THEMIS Mission Assurance Critical Design Review Ron Jackson University of California - Berkeley

1. THEMIS Mission Assurance Critical Design Review Ron Jackson University of California - Berkeley June 14-18, 2004

2. THEMIS Mission Assurance Team • Ron Jackson Mission Assurance Manager • Jorg Fisher Quality Assurance Engineer • Chris Scholz Quality Control Engineer • Tom Clemons Quality Control Technician

3. Quality Assurance Flowdown Instrument Mission Assurance Requirements Document (MAR) was released on June 25, 2002. UCB responded with a Performance Assurance Implementation Plan (PAIP): • UCB-PAIP – released – Pending approval by GSFC • Swales PAIP – released – Approved by UCB • FGM/TUB PAIP – released – Approved by UCB • SCM/CETP PAIP – released – Approved by UCB • All other vendors - Purchase order Flowdown

4. Responsibilities of Quality Assurance1.) Review and report on: • Evaluate/Audit contractors facilities for the ability to consistently produce quality flight hardware daily • Equipment calibration, temperature and humidity monitors • Clean room controls • Compliance to ESD requirements • Workmanship procedures/processes • Material handling and shelf life material storage • Data packages and logbooks • Nonconformance reporting / Problem reports • Assembly instruction / BOM • Personnel training and certification to NASA standards • Part/Materials Alert Status

5. Responsibilities of Quality Assurance 2.) Support integration and test activities: • Verify test set ups at board/instrument and spacecraft levels • Monitor thermal testing at Box/instrument and spacecraft levels • Witness vibration testing at instrument and spacecraft levels • Verify magnetics testing at instrument levels • All European suppliers – UCB shall review Acceptance Package Data / Travelers and inspect component/Box upon delivery to U.S.

6. Responsibilities of Quality Assurance 3.) Provide electrical and mechanical inspections but not limited to: • Incoming materials • Solder workmanship, through hole and SMT methods (verify coupon acceptance) • Conformal coating and staking applications • Witness board or Box closure • Wire harness build, continuity test, Hi-pot testing and routing • Configuration verification, as designed vs. as built

7. Contamination Control • UCB Contamination Control • Class 100k clean room • Air particle count will be monitored • All flight hardware will be placed in clean bags

8. Software Assurance • IV &V (IDPU & BAU) • To review software code • Develop metrics (Software risk assessment) • All software problems will be tracked on problem reports • All software changes will be under configuration review • Probe Bus • Under UCB configuration management review • Software problems reports provided to UCB

9. Responsibilities of Quality Assurance 4.) Communications: • Provide both written and verbal reports to THEMIS project management – monthly • Participate in program telecons - as required • Problem/failure reporting may be informal up to the time of integration with flight hardware

10. THEMIS Parts Requirements • 311- INST-001, Level 3 • Parts in compliance with 311-INST-001, Level 3 requirements and Standard Parts. • Use PPL 21 preferred parts, design permitting. • PIND, per Mil-STD-750 and Mil-STD-883, required for cavity devices. • Impose on manufacture, if possible. • When needed, have DESC approved test facility perform testing. • CSI and/or DPA for complex or known problem devices.

11. THEMIS Parts Requirements (continued) • Non-standard EEE parts will require at a minimum: PEM • DPA, Preconditioning, HAST, CSAM • Radiation Testing • Total Ionizing Dose Requirement 66 Krads (si) • Review existing test data from GSFC, JPL & Manufacturer • Review NASA “where used” historical data • Parts o.k. to use if data and/or orbit requirements equals or exceeds THEMIS • When needed, will perform Cobalt 60 TID testing • Single Event Effects: use existing data or historical use similarity • Whenever possible, designers will use latchup immune devices • Latchup requirements 37mev • Exceptions are handled on case by case basis with THEMIS Project Office

12. THEMIS EEE Parts List • UCB QA will maintain EEE Parts Identification List (PIL) • PIL will contain • Manufacturer’s generic part number • Military part number or SCD number • Manufacturer(s) • Where used (unique assembly) / Quantity used • Quantity ordered • Lot/Date Code • Radiation status (TID / SEL) • Project Approval Status • Alert status • Comments

13. THEMIS EEE Parts List (continued) • Parts will be procured to an approved Parts List • Schedule permitting, Berkeley will do common buy. • Procurement of devices will be based upon design Engineers Confidence-of-use factor of 70%. • Unique, high dollar items will be at 90% - 100% Confidence Level • Minimum Attrition / Spares factor of 20% - 30% will be applied to flight procurement quantities. Standard devices will have higher spares’ factor. • Schedule and Cost permitting, Engineering test units will use flight qualified part. Especially where minimum buy quantities are imposed. • ETU and Flight units • Procurements will run concurrently • Flowdown PAIP requirements on subcontractors.

14. THEMIS EEE Parts List (continued)Parts Control Board (PCB) • PCB members: THEMIS QA, Parts Engineer (GSFC), design Engineer and THEMIS – Berkeley Project Manger, or representative. • PCB shall review EEE part for: • Testing, Screening and Qualification requirements • Alerts • Review non-standard parts requirements • PCB will disposition EEE parts failures and nonconformance issues. • UCB QA will coordinate PCB parts issues with GSFC Flight Assurance Manager, or his representative.

15. GIDEP Alert Review • Microcircuits • 41 ea. Checked ok • 1 ea. Checked bad • Semiconductor Devices • 49 ea. Checked ok • 1 ea. Checked bad • Resistors/Capacitors • 31 ea. Checked ok • Connectors • 6 ea. Checked ok • Wire/Harness • 4 ea. Checked ok • Misc. Materials • 0 ea. Checked • Mechanical Parts • 0 ea. Checked

16. EEE parts Alerts Actel – FPGA In-rush current problem JANTXV1N5711-1 ESD /Lead handling problem Parts Issues Parts at up- screening CA3080A @ GSFC OP462HRU @ GSFC LTC1604 @ GSFC 2N6519 @ GSFC PT100 @ GSFC AD5544 @ WYLE

17. THEMIS Parts Lists Status

18. THEMIS Materials Lists Status