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Hybrid Status

Hybrid Status. Carl Haber 12-Aug-2008 UCSC. Prototypes and Designs. 60 cm, 9 cm strip, 6 segments/side. Stave-06. 1 meter, 3 cm strip, 30 segments/side 192 Watts (ABCD chip), ~2.4 % Xo + support structure. Stave-07. 6 x 3 cm, 6 chips wide.

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Hybrid Status

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  1. Hybrid Status Carl Haber 12-Aug-2008 UCSC

  2. Prototypes and Designs 60 cm, 9 cm strip, 6 segments/side Stave-06 1 meter, 3 cm strip, 30 segments/side 192 Watts (ABCD chip), ~2.4 % Xo + support structure Stave-07 6 x 3 cm, 6 chips wide 1.2 meter, 2.5 cm strip, 48 segments/side ~250-300 Watts (@0.25 W/chip) 1.7 – 2.4 % Xo + support structure, depends upon coolant and hybrid design Stave-08 10 x 10 cm, 10 chips wide

  3. Intro • We have developed a 6 chip ceramic ABCD hybrid for the Stave-2007 program • In use for ongoing studies of stave and transmission • A new flex version of this will be fabricated as well. Layout complete, check prints • This will used to test substrate issues (PM talk) • Beyond this a hybrid series is needed for the ABC-Next and Stave-2008 program • Liverpool will lead this program • July 30-31 I met with the Liverpool and Oxford groups, in the UK, to discuss this program • Includes hybrid development and data transmission studies

  4. ceramic flex

  5. Ongoing Program • More in PM talk • Individual hybrids/modules work well electrically • Main issue has been data transmission on the stave with multiple modules. • Lack of robust response to LVDS commands • Significant work on test bench with D.Nelson (many thanks for this…) • While we have made a number of improvements we are not there yet • This has delayed further mounting of modules on Stave-2007

  6. Hybrid for Stave-2008, ABC-next • Oxford Meeting July 30-31, 2008 • Phil Allport, Ashley Greenal, Tony Affolder, CH, Richard Nickerson, Tony Weidberg, Todd Huffman, Peter Phillips, Mike Tyndel • A key issue has been how to accommodate robust early testing of the ABC-next and Stave-2008, considering the lack of a MCC • Drive towards a minimum area design • Concern for data transmission problems • Parallel bus testing program • Follow-up meeting in US, late Sept, proposed

  7. Conclusion of Meeting • A plan was developed to systematically address these various needs • Liverpool will under take the design and fabrication of a series of hybrids over the next 6-9 months • Various design choices will be made as options are understand further.

  8. Proposal • Hybrid-1: for ABC-next test in legacy mode. • Can 20 ABC-next operate as a system? • Not compatible with stave and bus cable • Large connector, control with modified Mustard • Interface to various powering options • To be ready this Fall along with ABC-next

  9. Hybrid Powering and Readout • Proposal • A single PCB which can accommodate 2 hybrid fingers (with sensor) • All module connections to PCB made using wire bonds (as done by US) • Fusing current for 25µm Al wire is ~500mA • Topology of connections will be similar to that presently used on US Stave • Power/DCS towards one end and Data I/O at the opposite end of hybrid • For module readout & configuration make use of SCTDAQ (Mustard+SLOG+LV3) • Requires ABCns to operate in Legacy Mode (1 x Master/column) with data rate limited to 40MHz • Mustard firmware will be modified to accept increased ChipID field • AC-coupled LVDS data transmission to/from module • LVDS RX (CLK, COM, etc.) powered parasitically off module VDD (2V5) • LVDS TX (Module data) powered from LV3 power supply VDD (4V) • Make use of plug-in boards to provide the various powering scheme – the main PCB is simply a carrier • One plug-in per finger, coming in different flavours • SPi plug-in, Pseudo SPi (with own shunt regulation and bypass circuitry) • DC-DC powering • Requirement for floating power supply I/P • SPi will be(?) configurable using SCTDAQ • Direct connection to hybrid VDD/VCC for auxiliary powering • Allows for more thorough testing of ABCn powering • Over/under voltage scenarios + direct current monitoring Ashley Greenall 9 Module Integration Working Group 17th July 2008

