ITRS Factory Integration Technology Working Group (FITWG) Industry Presentation

1. ITRS Factory IntegrationTechnology Working Group (FITWG)Industry Presentation 18 July 2001 Michio Honma, NEC Jeff Pettinato, Intel

2. Agenda • Scope and Factory Drivers • Difficult Challenges • Key Technology Requirements • Integrated Potential Solutions: • Process Control • Agile Manufacturing • Material Handling • Summary

3. Europe Klaus Eberhardt Richard Oechsner Claus Schneider Taiwan Hugo Chang JJ Hsu Japan Michio Honma Shoichi Kodama Toshi Uchino Hiromi Yajima US Court Skinner Jeff Pettinato Factory Integration GroupRegional Representatives

4. Factory Integration Contributing Members Many International members have contributed to FI

5. 2001 Factory Integration Scope IncludesWafer, Chip and Product Manufacturing The Factory Wafer Mfg. Chip Mfg. Product Mfg. Si Substrate Mfg. Distribution • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test • The Factory is driven by Cost and Productivity: • Reduce factory capital and operating costs per function • Enable efficient high-volume production with operational models for varying product mixes (high to low) and other business strategies • Increase factory and equipment reuse, reliability, and overall efficiency • Quickly enable process technology shrinks and wafer size changes

6. Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with post CMOS novel devices 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion 2001 Difficult Challenges >65nm through 2007 < 65nm after 2007

7. All factory areas must be integrated to solve these Difficult Challenges Factory Areas or Thrusts Includes Wafer, Chip, and Product Manufacturing Technology Requirements and Potential Solutions are expressed through these factory areas Factory Operations Facilities Material Handling Factory Information and Control Systems Production Equipment Examples: Building, cleanroom, utility systems, process fluid delivery Examples: AMHS Transport, storage, ID Systems, interface standards Example: Equipment unit, real-time process control, interface standards, Embedded Control Example: Manufacturing rules, production size, mix Example: MES, Computers, Networks, Process Control Rapid changes to business needs & demands; Increasing process & product complexity; Larger wafers and carriers, Increased reliance on factory information & control systems Complexity Management Increased customer expectation to meet on time delivery; Increased urgency for improved factory effectiveness, High factory yield at startup; Reduce wafer and product cost; Satisfy all local regulations Factory Optimization Difficult Challenges >65nm thu 2007 Extendibility, Flexibility, Scalability Reuse of building, production equipment, and factory information and control systems; Factory designs that support rapid process and technology changes/retrofits; Comprehend tighter ESH/Code requirements

8. Key Technology Requirements and Issues 1. Production equipment is not keeping up with Overall Equipment Efficiency (OEE) and Availability targets • Ex. 2001 OEE target of 83% vs. actual of 65% for bottleneck equipment 2. Process technology advances are occurring at ever faster rates; factories are expected to ramp and meet yield targets more quickly • New equipment for 157nm litho, High K gate stack, Low k dielectrics, SOI, copper will be implemented in factories over the next 2-5 years 3. A 45% reduction in manufacturing cycle times by 2007 is expected for high volume high mix factories 4. Direct transport systems capability must be ready for beta tests during 2002 and HVM implementation by 2004 5. Time required to a) build/ramp new factories, or b) convert/ramp existing factories to new technologies must improve 30% by 2007 6. 300mm software standards compliance is not meeting single wafer processing and intrabay AMHS needs

9. Integrated Solutions are Essential to Meet Needs Technology Requirements • New disruptive process technologies • 157nm litho • High K gate stack • Low k dielectrics • Copper processing + • Improved Productivity • Decreased Factory Cycle Time (QTAT) • Improved Equipment Efficiency • Reduction in non-product (I.e. test) wafer usage • More efficient direct labor • Faster factory conversion at technology nodes Integrated Solutions • Agile Manufacturing • - Equipment Engineering Systems - EES • - Single wafer control • - e-Diagnostics • Process Control • - Fault Detection Capabilities • - Feedback & Feed forward Process Control • - Machine to machine matching • Material Handling - Direct Transport AMHS • - AMHS for Send-Ahead wafers • - Integrated Sorters, Stockers, Metrology Integrated Factory Goal = Meet Factory Challenges and Technology Requirements

10. Step N UI Process Equipment Process Control Potential SolutionsType 1: Fault Detection and Classification • Inside the Tool • FDC Models defined / configured • FDC host signals configured • FDC actions may be configured • Outside of Tool • Host determines actions based on type of fault • Host issues control command Fast FDC Module GEM Interface Host System FDC Signal / Data External FDC Module FDC Control Potential Solutions Needs Include: • Real-time process sensors on process equipment • Reporting of real-time data to host system • Ability to stop processing at various intervals via host command • Factory Software systems capabilities to manage areas and groups of equipment • Software I/F Standards • Technology Requirement Drivers: • Overall Equipment Efficiency • Equipment Availability • Yield Particle Densities

11. UI UI Metrology Equipment Metrology Equipment Process Control Potential SolutionsType 2: Run to Run Control MES (Equipment Control) Run to Run Control S/W & Models Feed Forward and Feedback Control - Use preprocess or post metrology data to adjust processing for that lot Recipe Recommendations Factory Network EE Network Detailed wafer and chamber data required Recipe Adjustment Control GEM GEM EE EE EE GEM Step N Step N+1 Metrology data pipeline Step N-1 Parameterized recipes required UI Process Equipment • Technology Requirement Drivers: • Overall Equipment Efficiency • Optimize Process Performance (for example): • Litho Gate CD control (nm) • Litho Overlay Control (nm) • Diffusion Oxide thickness Potential Solutions Needs Include: • Reporting of metro data to host system • Ability to adjust key recipe parameters at various intervals via host command • Relationship between end process results and adjustable process parameters • Open software interfaces and standards

