1 / 11

Rich Katz, Grunt Engineer NASA Office of Logic Design

Eclipse FPGA DPA’s. Rich Katz, Grunt Engineer NASA Office of Logic Design. Purpose. First early DPA look at Eclipse FPGAs This presentation will present highlights from the DPA reports. More info and full report posted at:

shona
Download Presentation

Rich Katz, Grunt Engineer NASA Office of Logic Design

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Eclipse FPGA DPA’s Rich Katz, Grunt Engineer NASA Office of Logic Design

  2. Purpose • First early DPA look at Eclipse FPGAs • This presentation will present highlights from the DPA reports. • More info and full report posted at: • http://klabs.org/richcontent/fpga_content/pages/notes/fpga_reliability.htm • http://klabs.org/richcontent/Reliability/aeroflex/dpa/eclipse_dpa_may_2006.pdf

  3. Summary Summary:  Two Eclipse FPGAs were sent to Hi-Rel Laboratories for a destructive physical analysis (DPA). The testing was performed in accordance with MIL-STD-1580B REQ. 16.1, MIL-STD-883 Method 5009, and applicable military standards. LOT SUMMARY/CONCLUSION This lot meets the specific DPA Requirements

  4. Eclipse in Package

  5. Eclipse Die and Bonds

  6. Eclipse Die

  7. Analyses Performed • External Visual Inspection • Radiographic Examination • Particle Impact Noise Detection (PIND) • Hermeticity Testing • Residual Gas Analysis (RGA) • Internal Visual Inspection of the Delidded Devices • Bond Pull Testing • Die Shear Testing

  8. Analyses Not Performed Scanning Electron Microscopy (SEM) Inspection of the metallization was not performed in accordance with MIL-STD-883F, Method 2018, paragraph 1. The metallization was of CMP planar oxide construction.

  9. Some Sample Data

  10. Residual Gas Analysis

  11. Sample Bond Pull Test Readings

More Related