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Module and stave interconnect

Rev. sept. 29/08. Module and stave interconnect. Outer Stave layout. Module on back. …. End of stave card serves 8 modules (half a stave) along Z Stave has 32 modules total, 16 on each face. 8 modules connected to 1 stave card via stave cable.

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Module and stave interconnect

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  1. Rev. sept. 29/08 Module and stave interconnect

  2. Outer Stave layout Module on back … End of stave card serves 8 modules (half a stave) along Z Stave has 32 modules total, 16 on each face. 8 modules connected to 1 stave card via stave cable. Cable is pre-assembled on stave (4 cables per stave). Modules are loaded on top of cable and connected down to it with a connector similar to present PP0 connector, but smaller.

  3. 4-chip outer stave module Flex hybrid on top of sensor Flex down to chip w-bonds Active area Pixel orientation 15.0 Flex pigtail (connector plugs into page)‏ 10.0

  4. Loaded module side view Hirose DF30 series 0.4mm contact pitch stiffener flex 1.0 mm connector sensor chips glue Compressed scale 20 position connector would be used. Replace 10.22 dimension by 6.52

  5. DC-DC Stave cable layout Layer 2: Power and return (25um aluminum)‏ Layer 1: Signals (1/4 oz copper)‏ ground ref. HV-3-4 HV-7-8 Multi-drops HV-5-6 HV-1-2 NTC HV-ret Out-2 Out-1 ... 12mm 1.5mm X8 -LV x8 +LV x8 (trace width varies such that each module sees the same cable resistance)‏

  6. Stave section (not to scale)‏ Flex hybrid sensor chips glue cover layer aluminum inter-layer copper Polyimide substrate glue facing foam Center line

  7. Power parameters Stave cable aluminum thickness (um)‏ 25 stave cable metal width (cm) 3.8 Single module 1.5V chip combined current (A)‏ 2.0 1.0 Single module stave cable current with DC-DC (A)‏ Aluminum layer resistance per square (ohm)‏ 0.0016 Number of squares 1-way (same for all modules)‏ 220 Stave cable round-trip voltage drop before DCDC convert. (V)‏ 0.34 Cable power dissipation (average per module in W)‏ 0.34 90% efficient DCDC module power excluding sensor bias (W)‏ 3.3 These are nominal values without contingency

  8. Inner layer modules • For small radius the staves must be narrow • => single-chip-wide modules. • Probably want single sided staves also. • If sensors are 3D they can naturally have active edges • Once active edge sensors are used, single-chip modules are very attractive • No active fraction advantage for bigger modules • High data rates also prefer single chip modules • One serial output per chip • (may still not be enough for BL)‏

  9. Single chip module features • Simplified assembly process • no single chip probing needed before flip-chip • No flex hybrid • Test individual modules with a probe card • Load “bare modules” directly on stave cable • Inherently high yield • SC stave module concept from US Upgrade meeting, Dallas 2004: robotically placed, fully tested 1-chip modules. Wire bond to stave after placement. End of stave card

  10. But… • Stave cable is more challenging. • Not as much room as on outer staves • 4 times as many data output lines needed (at least)‏ • Inner stave cable concept (presented in BL replacement meeting sept. 2007) Flap folds over after module is glued Cable stack Pre-laminated on bare stave End of stave card could be built-in Cable stack with 24 flaps before lamination (half stave).

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