Mission Assurance

Mission Assurance Nick Virmani National Research Laboratory Washington DC Swales Aerospace Beltsville MD

Safety & Mission Assurance General • The Trigger & Data Flow (T&DF) S&MA program will be conducted in accordance with LAT PAIP, LAT-MD-00039-1. • Quality is achieved through empowering employees, emphasizing teamwork, continuous improvement (relentless) and through sound scientific approaches to characterizing the flight hardware. • Lessons learned from other programs will be utilized. • The implementation relies on the controlled application of procedures, instructions and integrated product teams • Success of the program is dependent on: • Highly skilled design team, QA, EEE, Electronic packaging engineer with knowledge in a wide variety of areas. • Commands respect for technical knowledge/experience. • Be multifaceted (knows materials, metallurgy, manufacturing, mechanics, etc.) • Design T&DF specifications the first time. • Build test and validate hardware to specification the first time.

Safety & Mission Assurance Quality Assurance Control Flow Diagram Review Requirements Approve Drawings, MFG. & Test Procedures Review POs & Subcontract Evaluates and Surveys Vendors for Compliance Assign PAIP & EEE Parts Requirements Discuss Manufacturing, Producability, & Reliability Issues Perform Source Inspection at Vendor Attend Meetings and Provide Input Perform Continuous Risk Management Reviews Test Set up for Acceptance Test and Witness Test Approves WOAs, PRs, and PFRs Performs In-Process and Final Inspection Support Customer & Government Inspection if required Approve Final Acceptance Data Package

Safety & Mission Assurance • EEE Parts Program • EEE Part Program Control Plan LAT-MD-00099-02 implemented. • T&DF design engineers are using Quality Level 2 parts per GSFC-311-INST-001 which governs the selection, screening, and qualification processes. • Parts selection process will utilize the NASA Parts Selection List (NPSL), MIL-STD-975, GSFC PPL-21, and DESC QML P/N. • All EEE parts will be derated in accordance with PPL-21 and stress analysis will be performed to compare against the nominal stress derating criteria. • PCB will verify that all parts meet requirements of radiation, parts heritage, quality level, specifications, upscreens, DPA, other tests, and source inspections. • Component / Subsystem / System Engineers will generate parts list and submit to PCB for approval. Separate list for parts, materials and processes will be prepared. • At present, focusing on the long lead active non-QML parts, including ASIC, 3.3V DAC, 3.3V ADC, Qualification and Screening plan

Safety & Mission Assurance • Material, EEE Packaging and Processes Program • Implemented a materials and processes program as per LAT-SS-00107-1, LAT Mechanical Parts Plan. • Materials planned to be used will conform to 1.0% Total Mass Loss (TML) and 0.1% Vacuum Condensed Material (VCM) per NASA Specification. • Manufacturing, Assembly, and Quality Control of Electronic System will be in compliance to NASA-STD-8739.1, NASA-STD-8739.2, NASA-STD-8739.3, NASA-STD-8739.4, NASA-STD-8739.7 • PWBs will be manufactured and tested as per IPC-2221, IPC-6012 & IPC-6012, IPC-2223 Rigid and Flexible • PWB coupons will be evaluated prior to flight.

Safety & Mission Assurance EEE Parts, Materials, & Processes Overarching View * Manufacturing Failure Modes & Effects Analysis (FMEA) relies upon effective EEE, M&P Program. ** Areas successfully being addressed today.

QUALIFICATION AND VALIDATION OF PLASTIC ENCAPSULATED MICROCIRCUITS (PEMs) DAC, ADC and ASICs Review Performance History Part Selection QML-38535 Class N or equivalent with drawing details Review Suppliers’ Qualification and Reliability Data Review Reliability Monitoring Details Statistical Process Control (SPC) Procure Parts Visual Inspection Supplier Selection Scanning Acoustic Microscopy Destructive Physical Analysis (DPA) Review Data Pre-Conditioning (5 pieces max.) SMD to be machine soldered Pre-Conditioning Sequence Temp. Cycling 20 cycles Scanning Acoustic Microscopy Moisture Soak 85C / 85% RH Bake-out 16 hrs Reflow Phase 220C, 1 Pass Scanning Acoustic Microscopy Final Visual Examination

PLASTIC ENCAPSULATED MICROCIRCUITS (PEMs) SCREENING (100%) DAC, ADC, and ASICs Scanning Acoustic Microscopy Destructive Physical Analysis, Sample Temperature Cycling, (100%), 883, Method 1010, 10 Cycles Initial Electrical 883, Method 5005, Subgroup 2 Burn-In 72 / 160 hrs. max. Interim Electrical 883, Method 5005, Subgroup 1 Calculate Percentage Defects Allowable (PDA)  10% Final Electrical 883, Method 5005, Subgroups 2 - 7 Scanning Acoustic Microscopy External Visual

