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ITRS Factory Integration

ITRS Factory Integration. 2008 Contributors:

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ITRS Factory Integration

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  1. ITRS Factory Integration 2008 Contributors: Terry Francis, Gopal Rao, Al Chasey, Les Marshall, Todd Lasater, Brad van Eck, Kenjiro Nawa, Daniel Babbs, Dave Eggleston, Mutaz Haddadin, Gavin Rider, Andreas Neuber, Eric Englhardt, Peter Csatary, Adrian Pyke, Mikio Otani, Bill Fosnight, Richard Oeschner Junji Iwasaki, Mazafumi Fukushima, Tomoyuki Masui Shige Kobayashi, Tom Jefferson July 2008 San Francisco, USA Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: S. H. Park Taiwan: Thomas Chen US: Tom Jefferson

  2. UI Factory Integration Scope and Drivers Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities Si Substrate Mfg Chip Mfg Wafer Mfg Product Mfg Distribution Reticle Mfg • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Increasing cost & Cycle time implications • Factory is driven by Cost, Quality, Productivity, Speed, and Flexibility • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient/Effective volume/mix production, high reliability, & high equipment reuse • Enable rapid process technology shrinks and wafer size changes

  3. Key Technologies that will Impact Factory Design • 2008 and future years are targeted to meet productivity and capture technology requirements • Key process & device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), new materials, 450mm conversion, significant productivity improvements, and waste (inefficiencies) reduction • Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth to attain efficiency and effectiveness Planning for NGF/450mm EUVL in Production? 450mm ? NGF ?

  4. FI 2008 Focus

  5. FI 2009 Focus Other Focus Areas will be Addressed as Required

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