  10. Powering and Readout Conceptually Auxiliary Power connections Plug-in Circuit Plug-in Circuit Floating Power Supply Shunt Regulator Shunt Regulator Power In Power Out/In Power Out VDD VDD Linear Regulator Linear Regulator VCC VCC Pseudo-SPi Sensor SPi DC-DC Hybrids are floating w.r.t. each other Hybrid connections made using wire-bonds Hybrid 0 Hybrid 1 ABCn’s Operate in Legacy mode Data rate limited to 40MHz M M M M LVDS RX (CLK,COM, etc.) Powered from Module VDD LVDS TX (Module Data) Powered from SCTDAQ TX TX RX RX LV3 SCTDAQ 10 Module Integration Working Group 17th July 2008

  11. A Tentative Roadmap Consider using 18µm instead? • July’08 begin layout of hybrid • Will be fabricated as a Cu Kapton flex circuit • Using 35µm Cu (final version will use 12µm Cu) – build will otherwise be identical • Removes any uncertainty regarding asic/hybrid operation • Circuit will be laminated to rigid base board (FR4, carbon, ??) • Expect hybrid circuit(s) to start to become available Oct’08 • Circuits are being designed for both ASIC and Power evaluation • ABCns due back Oct’08? • First testing begins of asics • Expect release of ABCn’s Nov/Dec’08? 11 Module Integration Working Group 17th July 2008

  12. Proposal - continued • Hybrids for staves are challenged by available area at ends • Hybrid-2: for testing on stave • Assume MCC(s) is not available • Provide MCC function with either COTS chips or an FPGA, real-estate issue • Can consider a very wide hybrid (35 mm) to accommodate this, which still fits on stave • Aim for early 2009 • Hybrid-3: on stave with MCC(s) • Push for minimum area • Impact on MCC aspect ratio

  13. Bus cable access aperture 1.7 3.05 Bus Cable (Power+DCS) Hybrid Extension (?) 5.0 Kapton Hybrid 7.6 100.00 (Sensor) 96.3 110.00 (Bus cable width) ABCn 2.1 0402 Decoupling capacitor 7.5 3.05 Hybrid Extension (?) Bus Cable (Digital I/O) >24.0 What it means – hybrid on sensor (unbridged) with integrated bus cable • Notes: • Min. length of hybrid is 96.3mm • <2mm real estate available at ends, assuming sizing is to 100mm sensor • Where to locate MCC etc? (tape topology means 2 devices: 1 for power and 1 for digital I/O?) • Consider reducing gap between ABCns doesn’t help. A reduction of 0.5mm/gap increases asic-to-sensor bonding angle to 35º (max is 18º) • Necessary to increase hybrid length, will overhang sensor (rigidise?) • Dimensions fixed – no other option! Critical dimensions Ashley Greenall

  14. Simplified hybrid scheme without a real MCC ABCnext, 2 strings of 10 dataout 40 MHz Beam Clock x2 dataclock U1 multiplier x4 U2 Data interleave takes 2 80 MHz streams into 1 160 MHz stream

  15. Required Die • U1: clock multiplier: candidate identified • U2: data MUX: candidate identified • 3 channels of LVDS receiver • 1 channel of LVDS driver • Serial powering components

  16. Area • Strongly advocate an aggressive minimum area design for Hybrid-3 • Goal would be 97+? mm x 20 mm • Consider running bus work under the chips, not just in the space between chips (asymmetric design) • Driven by ceramic hybrid experience • Impact on location of pads in ABCnext Ver2? 5mm

  17. Layer (from bottom up) • Static shield layer • Traces and power • Traces and ground • Component and bond pads Hybrid real estate 20 mm 5mm 100 mm A goal would be to fit all the required die, and on-hybrid buswork in the 5mm zone or (lines) under the chips

  18. ABCnext, 2 strings of 10 dataout com clk 40 MHz Beam Clock x2 dataclock multiplier x4 mux bco L1 Data mux takes 2 80 MHz streams into one 160 MHz stream Wiring scheme for minimum area hybrid, route below chips

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