Safety & Mission Assurance ASIC Part Evaluation Vendor Selection Dominated by Analog Design ASIC Design Transfer of ASIC Design Files (GDS) to Vendor ASIC Fabrication (Wafers) Evaluate and Survey Packaging Part Supplier Characterize Packaged parts as per PEM flow Test vectors over specified Temp. and Voltage extremes Package PEM parts Electrical Characterization Performance Tests Specification and Data Verification DPA (Sample Only)

Safety & Mission Assurance ASIC Part Evaluation continued Qualify Flight Packaged Parts as per modified PEM test flow (samples only) Modify design if required and repeat previous steps Evaluation and Selection of a Screening Supplier Package Flight Parts as per SCD Failure may require failure analysis 100% Screen all parts, using test vectors. Perform functional test, etc Parts to the Controlled Storage

Safety & Mission Assurance Design Verification • Design verification facilitate effective communication of concepts. • Design validation and verification occurs very early. Detailed Verification & Validation Activities Peer Review by Team and Changes are Incorporated Conceptual Design Early Design Verification & Validation Detailed Design Created Reliability Verification (FMEA) Agreement on Design Suitability by Team Rapid Prototyping Model Built Rapid Prototyping Model Built Finalize Flight Design Flight Fabrication Initiated Revise Reliability Model (FMEA)

Safety & Mission Assurance Risk Management Process and Data Flow Identify Risks at Design Level Analyze: Classify risks Evaluate risks Analyze: Prioritize Risks Plan: Assign responsibility Approve Plans Prioritized list of risks Risk class, probability, impact, & timeframe Plan: Define mitigation approach. Determine mitigation plan Control risks Track risks Risk mitigation plans

Safety & Mission Assurance Safety & Mission Assurance Manufacturing Flow Diagram of PWB Assembly • PWB Preparation: • Clean • Ink Stamp • Bake SECURE STORE KIT Inspection Checkpoint Screen Solder Paste Inspection Checkpoint Parts SMT Placement I / R ReFlow Clean Inspection Checkpoint • Load Program • Load Pick/Place • Load Reflow Profile • Load Stencil • Second Level Assy. • Touch-up solder joints • Mechanical Installations • Staking/Bonding • Through-hole and Plastic Parts Preparation • Tin Components • Form & Cut Axial Leads Through-hole Component Placement & Hand Solder Clean & Inspection Checkpoint PEM Parts (ASIC, ADC, DAC) Placement & Hand Solder Clean Inspection Checkpoint Clean Inspection Checkpoint Controlled Storage Electrical Functional Test Inspection Checkpoint Clean Bake Conformal Coat Inspection Checkpoint Post Test Inspection Acceptance Test Electrical KEY Test Operation Production Operation Material Control Operation Inspection Operation

Safety & Mission Assurance • System Safety Program • The T&DF safety program will be in accordance with the LAT System Safety Program Plan, LAT-MD-00078-01. • Will support GSFC for assessment of orbital debris and acceptable level of risk. • Will perform hazard analysis and risk mitigation. • Will identify and control hazards to personnel, facilities, support equipment, and flight hardware during all stages.

Safety & Mission Assurance • Contamination Control • Contamination control program will be implemented as per LAT-MD-00228-D. • Fabrication and integration of the T&DF Subsystem components will occur in a minimum of class 100,000. • Will review all manufacturing and integration processes for contamination hazards. • Will take protective measures necessary to prevent contamination especially during I&T and environmental testing. • Surface cleanliness verification of fight hardware by optical witness samples, particle fallout plates, tape lifts, and/or NVR Rinses/Swabs

Safety & Mission Assurance • Integration Readiness Review Checklist • Verify that all Cert Logs, PRs, Material Review Board (MRB) reports, drawings, logbooks, etc. are completed & reviewed by QA. • Subsystem/component test plan completed • Review of special handling requirements • ESD, cleaning, pre-integration checkout, temperature, humidity, etc. • Walk-through of the integration flow • Functional test script completed • GSE in-place or available • Precursor activities identified & completed (thermal preps, other supporting systems, etc.) • Work Order Authorization form filled out and approved • Mechanical Integration Procedure ready • Contamination Control Plan for the item completed • Electrical Integration/safe-to-mate procedure ready • All supporting software (flight and test) complete and tested • Functional test procedures complete and tested

Safety & Mission Assurance • Reliability Analysis Flow Mitigate Risk, Change Design or Operations Concept Mission Requirements and Success Criteria Fault Tree Analysis (Top Down) Probabilistic Risk Assessment Change to Requirements Mission Design and Operations Concept FMEA (Bottom Up) Changes to Design or Operations Concept Design, Manufacture, and Test Reliability Block Diagram (Predictions) Problem Reporting (Risk Rated) T&DF Operations

Mission Assurance