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Briefing: Independent NASA Test of RTSX-SU FPGAs Wire Bonding Experiment. Test Objective: Verify the reliability of gold ball bonding to aluminum pad in RT54SX-S and RT54SX-SU FPGAs. Devices will baked at 150 ºC and will be sampled at 500, 750, 1,000, and 1,500 hours. Rich Katz, Grunt Engineer
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Briefing: Independent NASA Test of RTSX-SU FPGAsWire Bonding Experiment Test Objective: Verify the reliability of gold ball bonding to aluminum pad in RT54SX-S and RT54SX-SU FPGAs. Devices will baked at 150 ºC and will be sampled at 500, 750, 1,000, and 1,500 hours. Rich Katz, Grunt Engineer NASA Office of Logic Design
Variables • Die • MEC: RT54SX32S and RT54SX72S • UMC: RTSX32SU and RTSX72SU • Multiple Lots • Packages • CQ208 • CQ256 • Multiple Date Codes • Acceleration Time • 500, 750, 1,000, and 1,500 hours • Grade B vs. Grade E Note: Time at temperature for each device must be researched and added to these charts.