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Ruggedized Camera Module P13571 Project Review. May 10, 2013. Project Description. Design and develop a camera system that can capture, package, and transmit image data in a small form factor which may be subjected to adverse conditions. Customer Needs. Engineering Specifications.
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Ruggedized Camera ModuleP13571 Project Review May 10, 2013
Project Description Design and develop a camera system that can capture, package, and transmit image data in a small form factor which may be subjected to adverse conditions.
Electrical System Architecture • Power • Power Management • Image Sensor • Image Data Capture • Coax • Data Transmitter • FPGA • Transceiver Architecture
Mechanical System Architecture • Heat Dissipation • Cold Finger • Fins • Aluminum Body • Ruggedized • Anodized • Gorilla® Glass • Water Tight Seal • O-ring Seals • Flat Gasket
Synthetic Data Working Pixel Capture
Electrical Design Summary • System Testing Results • Voltage and Short Checks • Short on FPGA-to-Power Board connector • Power over CoaXPress • JTAG functionality • Flash programmable • I2C communication with sensor • I2C clock on input pin • Transceiver signal integrity
Mechanical Design Summary • Testing Results • Assembly • - Material Selection for high temperatures/oil temp. • PCBs and Hardware assemble together without interference. • Thermal pads compress effectively reducing contact resistance . • Tolerance Analysis provided an effective connector engagement. • Thermal • Experimental Data was 20% lower than Simulated • Factor of safety of 1.0 • Connecting to a stand of any type allows conduction and only increases F.S. • Sealing- Distributor provided CAD was not exact, o-rings under compressed (Lens Holder) • O-rings designed to 20 - 40% compression, difficult to assembly • Updated CAD provides up to 15% compression and used measured dimensions from Lens Holder
Objective Project Evaluation Successes Remaining Image display Frame grabber implementation Verification of transceiver signal integrity • Assembly fits together with no interference • Properly sinks heat • Imager works • Programmed FPGA • Transceiver works
Opportunities / Suggestions For Future Work • Finish CoaXPress protocol • Design frame grabber system • Upgrade FPGA to Cyclone V GX • Auto-focus capability using M3F Focus Module • CNC current release of CAD with tighter tolerance and modified O-ring grooves • Different housing designs (UAV application) • Incorporate video analytics • Include image processing filter on FPGA
Acknowledgments • D3 Engineering (sponsor) • Scott Reardon • Jason Enslin • Jim McGarvey • Alex Sojda • Ben McGee • David Collins • Lightforce Technology • Peter Hammond • Dr. Antonio Mondragon • Altera Corporation • Bill Jenkins • Bob Spurr • Arrow Electronics, Inc. • Gary Fredericks • RIT Machine Shop Personnel