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NA62. RICH ELECTRONICS LOGISTIC. R. Ciaranfi. OUTLINE. RACK POSITION INTERCONNECTIONS SLOW CONTROL PMT SOCKET (HAMAMATSU STD) CABLE TO CABLE JUNCTION DUAL BOARD CONNECTION MECHANICAL TOLLERANCE DISCONTINUITY PLANNING. RACK MAP. We need another crate under vessel. TELL62 “HUB”.
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NA62 RICH ELECTRONICS LOGISTIC R. Ciaranfi
OUTLINE • RACK POSITION • INTERCONNECTIONS • SLOW CONTROL • PMT SOCKET (HAMAMATSU STD) • CABLE TO CABLE JUNCTION • DUAL BOARD CONNECTION • MECHANICAL TOLLERANCE • DISCONTINUITY • PLANNING
RACK MAP We need another crate under vessel
NEW RACK POSITION TELL62 CRATE A CONCRETE BLOCK SUPPORT
FRONT VIEW OPT. VERTICAL WIRE SUPPORT 512 CH FEDAQ 512 CH FEDAQ PMT PMT 512CH FEDAQ 512CH FEDAQ 1024CH HV FILT 1024CH HV FILT CONCRETE/OTHER RACK SUPPORT CONCRETE/OTHER RACK SUPPORT 5X TELL62
JURA AND SALEVE RACK JURA 2 M COAX CABLE HALOGEN FREE?? 512 CH FEDAQ Diam 695 mm 512 CH FEDAQ 2 X 3M HV WIRE HV FILTER R=2150 mm 1024 CH TOTAL (PER SIDE) Max distance 1.4M
INTERCONNECTIONS TOP VIEW VESSEL ETHERNET 512 CH HV PS SLOW CONTROL (CANBUS/OTHER) ETHERNET REAR S. SHV CABLE 32 X 32 VHDC SIGNAL CABLE REAR S. 1024 HV FILTER ONLY BIN TELL62 4X MULT. CABLE 1024 CH HV FILTER 1024 CH HV FILTER /FANOUT 2X 512 CH FEDAQ 2X 512 CH FEDAQ PMTs PMTs 2 X 512 CH FEDAQ BIN+ POWER 1024 SIGNAL+ HV CABLE OTHER DETECTOR
SLOW CONTROL I2C/SPI BUS DAC/ADC DEVICE ON BOARD On every board there is a CAN/OTHER node that Control I2C/SPI serial DAC/ADC and manage board and channel addressing DAISY CHAINED WITH OTHER BOARDS CH1 8 CH I2C 10b DAC/ADC CAN BUS/ or other serial bus NODE uCONTROLLER VTH CH4 HYS STR WE HAVE’NT EXPERTISE IN DESIGN CANBUS OR OTHER HIGH LEVEL DATABASE/PROTOCOL READ CAPABILITY ADDED WE CAN ADAPT OUR HARDWARE TO A SUGGESTED COMM. LAYER ALREADY USED IN CERN/NA62 HW DEV. BOARD
PMT SOCKET WE HAVE 600 PMT SOCKET WITH 45 CM CABLE LENGTH FRONT END ELECTRONICS COULD BE LOCATED UP TO 1.5 M APART FROM PMT FLANGE NEED TO EXTEND OLD PMT RG174 SOCKET WITH NEW CABLE LENGTH
PMT SIGNALSHAPE 1.2ns RISE 0.7ns FALL Vampl 0.521 Tw(fwhm) 1.3ns
TEST SIGNAL 0.477ns RISE 0.484ns FALL Vampl 0.521 Tw(fwhm) 0.805ns HP8131A PULSE GENERATOR -0.5 V PULSE AMPLITUDE 1ns PULSE WIDTH WP=WITH PATCH NP= NOPATCH 1K2= CURRENT PULSE
PARAM. EXTRAPOLATION CONSIDER A 3mm DISCONTINUITY IN WHICH THERE IS NO INSULATION (Er=1 INSTEAD OF 2.4 OF PEE) WE OBTAIN A z=77 OHM AND A DELAY OF 10ps
3mm TEST 2M CABLE 6mm RG174
MECH. STRESS WE APPLY A PULL LOAD OF 50N AND WAIT FOR 10 MIN, AFTER THAT WE TEST ELECTRICAL CONTINUITY AND SIGNAL SHAPE AND NO DIFFERENCES WHERE FOUND
VME like CONNECTOR 340 mm MAX. 220 mm MIN. 120 mm DC/DC CONVERTER 3.3 TO 2.5V 8CH NINO CHIP J1 VME CONNECTOR 8CH NINO CHIP 32 LEMO COAX SIGNAL FROM PMT 360 mm 32 CH VHDCI CONNECTOR TO TELL62 32 CHANNEL FRONT-END AREA G 8CH NINO CHIP 4CH MULTIPLICITY TO TELL62 I2C 8CH NINO CHIP CAN BUS CONNECTORS CAN CUSTOMIZABLE FRONT END (“FE”)AREA “DAQ” AREA
VME like CONNECTOR MAX. 220 mm MIN. 120 mm WE CAN DISCARD CONNECTORS SOLUTION LOOSING FLEXIBILITY DC/DC CONVERTER 3.3 TO 2.5V 8CH NINO CHIP J1 VME CONNECTOR 3 BOARD TO BOARD CONNECTORS ARE LIKE VME BACKPLANE J1 J2 J3 8CH NINO CHIP 32 CH VHDCI CONNECTOR TO TELL62 32 CHANNEL FRONT-END AREA G IN RICH 400 TEST BEAM PRE_NINO AND NINO BOARD WHERE CONNECTED WITH 2 VME CONNECTORS. NO TOLLERANCE PROBLEM WAS FOUND 8CH NINO CHIP 4CH MULTIPLICITY TO TELL62 THERE ARE OTHER INDUSTRY SOLUTION FOR HIGH DENSITY CONTROLLED IMPEDANCE BOARD TO BOARD CONNECTION I2C 8CH NINO CHIP CAN BUS CONNECTORS CAN CUSTOMIZABLE FRONT END (“FE”)AREA “DAQ” AREA
DISCONTINUITY VME like CONNECTOR IS NOT 50 OHM DIFF. IMPEDANCE BUT: EUROCARD TYPE C CONNECTOR MALE-FEMALE MODEL FOR EACH DIFF PAIRS THERE ARE ROW A-B-C IN PARALLEL SO 1/[1/Z1+1/Z2+1/Z3] = 25 ohm DIFFERENTIAL Z= 2x 25 = 50
FUTURE WORK FEDAQ BOARD • FINALIZE SLOW CONTROL ARCH. (1.5 MONTH) • DESIGN PCB (3 MONTHS) • BUILD PROTOTYPE (2 MONTHS) • TEST PROTOTYPE (1 MONTH) • PMT SOCKET • ORDER • ASSEMBLY AND TEST (2-3 MONTHS)