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NA62 Gigatracker cooling requirements

NA62 Gigatracker cooling requirements. Gigatracker (GTK) modules will operate in vacuum and under high radiation Module has to be replaced on a regular basis C ooling system required to avoid performance loss

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NA62 Gigatracker cooling requirements

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  1. NA62 Gigatrackercoolingrequirements • Gigatracker (GTK) modules will operate in vacuum and under highradiation • Module hastobereplaced on a regularbasis • Cooling system required to avoid performance loss • The operation temperature for thefrontendelectronics will be 5°C orlower • Low material budgetforthecoolingsystem

  2. Gigatracker Module supportandalignementstructure Coolingplate Readoutchip (12.5 x 20 mm), heatproduction ca. 3.2W per chip (2 W/cm2) beam direction Sensor, siliconpixels (27 x 60 mm) 3D schematicdrawing of the GTK module

  3. Materials in thesensorarea The total material budget (material in the beam) allowedfor the GTK module is 0.5% X0(radiation length).

  4. Coolingsystemsunderinvestigation • carbonplate, conductivecooling • convectivecooling in a vessel • microchannels

  5. Ourproposal: Microchannelcooling • Goals ofdevelopment: • Integration ofmicrochannelsintofrontendelectronics • Cooling via an separate coolingplatewithmicrochannels • 150mm thickness • 300mm thickness • Benefits: • Uniform temperaturedistribution in theareatobecooled • Small DT betweencoolantandreadoutchip => reduced thermal stress • Single-phaseandtwo-phasecoolingpossible • Technology studiedat EPFL with strong supportofindustrialpartners • Mutual understandingtoshareknowledge (EPFL <> CERN) • Specifityofourapplication: • Verylow material budget • Low heatflux

  6. Tentative layoutofmicrochannelsfortheGigatracker • areatobecooled ~40 x 60mm • channellength ~40mm • channelcrosssection 50mm x 50mm • separationwalls 25mm thick • heatflux in thecoolingregion 2W/cm2 • Support and Connection ofservicesoutside the sensor area and on one side • Single-phasecooling • Open pointsforthe prototype: • U-shapedchannelsorsinglelinechannels (pressureloss <> massflowneeded) • Thermal connectionofthereadoutchiptothecoolingplate

  7. C6F14 cooling liquid ofchoice • radiationhard • thermallyandchemicallystable • nonflammable, nontoxic, nonconducting • knownandusedat CERN (CMS and Atlas Tracker) • used in liquid phase

  8. More peopleforthe GTK cooling Paolo Petagna, CERN PH-DT-PO, DT cooling Project Leader Alessandro Mapelli, EPFL Mircrosystems Laboratory, Microfabricationtechnologies Piet Wertelaers, CERN PH-DT-PO, Consultant for design andlayoutofcoolingcircuit JerômeDaguin, PH-DT, Experience in C6F14plantsat CERN

  9. Plans forthenextmonths August/September: • firstlayoutforthemicrochannels • productionof a prototype atthe EPFL clean room • preparation teststand (coolingunit, instrumention …) • design ofconnectingcomponent • developmentof a CFD-Model Oktober/November: • commissioning teststand • firsttestatroomtemperature • preparationoftestatcoldtemperature, cryostat • assembly prototype andmockupchips Thermal interfacetobedesignedaccordingtochip design andfabrication!!!

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