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Progress towards a Long Shaping-Time Readout for Silicon Strips

This overview discusses the progress made towards implementing a long shaping-time readout system for silicon strips at the Snowmass Linear Collider Workshop in 2005. Topics covered include test bench preparation, chip designs, digital architecture development, and ladder assembly. The text details the current status of the project, including the completion of the test bench control system, fabrication of the LSTFE-2 chip, and the proposed back-end architecture. The focus is on optimizing electronics readout efficiency and reducing noise for improved performance.

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Progress towards a Long Shaping-Time Readout for Silicon Strips

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  1. Progress towards a Long Shaping-Time Readout for Silicon Strips Bruce Schumm SCIPP & UC Santa Cruz Snowmass Linear Collider Workshop August 14-28, 2005

  2. Overview • Status as of LCWS05 • Test bench prepared • NLC-oriented LSTFE-1 chip received, but basic design flaw precluded testing • Current Status • Test-bench control system completed • Cold-technology-oriented LSTFE-2 designed & fabricated; tests beginning • Long-ladder assembly under construction • Back-end (digital) architecture designed and tested

  3. The SCIPP/UCSC ILC HARDWARE GROUP Faculty/Senior Alex Grillo Hartmut Sadrozinski Bruce Schumm Abe Seiden Students Michael Young Kunal Arya (Com- puter Eng. Post-Docs Gavin Nesom Jurgen Kroseberg Lead Engineer: Ned Spencer Technical Staff: Max Wilder, Forest Martinez-McKinney

  4. The Gossamer Tracker • Ideas: • Long ladders  substantially limit electronics readout and associated support • Thin inner detector layers • Exploit duty cycle  eliminate need for active cooling  Competitive with gaseous track- ing over full range of momenta Also: forward region…

  5. THE LSTFE-2 CHIP Long shaping-time front end suppresses 1/f noise, allowing for long-ladder readout Power cycling should reduce IR heating by close to x100 Analog measurement via time-over-threshold (TOT) from low-threshold “readout” comparator. Redesigned relative to LSTFE-1 to accommodate long pulse train and exploit more relaxed (5 Hz) duty cycle. Submitted to TSMC 0.25m mixed-signal RF process; received August 11 (5 weeks late)

  6. 3 s shaping time; analog readout it Time-Over-Thres-hold with 400 nsec clock

  7. 128 mip 1 mip Operating point threshold Readout threshold 1/4 mip

  8. RMS RMS Gaussian Fit Gaussian Fit SIMULATED PERFORMANCE FOR 167cm LADDER Resolution as a function of low threshold Efficiency and Occupancy as a function of high threshold

  9. INITIAL RESULTS Expected analog gain of 140 mV/fC confirmed Transition to log-arithmic response (TOT) at ~ 1.5 mip 1 mip

  10. DIGITAL ARCHITECTURE: FPGA DEVELOPMENT Digital logic should perform basic zero suppression (intrinsic data rate for entire tracker would be approximately 50 GHz), but must retain nearest-neighbor information for accurate centroid.

  11. Status of Back-End Architecture Development • First-pass digital strategy worked out • FPGA code developed for 8-channel system • Simulated data stream (including noise and detector background) injected and processed in simulation • Data rates estimated

  12. Li Hi Li+1 Hi+1 Li+2 Hi+2 Li+3 Hi+3 Li+4 Hi+4 Li+5 Hi+5 Li+6 Hi+6 Proposed LSTFE Back-End Architecture Low Comparator Leading-Edge-Enable Domain 8:1 Multi-plexing (clock = 50 ns) FIFO (Leading and trailing transitions) Event Time Clock Period  = 400 nsec

  13. FIFO FIFO FIFO Controller FIFO FIFO FIFO Proposed LSTFE Back-End Architecture (cont’d) Per 128 Channel Chip: 1 Master FIFO reads out 32 local FIFO’s Store in Master FIFO essentially complete by end of ~1ms beam spill Master FIFO

  14. DIGITAL ARCHITECTURE VERIFICATION ModelSim package permits realistic simulation of FPGA code (for now, up to signal propagation delay) Simulate detector background and noise rates for 500 GeV running, as a function of read-out threshold. Per 128 channel chip ~ 7 kbit per spill  35 kbit/second For entire long shaping-time tracker ~ 0.5 GHz data rate (x100 data rate suppression) Nominal Readout Threshold

  15. LONG LADDER CONSTRUCTION

  16. SUMMARY • Progress on key fronts: • Front-end electronics development • LSTFE-2 chip (cold-rf optimization) designed and testing underway • Digital architecture • Proposed back-end architecture developed and verified; raw data rates acceptable (0.5 GHz) • Ladder construction underway • Substantial work remains in all these areas; working towards testbeam run in late 2006

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