12. Process Control Potential SolutionsType 3: Integrated Metrology Factory Network EE Network GEM Metrology data and detailed wafer and chamber data Host System Recipe and Model Selection via remote interface EE Equip Controller EES Parameterized recipes required UI Integrated Metrology Module (not Bolt on) Integrated Process and Metro Equip. Potential Solutions Needs Include: • Hardware integration of process and metrology equipment • Software integration of metrology and process equipment • Single SECS/GEM interface for integrated metrology and process equipment • No increase in process equipment footprint • No degradation in equipment run rate or availability • Technology Requirement Drivers: • Factory Cycle Time per Mask Layer • Interbay AMHS throughput • Intrabay AMHS throughput

13. Agile Manufacturing Means… • Quick turn around [*faster cycle] time for production • Quick turn around time without productivity deterioration • No productivity reduction even if many lots production formed with few wafers • Quick capability to product, scale and technology change • Quick ramp-up of equipment installation and product • Assure high productivity even if low production volume to Satisfy these Requirements… • Cost • Equipment high OEE • Product yield high at ramp-up • Speed • Product: short ramp-up time • Equipment: short ramp-up time • Product Quick Turn Around Time (QTAT)

14. Key Potential Solutions • Full Automation • Equipment Engineering System • Fundamental technology • Single Wafer Control • Multiple lots/single wafer control in equipment module (group) • Process Control • Fault Detection and Classification • Run to Run • Integrated Metrology • Direct Transportation • Real Time Scheduling (RTS) • Supply Chain Management (SCM)

15. What will Equipment EngineeringSystems (EES) replace? New! Manufacturing Execution System Equipment Engineering System MES MCS MES FAX and telephone be replaced by Internet No more operator this side Suppliers e-Diag Capability Operators still watch the tool to confirm its health status and do miscellaneous things AMHS

16. Process or Metrology Equipment (side view) Control System AMHS Eqpt (side view) e-Manufacturing Hierarchy Company to Company (E-Commerce) Suppliers Company A Company B Factory to Factory (E-Factory) e-diagnostics capability firewall Factory A Factory B Within a Factory (E-Factory) Manufacturing Execution System - MES EES Equipment Engineering System Equipment/AMHS Ethernet Material Control System - MCS Station Controller

17. (EE) The e-Business structure for manufacturing

18. OHT Loop Process Tools Stocker Metro Tools Sorter OHT Loop Stockers Metro Metro Tools Stocker robot loads Sorters and Metro equipment Loadports Metro Process Tools Sorter Stocker robot interfaces directly with Sorters and Metro equip End View Carrier Level integrated Flow and Control Type 1: Sorter and Metrology with Stockers • When Solutions Are Needed: • Research Required by 2001 • Development Underway by 2002 • Qualification/Production by 2003 Potential Solutions Require: • Standardized Intrabay Operation • Integrated Software

19. Wafer Level Integrated Flow and ControlType 2: Connected EFEM Equipment Supplier A Equipment Supplier C Equipment Supplier B Wafer Staging Carrier Staging Potential Solutions Require: • I/F Standard (H/W, S/W) • Standardized EFEM • Software • Integrated • Wafer level APC • Standardized Intrabay Operation • When Solutions Are Needed: • Research Required by 2002 • Development Underway by 2004 • Qualification/Production by 2005 Conceptual Only

20. Wafer Level Integrated Flow and ControlType 3: Expanded EFEM Standard Tool Widths Potential Solutions Require: • System controller of Equipment Group • Wafer Dispatcher • Module structure of equipment • Standardized I/F • Standardized Width • Modular Process Steps • High Speed Wafer Transfer • Standardized Intrabay Operation • When Solutions Are Needed: • Research Required by 2003 • Development Underway by 2005 • Qualification/Production by 2006 Conceptual Only

21. Wafer Level Integrated Flow and ControlType 4: Continuous EFEM (Revolving Sushi Bar) Single Wafer Conceptual Only Wafer Transport Potential Solutions Require: • Ultra High Speed Wafer Transfer • Target M/C to M/C 7sec. • Wafer Level Dispatching Carrier Level Transport Single Chamber Process Tool Stocker Metrology Tool Multi-Wafer Carrier • When Solutions Are Needed: • Research Required by 2007 • Development Underway by 2010 • Qualification/Production by 2013 Target 450mm

22. The Next Generation Factory Concept User’s SCM - Supply Chain Management Planning System ….. ….. Direct Transport ….. ….. Mfg. System Agile -Mfg. EES Wafer Level Control ….. ….. E- Diagnostic Supporting System ….. Supplier’s SCM E-Mfg.

23. Summary 1. Advances in process technology are occurring at ever faster rates 2. Equipment suppliers must deliver stable equipment running new process technologies with very high Overall Equipment Efficiency (OEE) 3. Agile manufacturing systems are needed to quickly ramp new process technologies into high volume production and to achieve cycle time goals 4. Process control and machine to machine matching are needed to get high yields at startup and reduce cycle time 5. Open standards are a Key Part of Potential Solutions 6. We invite and encourage you to participate in FITWG activities to convert these plans to reality