieces (with help from EP/ESS, NTU Athens) • pre-qualification measurements concerning radiation H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
ELMB front side ISP 50mm DIP-SW ID BAUD 67 mm H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
ELMB back side ADC ADC Analog MUX 2*50 pin Bergstac connector H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
ELMB ADC 1uV H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
ELMB ADC H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
ELMB3 motherboard for tests in DIN rail housing H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Back side of MB3 H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Radiation Measurements • Total Ionisation Dose (TID) • PAGURE, Saclay, Co60 (1 MeV gammas) • GIF, CERN, Cs137 (662 keV gammas) • CYCLONE, Louvain-la-Neuve, 60 MeV protons • Single Event Effects (SEE) • CYCLONE, Louvain-la-Neuve, 60 MeV protons • Non-Ionising Energy Loss (NIEL) • PROSPERO, Valduc, 0.75 MeV neutrons from reactor • “Measurements in the Field” • TCC2 target area, CERN SPS, “realistic (?) mix of particles” H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
TID tests H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Accelerated ageing test H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
TID effects H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
NIEL test Prospero H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
SEE effects: SRAM H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
SEE Results: Memories No of bits tested No of errors Cross-section cm2/bit SRAM 16384 2320 4.3*10-13 EEPROM 28672 <1 <1.1*10-16 FLASH 1048576 <1 <2.9*10-18 CAN reg. 320 23 2.2*10-13 ADC reg. 264 22 2.5*10-13 No errors were found in Flash memory and EEPROM! H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Radiation Requirements SEE category / Symptoms Error recovery Maximum allowed rate Soft SEE/ Data readout errors Automatic 1 per 10 min per CAN branch Soft SEE / CAN node hangs Software reset 1 per 24 h per CAN node Soft SEE / CAN branch hangs Power cycling 1 per 24 h per CAN branch Hard SEE / Permanent error Replace ELMB 1 per months for 3000 ELMBs Destructive SEE / Damage Power limitation Not allowed H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Results H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Summary Radiation Tolerance • Radiation pre-qualification finished • DCS IWN 9-12 • Summary paper given at the 7th Workshop on Electronics for LHC Experiments, Stockholm, Sweden, September 2001 • Subdetectors have to decide, where to use ELMB • e.g. Muons, Assessment of Electronics Coordination: • SEE looks ok, more precaution (SW) and automatic recovery needed • NIEL looks ok • TID at the limit, study position of ELMB on some chambers EC1 H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Need • Envisaged usage of ELMB • “standard” use (with ADC) • MDT: 1200 • infrastructure and other subdetectors : 1000 • other LHC experiments ??? • “special” use (w/o ADC, special SW) • TGC: 1000 • RPC: 1000 H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Estimated Cost • Quantity ~300 pc ~4000 pc • Microcontroller $70 $50 • ADC $50 $40 • $120 $90 • Overhead 30%? $40 $30 • Total $160 $120 • Catalog price (1pc) $320 (>1k) $160 H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Next Steps (1) • Work to do • simplify PCB (8 ==> 6 layers) • cabling/powering of full branch • automatic detection of and recovery from SEE • Final connection to SCADA PVSS • HW: interface card • SW: OPC, driver • Distribution of functions (see DCS-IWN 13) H.J.Burckhart, Muon Electronics Meeting, December 11th 2001
Next Steps (2) • Procurement • production in industry (allow 1-2 years !!!) • Market Survey procedure has been started • Tendering, need commitments (pledges !) from ATLAS institutes • pre-series of 500-1000 next year (not for UX) • final series 2003/2004 (?) • Combined/separate production of ELMB with and w/o ADC ? • Support by the CERN electronics pool Probably a shortage of ELMBs next year ! H.J.Burckhart, Muon Electronics Meeting, December 11th 2001